Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

Zhe WANG; Yong-tong WANG; Jia-xin LIU; Yun MOU; Yang PENG; Ming-xiang CHEN

doi:10.37188/CJL.20220084

您当前的位置：

首页 >

文章列表页 >

Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

Luminescence Industry and Technology Frontier | 更新时间：2022-08-01

- Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging
  增强出版
- Chinese Journal of Luminescence Vol. 43, Issue 7, Pages: 1139-1146(2022)
- 作者机构：
  
  1.华中科技大学机械科学与工程学院，湖北武汉　430074
  2.华中科技大学航空航天学院，湖北武汉　430074
- 作者简介：
- 基金信息：
  
  Key Research and Development Project of Hubei Province(2021BAA213;2020BAB068;2021BAA071)
- DOI：10.37188/CJL.20220084
  CLC： TN312.8
- Published：05 July 2022，
  
  Received：11 March 2022，
  
  Revised：31 March 2022，
扫描看全文
王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-1146.

WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-1146.
王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-1146. DOI： 10.37188/CJL.20220084.

WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-1146. DOI： 10.37188/CJL.20220084.

摘要

普通印刷电路板（PCB）材料热导率低，散热性能不佳，难以用于封装大功率器件。本文提出并制备了一种直接电镀铜陶瓷基板（DPC）的PCB基板（以下简称“内嵌基板”），利用陶瓷材料高热导率强化基板局部散热，并将其应用于大功率LED封装。使用胶粘剂将DPC基板固定在开窗的PCB基板中，电互连后得到内嵌基板。相较于普通PCB基板，相同电流下内嵌基板表面温度低，温升趋势放缓，当电流从200 mA增加到400 mA时，内嵌基板温升比普通PCB基板低约42.1 ℃。当电流为350 mA时，内嵌基板封装的LED样品热阻和结温变化分别为15.55 K/W和9.36 ℃，其光功率随电流增加而增大，并始终高于同电流下普通PCB基板封装LED；在400 mA时，两者光功率相差约16.7%。实验表明，内嵌基板是一种高性能、低成本的封装基板，可有效提高大功率LED散热性能，满足功率器件封装应用需求。

Abstract

The low thermal conductivity of ordinary printed circuit board（PCB） material leads to poor heat dissipation performance， which makes it difficult to package high-power devices. In this work， a PCB substrate embedded with direct plated copper ceramic substrate（DPC）（hereinafter referred to as “embedded substrate”） is developed， which can enhance the local heat dissipation of PCB owing to the high thermal conductivity of ceramic materials， so it can be used for high-power LED packaging. Firstly， the DPC is fixed into the windowed PCB with adhesive， and the embedded substrate is obtained after electrical interconnection. Compared with ordinary PCB substrate， the surface temperature of embedded substrate is lower and the temperature rise trend is slow at the same current. When the current increases from 200 mA to 400 mA， the temperature rise of LED packaged with embedded substrate is about 42.1 ℃ lower than that of ordinary PCB substrate. At 350 mA， the thermal resistance and junction temperature of LED sample packaged with embedded substrate are 15.55 K/W and 9.36 ℃ respectively， and its optical power increases with the increase of current， which is always higher than that of LED packaged with ordinary PCB substrate under the same current. At 400 mA， the difference in optical power between them is about 16.7%. The experiments show that the embedded substrate is a high-performance and low-cost packaging substrate， which can effectively improve the heat dissipation performance of high-power LED and meet the packaging application requirements of power devices.

关键词

发光二极管（LED）内嵌PCB直接电镀铜陶瓷基板（DPC）散热光热性能

Keywords

LEDembedded PCBdirect plated copper ceramic substrate（DPC）heat dissipationphotothermal properties

references

SCHUBERT E F，KIM J K. Solid-state light sources getting smart ［J］. Science， 2005，308（5726）：1274-1278. doi: 10.1126/science.1108712http://dx.doi.org/10.1126/science.1108712

WU J D，ZHANG Z F，ZHENG H，et al. Realization of conformal phosphor coating by ionic wind patterning for phosphor-converted white LEDs ［J］. IEEE Photonics Technol. Lett.， 2017，29（3）：299-301. doi: 10.1109/lpt.2016.2647278http://dx.doi.org/10.1109/lpt.2016.2647278

