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1.中国科学院半导体研究所 宽禁带半导体研发中心,北京 100083
2.中国科学院大学,材料科学与光电技术学院,北京 100049
[ "董婧楠(2001-),女,山西长治人,硕士研究生,2023 年于太原理工大学获得学士学位,主要从事氮化物材料生长和器件制备的研究。E-mail:dongjingnan@semi.ac.cn" ]
[ "王军喜(1975-),男,陕西西安人,博士,研究员,2003年于中国科学院半导体研究所获得博士学位,主要从事III族氮化物发光材料与器件的研究。 E-mail:jxwang@semi.ac.cn" ]
[ "魏同波(1978-),男,山东潍坊人,博士,研究员,2007年于中国科学院半导体研究所获得博士学位,主要从事宽禁带半导体材料生长及器件制备的研究。 E-mail:tbwei@semi.ac.cn" ]
网络出版日期:2025-06-07,
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董婧楠,多亦威,羊建坤等.六方氮化硼的外延生长与器件应用[J].发光学报,
Dong Jingnan,Duo Yiwei,Yang Jiankun,et al.Epitaxial growth of hexagonal boron nitride and device application[J].Chinese Journal of Luminescence,
董婧楠,多亦威,羊建坤等.六方氮化硼的外延生长与器件应用[J].发光学报, DOI:10.37188/CJL.20250128 CSTR: 32170.14.CJL.20250128.
Dong Jingnan,Duo Yiwei,Yang Jiankun,et al.Epitaxial growth of hexagonal boron nitride and device application[J].Chinese Journal of Luminescence, DOI:10.37188/CJL.20250128 CSTR: 32170.14.CJL.20250128.
六方氮化硼(h-BN)是一种具有代表性的宽禁带二维层状材料,其表面原子级整并且没有悬挂键和带电杂质,拥有优异的机械稳定性、热稳定性和化学惰性。因为它在光电子学、量子光学和电子学领域表现出非凡的特性,目前已成为各种应用场景的低维衬底材料载体。本文首先系统地介绍了h-BN的基本结构以及光电、机械、热学等材料性能,然后阐述了h-BN的最新制备方法,包括剥离、化学和物理气相沉积、分子束外延,其中详细介绍了使用化学气相沉积在过渡金属衬底和介质衬底上生长h-BN薄膜的现状,并分析了其独特优势。接着从转移介质、FET栅介质层、DUV光电器件、单光子源以及中子探测等多维度介绍了基于h-BN器件应用的最新研究进展。最后基于h-BN的研究现状和关键问题,分析了其所面临的一些挑战和瓶颈,并对未来的发展方向提出展望。
Hexagonal boron nitride (h-BN) is a representative wide-bandgap two-dimensional layered material with an atomically complete surface and no dangling bonds and charged impurities, and has excellent mechanical stability, thermal stability and chemical inertness. Because it exhibits extraordinary properties in the fields of optoelectronics, quantum optics and electronics, it has become a low-dimensional substrate material carrier for various application scenarios. In this paper, the basic structure of h-BN and the properties of optoelectal, mechanical, thermal and other materials are systematically introduced, and then the latest preparation methods of h-BN are described, including exfoliation, chemical and physical vapor deposition, and molecular beam epitaxy. Then, the latest research progress of h-BN device applications is introduced from multiple dimensions, such as transfer medium, FET gate dielectric layer, DUV optoelectronic device, single photon source and neutron detection. Finally, based on the research status and key problems of h-BN, some challenges and bottlenecks are analyzed, and the future development direction is proposed.
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