纳米银焊膏封装大功率COB LED模块的性能研究

杨呈祥; 李欣; 孔亚飞; 梅云辉; 陆国权

doi:10.3788/fgxb20163701.0094

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纳米银焊膏封装大功率COB LED模块的性能研究

发光学应用及交叉前沿 | 更新时间：2020-08-12

- 纳米银焊膏封装大功率COB LED模块的性能研究
- High Power COB LED Modules Attached by Nanosilver Paste
- 发光学报 2016年37卷第1期页码：94-99
- 作者机构：
  
  1. 天津大学材料科学与工程学院, 天津 300072
  2. 弗吉尼亚理工大学材料科学与工程学院, 弗吉尼亚蒙哥马利 24060
- 作者简介：
- 基金信息：
  
  天津市自然科学基金青年基金(13JCQNJC02400)资助项目()
- DOI：10.3788/fgxb20163701.0094
  中图分类号： TN312.8
- 纸质出版日期：2016-1-10，
  
  收稿日期：2015-9-10，
  
  修回日期：2015-11-12，
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杨呈祥, 李欣, 孔亚飞等. 纳米银焊膏封装大功率COB LED模块的性能研究[J]. 发光学报, 2016,37(1): 94-99

YANG Cheng-xiang, LI Xin, KONG Ya-fei etc. High Power COB LED Modules Attached by Nanosilver Paste[J]. Chinese Journal of Luminescence, 2016,37(1): 94-99
杨呈祥, 李欣, 孔亚飞等. 纳米银焊膏封装大功率COB LED模块的性能研究[J]. 发光学报, 2016,37(1): 94-99 DOI： 10.3788/fgxb20163701.0094.

YANG Cheng-xiang, LI Xin, KONG Ya-fei etc. High Power COB LED Modules Attached by Nanosilver Paste[J]. Chinese Journal of Luminescence, 2016,37(1): 94-99 DOI： 10.3788/fgxb20163701.0094.

摘要

为提高大功率LED的散热能力

采用具有更高熔点和更优良的导电导热性能的纳米银焊膏作为芯片粘结材料

以Al

基陶瓷基板封装COB LED模块。同时以Sn/Ag3.0/Cu0.5和导电银胶两种粘结材料作为对比

分别在27

100

120 ℃等环境温度中测试3种模块的光电性能来评估模块的热管理水平;在100 ℃环境下进行加速老化实验

评估3种LED模块的可靠性。测试结果表明

纳米银焊膏封装的大功率LED模块光电性能优异

且具有较强的长期可靠性。

Abstract

In order to improve the thermal performance of the high-power LED

the novel nanosilver paste with higher melting temperature and thermal/electrical conductivity was used as die-attach material

and Al

-based ceramic substrates were used to form a high-power LED chip-on-board (COB) architecture. To compare the effect of die attach material

high power COB LED modules were packaged by nanosilver paste

traditional Sn/Ag3.0/Cu0.5 solder and silver epoxy

respectively. The photoelectricity properties of three kinds of LEDs under various ambient temperatures from 27 to 120 ℃ were measured to evaluate their thermal management. The accelerated degradation testing under 100 ℃ was measured to evaluate the reliability. The test results show that the nanosilver paste is a very promising die-attach material for high power multi-chip modules packaging.

关键词

大功率LEDCOB封装纳米银焊膏光电性能可靠性

Keywords

high power LEDCOB packagingnanosilver pastephotoelectricity propertyreliability

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