热电制冷LED自然对流散热的设计与优化

张建新; 韩变华; 杨庆新; 薛亮; 马楷; 李海林

doi:10.3788/fgxb20183904.0523

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热电制冷LED自然对流散热的设计与优化

器件制备及器件物理 | 更新时间：2020-08-12

- 热电制冷LED自然对流散热的设计与优化
- Thermal Design and Optimization of LED Integrated with Thermoelectric Cooler in Natural Convection
- 发光学报 2018年39卷第4期页码：523-533
- 作者机构：
  
  1. 天津工业大学天津市电工电能新技术重点实验室, 天津 300387
  2. 天津工业大学天津市光电检测技术与系统重点实验室, 天津 300387
  3. 天津工业大学中空纤维膜材料与膜过程省部共建国家重点实验室, 天津 300387
- 作者简介：
- 基金信息：
  
  国家自然科学基金（51577132，61605145）();天津市自然科学基金（15JCQNJC41800）();天津市教委科研计划项目（自然科学）（2017ZD06）
- DOI：10.3788/fgxb20183904.0523
  中图分类号： TN312.8;TN305.94
- 纸质出版日期：2018-4-5，
  
  网络出版日期：2017-11-3，
  
  收稿日期：2017-8-12，
  
  修回日期：2017-10-5，
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张建新, 韩变华, 杨庆新等. 热电制冷LED自然对流散热的设计与优化[J]. 发光学报, 2018,39(4): 523-533

ZHANG Jian-xin, HAN Bian-hua, YANG Qing-xin etc. Thermal Design and Optimization of LED Integrated with Thermoelectric Cooler in Natural Convection[J]. Chinese Journal of Luminescence, 2018,39(4): 523-533
张建新, 韩变华, 杨庆新等. 热电制冷LED自然对流散热的设计与优化[J]. 发光学报, 2018,39(4): 523-533 DOI： 10.3788/fgxb20183904.0523.

ZHANG Jian-xin, HAN Bian-hua, YANG Qing-xin etc. Thermal Design and Optimization of LED Integrated with Thermoelectric Cooler in Natural Convection[J]. Chinese Journal of Luminescence, 2018,39(4): 523-533 DOI： 10.3788/fgxb20183904.0523.

摘要

为提升高热流密度下LED灯具的自然对流散热性能，以一款基于热电制冷（TEC）的单颗LED小型灯具模组为研究对象，在采用实验测量和回归拟合准确获得TEC性能参数的基础上，建立了有无TEC参与散热的等效热路模型，并选择合理的数学公式对其进行性能描述，进而遵循本文设计的计算流程快速得到各种散热性能数据。LED模组的散热分析表明：在恒定的LED热功率下，施加最佳的TEC电流可获得最高的散热性能；LED热功率越低，安装TEC的散热性能越比常规方法优异。经遗传算法优化前后的性能对比分析表明：优化后结构中TEC的合理工作区明显增大，能满足LED更高功率的散热需求；当LED为0.493 W时，优化后结构的最佳结温仅为15.66℃，远低于30℃的环境温度。基于TEC实验数据建立的等效热路模型，能为装配TEC的LED模组提供快速完整的散热设计分析与结构优化的合理方案。

Abstract

In order to improve the thermal performance of LED lamp with high heat flux in natural convection

a thermoelectric cooler (TEC) was presented to meet the cooling requirement of a compact lamp with single high-power LED. The performance parameters of TEC were determined accurately by regression analysis for TEC experimental data at different work status. The equivalent thermal circuits of the compact LED modules with TEC and without TEC were established based on electrical-thermal analogy. Some mathematic models of equivalent thermal circuits were developed to quickly predict the accurate thermal performance of LED modules following the specified calculation procedure in this paper. The thermal performance analysis results show that the best cooling performance can be obtained at the optimum input TEC current for a specific LED power dissipation. The thermal performance of LED modules with TEC can be superior to that of modules without TEC and be better at low LED power dissipations than at high ones. Two-objective optimization was carried out using three design variables of fin to minimize the junction temperature and fin mass simultaneously. For the un-optimized and optimized modules

the comparison results of thermal performance demonstrate that the effective operating range of TEC in optimized module performs broader than that in un-optimized module. The LED power dissipation of optimized module can reach a higher performance than that of un-optimized one. At the LED power dissipation of 0.493 W

the minimum junction temperature is 15.66℃ and much lower than the ambient temperature of 30℃. For the LED modules with TEC

the equivalent thermal circuit models presented based on TEC experimental data can contribute to the thermal design

performance analysis and structural optimization.

关键词

LED散热热电制冷自然对流等效热路法优化

Keywords

LED coolingthermoelectric coolernatural convectionthermal circuit methodoptimization

references

NARENDRAN N, GU Y, FREYSSINIER J P, et al.. Solid-state lighting:failure analysis of white LEDs[J]. J. Cryst. Growth, 2004, 268(3-4):449-456.

陈华, 周兴林, 汤文, 等. 大功率远程荧光粉型白光LED散热封装设计[J]. 发光学报, 2017, 38(1):97-102. CHEN H, ZHOU X L, TANG W, et al.. Thermal design of high power remote phosphor white LED package[J]. Chin. J. Lumin., 2017, 38(1):97-102. (in Chinese)

SUN B, FAN X, YE H, et al.. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation[J]. Reliab. Eng. Syst. Saf., 2017, 163:14-21.