LUO X B，HU R，LIU S，et al. Heat and fluid flow in high-power LED packaging and applications ［J］. Prog. Energy Combust. Sci.， 2016，56：1-32. doi: 10.1016/j.pecs.2016.05.003http://dx.doi.org/10.1016/j.pecs.2016.05.003

CHENG H，MOU Y，PENG Y，et al. White LEDs with high optical consistency packaged using 3D ceramic substrate ［J］. IEEE Photonics Technol. Lett.， 2019，31（22）：1818-1821. doi: 10.1109/lpt.2019.2948364http://dx.doi.org/10.1109/lpt.2019.2948364

张稀雯，余子康，牟运，等. 荧光玻璃封装芯片级白光LED光热性能［J］. 发光学报， 2021，42（12）：1961-1968. doi: 10.37188/CJL.20210303http://dx.doi.org/10.37188/CJL.20210303

ZHANG X W，YU Z K，MOU Y，et al. Photothermal performance investigation of phosphor-in-glass packaged chip-scale white LED ［J］. Chin. J. Lumin.， 2021，42（12）：1961-1968. （in Chinese）. doi: 10.37188/CJL.20210303http://dx.doi.org/10.37188/CJL.20210303

彭洋，陈明祥，罗小兵. 深紫外LED封装技术现状与展望［J］. 发光学报， 2021，42（4）：542-559. doi: 10.37188/CJL.20200394http://dx.doi.org/10.37188/CJL.20200394

PENG Y，CHEN M X，LUO X B. Status and perspectives of deep ultraviolet LED packaging technology ［J］. Chin. J. Lumin.， 2021，42（4）：542-559. （in Chinese）. doi: 10.37188/CJL.20200394http://dx.doi.org/10.37188/CJL.20200394

LEI X，ZHENG H，GUO X，et al. Reduction of die-bonding interface thermal resistance for high-power LEDs through embedding packaging structure ［J］. IEEE Trans. Power Electron.， 2017，32（7）：5520-5526. doi: 10.1109/tpel.2016.2609891http://dx.doi.org/10.1109/tpel.2016.2609891

CHEN C，ZHAO D Z，XIONG Z H，et al. Comparative study of the photoelectric and thermal performance between traditional and chip-scale packaged white LED ［J］. IEEE Trans. Electron. Devices， 2021，68（4）：1710-1716. doi: 10.1109/ted.2021.3058091http://dx.doi.org/10.1109/ted.2021.3058091

FREISLEBEN J，DZUGAN T，HAMACEK A. Comparative study of printed circuit board substrates used for thermal management of high power LEDs ［C］. Proceedings of the 38th International Spring Seminar on Electronics Technology，Eger，Hungary， 2015：80-84. doi: 10.1109/isse.2015.7247967http://dx.doi.org/10.1109/isse.2015.7247967

WENG C J. Advanced thermal enhancement and management of LED packages ［J］. Int. Commun. Heat Mass Transfer，2009，36（3）：245-248. doi: 10.1016/j.icheatmasstransfer.2008.11.015http://dx.doi.org/10.1016/j.icheatmasstransfer.2008.11.015

陈明祥，罗小兵，马泽涛，等. 大功率白光LED封装设计与研究进展［J］. 半导体光电， 2006，27（6）：653-658. doi: 10.3969/j.issn.1001-5868.2006.06.001http://dx.doi.org/10.3969/j.issn.1001-5868.2006.06.001

CHEN M X，LUO X B，MA Z T，et al. Advances in packaging design and research on high-power white LED ［J］. Semicond. Optoelectron.，2006，27（6）：653-658. （in Chinese）. doi: 10.3969/j.issn.1001-5868.2006.06.001http://dx.doi.org/10.3969/j.issn.1001-5868.2006.06.001

LUO X B，FU X，CHEN F，et al. Phosphor self-heating in phosphor converted light emitting diode packaging ［J］. Int. J. Heat Mass Transfer， 2013，58（1-2）：276-281. doi: 10.1016/j.ijheatmasstransfer.2012.11.056http://dx.doi.org/10.1016/j.ijheatmasstransfer.2012.11.056

