浏览全部资源
扫码关注微信
BN&Al2O3/环氧树脂复合材料粘接层对LED灯结温的影响
Effects of BN & Al2O3/Epoxy Composites Adhesive Layer on Junction Temperature of LED
- 发光学报 2015年36卷第12期 页码：1469-1476
- 作者机构：
1. 重庆大学 物理学院 重庆,400044
2. 重庆大学 材料科学与工程学院 重庆,400044
- 作者简介：
- 基金信息：重庆市国际科技合作项目(cstc2012gg-gjhz50001)();重庆大学教学改革研究项目(2014Y31)();国家级大学生创新训练项目(20151061102
DOI：10.3788/fgxb20153612.1469
中图分类号： TN312.8纸质出版日期：2015-12-10，
收稿日期：2015-8-30，
修回日期：2015-9-23，
扫 描 看 全 文
吕亚南, 李巧梅, 牟其伍等. BN&Al<sub>2</sub>O<sub>3</sub>/环氧树脂复合材料粘接层对LED灯结温的影响[J]. 发光学报, 2015,36(12): 1469-1476
LYU Ya-nan, LI Qiao-mei, MU Qi-wu etc. Effects of BN & Al<sub>2</sub>O<sub>3</sub>/Epoxy Composites Adhesive Layer on Junction Temperature of LED[J]. Chinese Journal of Luminescence, 2015,36(12): 1469-1476
吕亚南, 李巧梅, 牟其伍等. BN&Al<sub>2</sub>O<sub>3</sub>/环氧树脂复合材料粘接层对LED灯结温的影响[J]. 发光学报, 2015,36(12): 1469-1476 DOI： 10.3788/fgxb20153612.1469.
LYU Ya-nan, LI Qiao-mei, MU Qi-wu etc. Effects of BN & Al<sub>2</sub>O<sub>3</sub>/Epoxy Composites Adhesive Layer on Junction Temperature of LED[J]. Chinese Journal of Luminescence, 2015,36(12): 1469-1476 DOI： 10.3788/fgxb20153612.1469.
摘要
自制BN/EP(环氧树脂)复合材料和Al
2
O
3
/EP复合材料作为LED灯PCB板和散热铝块之间的粘接层材料
采用精密钻孔的方法用高精度测温仪测量LED灯正常工作时的温度分布
讨论粘接层对结温的影响
并与COMSOL Multiphysics软件模拟结果进行对比分析。实验测量LED结温与模拟结温变化趋势基本一致
结温会随着粘接层厚度的增加而上升、随着粘接层复合材料热导率的增加先快速降低而后趋于平缓。最终得到PCB板和散热铝块间最佳粘接层厚度和粘接层复合材料配比
当BN的质量分数为60%时
BN/EP复合材料粘接层的热导率最高
此时LED结温为75.2 ℃
比纯环氧树脂粘接层LED的结温降低了27.6 ℃。而Al
2
O
3
/EP复合材料粘接层LED的最低结温为78.2 ℃
此时Al
2
O
3
的质量分数为50%。
Abstract
Homemade BN/EP composites and Al
2
O
3
/EP composites were used as the adhesive layer between PCB and the heat sink of LED
respectively. The temperature distribution of LED working in the normal condition was measured by high-precision thermometers through a small hole. The effect of the adhesive layer composites on the junction temperature of LED was discussed
and was compared with the results from COMSOL simulations. A similar variation trend of junction temperature of LED was observed in both our experiment and COMSOL simulation. The junction temperature of LED raised with the increment of thickness of the adhesive layer. Besides
along with the increment of thermal conductivity of the adhesive layer composites
the junction temperature declined sharply at first
and then gradually decreased to a flat level. At last
we obtained two optimum values of the thickness and the ratio of adhesive layer composites with the best performance. When the mass fraction of BN is 60%
the thermal conductivity of BN/EP composites reaches at the highest level. In this condition
the junction temperature of LED is the lowest (75.2 ℃) and is 27.6 ℃ lower than that of using pure epoxy resin. In addition
the minimum junction temperature of the Al
2
O
3
/EP composites is 78.2 ℃ when the mass fraction of Al
2
O
3
is 50%.
关键词
粘接层结温热导率环氧树脂复合材料温度分布
Keywords
adhesive layerjunction temperaturethermal conductivityepoxy compositestemperature distribution
references
Krames M R, Shchekin O B, Mueller-Mach R, et al. Status and future of high-power light-emitting diodes for solid-state lighting [J]. J. Disp. Technol., 2007, 3(2):160-175.
Qian M H, Lin Y D, Sun Y J. Life prediction model for LEDs based on the photo-electro-thermal-life theory [J]. Acta Optica Sinica (光学学报), 2012, 32(8):177-182 (in Chinese).
