LAN Hai, DENG Zhong-hua, LIU Zhu-guang, HUANG Ji-quan, CAO Yong-ge. Thermal Simulation for Design of LED COB Package[J]. Chinese Journal of Luminescence, 2012,(5): 535-539
LAN Hai, DENG Zhong-hua, LIU Zhu-guang, HUANG Ji-quan, CAO Yong-ge. Thermal Simulation for Design of LED COB Package[J]. Chinese Journal of Luminescence, 2012,(5): 535-539 DOI: 10.3788/fgxb20123305.0535.
ceramic substrates without insulating layer and metal substrate with insulating layer were studied for the thermal management of COB package. Their chip-to-substrate thermal resistances were simulated and calculated by finite element method. Temperature distribution in two substrates was obtained by infrared thermography
which confirmed the adopted finite element method is feasible in our experiment. Based on these studies
the thermal management of COB package was optimized by finite element simulation. The results show that the ceramic substrate has a lower chip-to-substrate thermal resistance (only half of that of the metal substrate)
which indicate that it is more suitable for the heat dissipation in high-power LED package.
关键词
COB封装有限元分析热仿真
Keywords
COB packagefinite element analysisthermal simulation
references
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