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The Influence of copper substrate area, solder and copper foil thickness on the maximum output light intensity and voltage of high power density LEDs
更新时间:2024-05-09
    • The Influence of copper substrate area, solder and copper foil thickness on the maximum output light intensity and voltage of high power density LEDs

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    • 在半导体照明技术领域,研究者们通过实验验证了铜基板面积、焊锡厚度和导电铜箔厚度对高功率LED器件极限光电性能的影响,为提升高功率LED器件性能提供了有效解决方案。
    • Chinese Journal of Luminescence   Pages: 1-15(2024)
    • DOI:10.37188/CJL.20240090    

      CLC: TN304
    • Published Online:09 May 2024

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  • HUANG Lin-feng,XIONG Chuan-bing,TANG Ying-wen,et al.The Influence of copper substrate area, solder and copper foil thickness on the maximum output light intensity and voltage of high power density LEDs[J].Chinese Journal of Luminescence, DOI:10.37188/CJL.20240090

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