Jin P, Yu C Y, Zhou Q F, et al. Superior application of LED to street lighting [J]. Opt. Precision Eng.(光学 精密工程), 2011, 19(1):51-55 (in Chinese).
Yu B H, Wang Y H. Junction temperature and thermal resistance restrict the developing of high-power LED [J]. Chin. J. Lumin.(发光学报), 2005, 26(6):761-766 (in Chinese).
Yang L Q, Fu M J, Wei B, et al. Thermal analysis and thermal design of organic Light-emitting diode [J]. Chin. J. Lumin.(发光学报), 2012, 33(6):624-627 (in Chinese).
Chen Q, Luo X, Zhou S, et al. Dynamic junction temperature measurement for high power light emitting diodes [J]. Rev. Sci. Instrum., 2011, 82(8):084904-1-7.
Liang T J, Zhang F H, Qiu X Z, et al. The influence of junction temperature on the spectral characteristics of white LED with low color rendering index [J]. J. Funct. Mater.(功能材料), 2013, 43(24):3389-3392 (in Chinese).
Gao J Q, Guo Q H, He X T. Reserch and design of heat emission on LED roadway lighting luminaire [J]. Chin. Illumin. Eng. J.(照明工程学报), 2010, 21(5):81-85 (in Chinese).
Chen Y X, Shen G D, Han J R, et al. Study of light efficiency and lifetime of LED with different surface structures [J]. Acta Phys. Sinica (物理学报), 2010, 59(1):545-549 (in Chinese).
Lin Y, Lu Y J, Gao Y L, et al. Measuring the thermal resistance of LED packages in practical circumstances [J]. Thermochim. Acta, 2011, 520(1):105-109.
Shi D, Feng S W, Zhang Y M, et al. Thermal investigation of LED array with multiple packages based on the superposition method [J]. Microelectron. J., 2015, 46(7):632-636.
Wang J, Zhao X J, Cai Y X, et al. Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package [J]. Energ. Convers Manage., 2015, 101(1):532-540.
Wang G Y, Jiang G L, Zhang J. Preparation, curing kinetic and properties of a novel amine with flexible polyoxypropylene side chain curing agent for epoxy resin [J]. Thermochim. Acta, 2014, 589(10):197-206.
Peng W Y, Huang X Y, Yu J H, et al. Electrical and thermophysical properties of epoxy/aluminum nitride nanocomposites: Effects of nanoparticle surface modification [J]. Composites Part A: Appl. Sci. Manufact., 2010, 41(9):1201-1209.
Nie G C, Wu Y H, Xie X L. Synthesis and structural analysis of new epoxy resin nanocomposites [J]. Chin. J. Struct. Chem.(结构化学), 2004, 23(8):957-961 (in Chinese).
Kim K H, Kim M J, Hwang Y S, et al. Chemically modified boron nitride-epoxy terminated dimethylsiloxane composite for improving the thermal conductivity [J]. Ceram. Inter., 2014, 40(1):2047-2056.
Gao Z F, Zhao L. Effect of nano-fillers on the thermal conductivity of epoxy composites with micro-Al2O3 particles [J]. Mater. Design, 2015, 66:176-182.
Mu Q W. Multi function heat conduction coefficient measuring instrument. China: CN203772777U [P]. 2014-08-13.
Zhang M C. Preparation of Thermal Composite Materials and Reflective Materials for Application Research on White LED [D]. Shanghai: East China Normal University, 2010 (in Chinese).
Dang Z M, Yu Y F, Xu H P, et al. Study on microstructure and dielectric property of the BaTiO3/epoxy resin composites [J]. Composit. Sci. Technol., 2008, 68(1):171-177.
Ran Q. Study on Thermal Interface of Epoxy Resin Composites Materials [D]. Chongqing: Chongqing University, 2015 (in Chinese).
0
浏览量
21
下载量
1
CSCD
- 网络PDF下载
- Meta-XML下载
- BibTeX下载
- Endnote下载
- RefMan 下载
- NoteExpress下载
- NoteFirst下载
关联资源
相关文章
相关作者
相关机构
- 地址：长春市经济技术开发区东南湖大路3888号 邮编：130033
- 联系电话：0431-86176862 Email：fgxbt@126.com
- 本系统由Light学术出版中心、北京北大方正电子有限公司共建 吉ICP备11002662号-17
京公网安备11010802024621 - 本系统建议在Chrome、 IE9+ 以上版本浏览器阅读本站内容，360浏览器请切换至极速模式
- Cookies帮助我们提供服务并提供个性化体验。使用本网站，即表示您同意我们使用Cookies