JEON D, BYON C. Thermal performance of plate fin heat sinks with dual-height fins subject to natural convection[J]. Int. J. Heat Mass Transf., 2017, 113:1086-1092.

SKMEN K F. YVRVKLV E, YAMANKARADENIZ N. Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications[J]. Appl. Therm. Eng., 2016, 94:534-542.

SUFIAN S F, FAIRUZ Z M, ZUBAIR M, et al.. Thermal analysis of dual piezoelectric fans for cooling multi-LED packages[J]. Microelectron. Reliab., 2014, 54(8):1534-1543.

DENG Y G, LIU J. A liquid metal cooling system for the thermal management of high power LEDs[J]. Int. Commun. Heat Mass Transf., 2010, 37(7):788-791.

王志斌, 张健, 刘丽君, 等. 大功率LED螺旋扁管水冷散热技术研究[J]. 光子学报, 2013, 42(11):1350-1354. WANG Z B, ZHANG J, LIU L J, et al.. Study of water cooling technology on high power LED with the twisted tube[J]. Acta Photon. Sinica, 2013, 42(11):1350-1354. (in Chinese)

LUO X B, CHEN W, SUN R X, et al.. Experimental and numerical investigation of a microjet based cooling system for high power LEDs[J]. Heat Transfer Eng., 2008, 29(9):774-781.

CHANG Y W, CHANG C C, KE M T, et al.. Thermoelectric air-cooling module for electronic devices[J]. Appl. Therm. Eng., 2009, 29(13):2731-2737.

HU H M, GE T S, DAI Y J, et al.. Experimental study on water-cooled thermoelectric cooler for CPU under severe environment[J]. Int. J. Refrig., 2016, 62:30-38.

CHUN K L, DAI M J, YU C K, et al.. High efficiency silicon-based high power LED package integrated with micro-thermoelectric device[C]. International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, Taipei, China, 2007:29-33.

LI J H, MA B K, WANG R S, et al.. Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs[J]. Microelectron. Reliab., 2011, 51(12):2210-2215.

WANG J, ZHAO X J, CAI Y X, et al.. Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package[J]. Energy Convers. Manag., 2015, 101:532-540.

WANG N, WANG C H, LEI J X, et al. Numerical study on thermal management of LED packaging by using thermoelectric cooling[C]. International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP, Beijing, 2009:433-437.

CHEN M, SNYDER G J. Analytical and numerical parameter extraction for compact modeling of thermoelectric coolers[J]. Int. J. Heat Mass Transf., 2013, 60(1):689-699.

GAO X, CHEN M, SNYDER G J, et al.. Thermal management optimization of a thermoelectric integrated methanol evaporator using a compact CFD modeling approach[J]. J. Electron. Mater., 2013, 42(7):2035-2042.

SHYU J C, HSU K W, YANG K S, et al.. Thermal characterization of shrouded plate fin array on an LED backlight panel[J]. Appl. Therm. Eng., 2011, 31(14-15):2909-2915.

张建新, 牛萍娟, 李红月, 等. 基于等效热路法的LED阵列散热性能研究[J]. 发光学报, 2013, 34(4):516-522. ZHANG J X, NIU P J, LI H Y, et al.. Study on the heat dissipation performance of LED array using thermal circuit method[J]. Chin. J. Lumin., 2013, 34(4):516-522. (in Chinese)

ABDELMLEK K B, ARAOUD Z, CHARRADA K, et al.. Optimization of the thermal distribution of multi-chip LED package[J]. Appl. Therm. Eng., 2017, 126:653-660.

张建新, 武志刚, 李松宇, 等. LED散热模块总热阻测量实验系统开发[J]. 实验技术与管理, 2013, 30(12):77-81. ZHANG J X, WU Z G, LI S Y, et al.. Development of experimental system for measuring total thermal resistance of LED module[J]. Experiment. Technol. Manag., 2013, 30(12):77-81. (in Chinese)

LEUNG C W, PROBERT S D. Heat exchanger performance:effect of orientation[J]. Appl. Energy, 1989, 33(4):235-252.

DIALAMEH L, YAGHOUBI M, ABOUALI O. Natural convection from an array of horizontal rectangular thick fins with short length[J]. Appl. Therm. Eng., 2008, 28(17-18):2371-2379.

WONG S C, HUANG G J. Parametric study on the dynamic behavior of natural convection from horizontal rectangular fin arrays[J]. Int. J. Heat Mass Transf., 2013, 60(1):334-342.

SCHMID G, YANG L H, YANG T H, et al.. Influence of inter-fin base length on thermal performance of free hanging horizontal base heat sinks[J]. Appl. Therm. Eng., 2016, 108:1226-1236.

MICHELI L, REDDY K S, MALLICK T K. Experimental comparison of micro-scaled plate-fins and pin-fins under natural convection[J]. Int. Commun. Heat Mass Transf., 2016, 75:59-66.

张建新, 牛萍娟, 武志刚, 等. 大功率LED散热器性能的双目标优化[J]. 电工技术学报, 2014, 29(4):136-141. ZHANG J X, NIU P J, WU Z G, et al.. Two-objective optimization of heat sink cooling performance for high-power LED application[J]. Trans. China Electrotech. Soc., 2014, 29(4):136-141. (in Chinese)

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