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Thermal Analysis and Optimization of Vertical-cavity Surface-emitting Lasers with Different Packaging Structures
Device Fabrication and Physics | 更新时间：2025-06-25

    • Thermal Analysis and Optimization of Vertical-cavity Surface-emitting Lasers with Different Packaging Structures

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    • “In the field of optoelectronic devices, experts have analyzed the thermal characteristics of VCSEL based on finite element models and proposed optimized packaging solutions, effectively improving the heat dissipation performance of VCSEL.”
    • Chinese Journal of Luminescence   Vol. 45, Issue 8, Pages: 1371-1379(2024)

    • DOI：10.37188/CJL.20240141    

      CLC： TN248

    • Received：20 May 2024，

      Revised：29 May 2022，

      Published：25 August 2024

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  • ZHANG Wei,WANG Yanjing,TONG Haixia,et al.Thermal Analysis and Optimization of Vertical-cavity Surface-emitting Lasers with Different Packaging Structures[J].Chinese Journal of Luminescence,2024,45(08):1371-1379. DOI： 10.37188/CJL.20240141.

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