Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs
Luminescence Industry and Technology Frontier|更新时间:2024-07-25
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Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs
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“最新研究揭示了高功率密度LED器件在光电性能上的突破,为半导体照明技术发展提供了新视角。”
Chinese Journal of LuminescenceVol. 45, Issue 7, Pages: 1196-1210(2024)
作者机构:
闽南师范大学 物理与信息工程学院, 福建 漳州 363000
作者简介:
基金信息:
Key Technologies Innovation and Industrialization Projects in Fujian Province(2023QX007);Industry-University-Research Cooperation Project of Fujian Science and Technology Department(2023H6018)
HUANG Linfeng,XIONG Chuanbing,TANG Yingwen,et al.Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs[J].Chinese Journal of Luminescence,2024,45(07):1196-1210.
HUANG Linfeng,XIONG Chuanbing,TANG Yingwen,et al.Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs[J].Chinese Journal of Luminescence,2024,45(07):1196-1210. DOI: 10.37188/CJL.20240090.
Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs增强出版