HUANG LINFENG, XIONG CHUANBING, TANG YINGWEN, et al. Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs. [J]. Chinese journal of luminescence, 2024, 45(7): 1196-1210.
HUANG LINFENG, XIONG CHUANBING, TANG YINGWEN, et al. Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs. [J]. Chinese journal of luminescence, 2024, 45(7): 1196-1210. DOI: 10.37188/CJL.20240090.