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Laser Welding and Packaging Technology of Three-dimensional Direct Plated Copper Ceramic Substrate
Luminescence Industry and Technology Frontier | 更新时间：2024-04-08
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    • Laser Welding and Packaging Technology of Three-dimensional Direct Plated Copper Ceramic Substrate

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    • Chinese Journal of Luminescence   Vol. 45, Issue 3, Pages: 506-515(2024)

    • DOI：10.37188/CJL.20230318    

      CLC： TN248.4;TQ174.1

    • Published：05 March 2024，

      Received：13 December 2023，

      Revised：01 January 2024，

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  • LUO Lin,DING Yongjie,SU Pengfei,et al.Laser Welding and Packaging Technology of Three-dimensional Direct Plated Copper Ceramic Substrate[J].Chinese Journal of Luminescence,2024,45(03):506-515. DOI： 10.37188/CJL.20230318.

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Related Institution

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