Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

WANG Zhe; WANG Yong-tong; LIU Jia-xin; MOU Yun; PENG Yang; CHEN Ming-xiang

doi:10.37188/CJL.20220084

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Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

Luminescence Industry and Technology Frontier | 更新时间：2026-09-12

- Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging
  增强出版
- Chinese Journal of Luminescence Vol. 43, Issue 7, Pages: 1139-1146(2022)
- 作者机构：
  
  1.华中科技大学机械科学与工程学院，湖北武汉　430074
  2.华中科技大学航空航天学院，湖北武汉　430074
- 作者简介：
- 基金信息：
  
  Key Research and Development Project of Hubei Province(2021BAA213;2020BAB068;2021BAA071)
- DOI：10.37188/CJL.20220084
  CLC： TN312.8
- Received：11 March 2022，
  
  Revised：2022-03-31，
  
  Published：05 July 2022
- 稿件说明：
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王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-1146.

WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-1146.
王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-1146. DOI： 10.37188/CJL.20220084.

WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-1146. DOI： 10.37188/CJL.20220084.

摘要

普通印刷电路板（PCB）材料热导率低，散热性能不佳，难以用于封装大功率器件。本文提出并制备了一种直接电镀铜陶瓷基板（DPC）的PCB基板（以下简称“内嵌基板”），利用陶瓷材料高热导率强化基板局部散热，并将其应用于大功率LED封装。使用胶粘剂将DPC基板固定在开窗的PCB基板中，电互连后得到内嵌基板。相较于普通PCB基板，相同电流下内嵌基板表面温度低，温升趋势放缓，当电流从200 mA增加到400 mA时，内嵌基板温升比普通PCB基板低约42.1 ℃。当电流为350 mA时，内嵌基板封装的LED样品热阻和结温变化分别为15.55 K/W和9.36 ℃，其光功率随电流增加而增大，并始终高于同电流下普通PCB基板封装LED；在400 mA时，两者光功率相差约16.7%。实验表明，内嵌基板是一种高性能、低成本的封装基板，可有效提高大功率LED散热性能，满足功率器件封装应用需求。

Abstract

The low thermal conductivity of ordinary printed circuit board（PCB） material leads to poor heat dissipation performance， which makes it difficult to package high-power devices. In this work， a PCB substrate embedded with direct plated copper ceramic substrate（DPC）（hereinafter referred to as “embedded substrate”） is developed， which can enhance the local heat dissipation of PCB owing to the high thermal conductivity of ceramic materials， so it can be used for high-power LED packaging. Firstly， the DPC is fixed into the windowed PCB with adhesive， and the embedded substrate is obtained after electrical interconnection. Compared with ordinary PCB substrate， the surface temperature of embedded substrate is lower and the temperature rise trend is slow at the same current. When the current increases from 200 mA to 400 mA， the temperature rise of LED packaged with embedded substrate is about 42.1 ℃ lower than that of ordinary PCB substrate. At 350 mA， the thermal resistance and junction temperature of LED sample packaged with embedded substrate are 15.55 K/W and 9.36 ℃ respectively， and its optical power increases with the increase of current， which is always higher than that of LED packaged with ordinary PCB substrate under the same current. At 400 mA， the difference in optical power between them is about 16.7%. The experiments show that the embedded substrate is a high-performance and low-cost packaging substrate， which can effectively improve the heat dissipation performance of high-power LED and meet the packaging application requirements of power devices.

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