DING X R，TANG Y，LI Z T，et al. Thermal and optical investigations of high power LEDs with metal embedded printed circuit boards ［J］. Int. Commun. Heat Mass Transfer， 2015，66：32-39. doi: 10.1016/j.icheatmasstransfer.2015.05.005http://dx.doi.org/10.1016/j.icheatmasstransfer.2015.05.005

许文涛，汪莉丽，朱忠翰. 一种新型嵌铜块印制板的制作方法［J］. 印制电路信息， 2020，28（9）：39-42. doi: 10.3969/j.issn.1009-0096.2020.09.010http://dx.doi.org/10.3969/j.issn.1009-0096.2020.09.010

XU W T，WANG L L，ZHU Z H. A new manufacturing method of copper block PCB ［J］. Printed Circuit Inf.， 2020，28（9）：39-42. （in Chinese）. doi: 10.3969/j.issn.1009-0096.2020.09.010http://dx.doi.org/10.3969/j.issn.1009-0096.2020.09.010

WANG N，HSU A，LIM A，et al. High brightness LED assembly using DPC substrate and superMCPCB ［C］. Proceedings of the 4th International Microsystems，Packaging，Assembly and Circuits Technology Conference，Taipei，China， 2009：199-202. doi: 10.1109/impact.2009.5382142http://dx.doi.org/10.1109/impact.2009.5382142

程浩，陈明祥，罗小兵，等. 电子封装陶瓷基板［J］. 现代技术陶瓷，2019，40（4）：265-292.

CHENG H，CHEN M X，LUO X B，et al. Ceramic substrate for electronic packaging ［J］. Adv. Ceram.， 2019，40（4）：265-292. （in Chinese）

QIN D C，XIAO Y L，LIANG K W. Characterization of A novel FR4/AlN printed circuit board of high thermal conductivity ［J］. Adv. Mater.，2018，7（2）：26-33. doi: 10.11648/j.am.20180702.13http://dx.doi.org/10.11648/j.am.20180702.13

秦典成，李保忠，黄奕钊，等. 陶瓷复合FR4结构界面形貌与导热性能［J］. 半导体技术， 2017，42（11）：864-869.

QIN D C，LI B Z，HUANG Y Z，et al. Interface morphology and thermal conductivity of ceramic-embedded FR4 structure ［J］. Semicond. Technol.， 2017，42（11）：864-869. （in Chinese）

YANG K S，CHUNG C H，TU C W，et al. Thermal spreading resistance characteristics of a high power light emitting diode module ［J］. Appl. Therm. Eng.，2014，70（1）：361-368. doi: 10.1016/j.applthermaleng.2014.05.028http://dx.doi.org/10.1016/j.applthermaleng.2014.05.028

王健，黄先，刘丽，等. 温度和电流对白光LED发光效率的影响［J］. 发光学报， 2008，29（2）：358-362.

WANG J，HUANG X，LIU L，et al. Effect of temperature and current on LED luminous efficiency ［J］. Chin. J. Lumin.，2008，29（2）：358-362. （in Chinese）

钟文姣，魏爱香，招瑜. 结温对GaN基白光LED光学特性的影响［J］. 发光学报， 2013，34（9）：1203-1207. doi: 10.3788/fgxb20133409.1203http://dx.doi.org/10.3788/fgxb20133409.1203

ZHONG W J，WEI A X，ZHAO Y. Dependence of GaN-based white LED colorimetric parameters on junction temperature ［J］. Chin. J. Lumin., 2013，34（9）:1203-1207. （in Chinese）. doi: 10.3788/fgxb20133409.1203http://dx.doi.org/10.3788/fgxb20133409.1203

Views

237

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Thermal Stability and Reliability Analysis of Ultraviolet Light-emitting Diode Packages

Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED

Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

Related Author

Mingxiang CHEN

Yang PENG

Yun MOU

Jiaxin LIU

Yongtong WANG

Zhe WANG

CAO Jian-wu

HU Ai-hua

Related Institution

College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China

Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China

School of Electronic Information Engineering, Guangdong University of Technology, Guangzhou 510006, China

Fujian Hongbo Opto-Electronics Technology Co., Ltd., Fuzhou 350008, China

Guangdong LED Packaing Heat Sink Substratae Engineering Technology Research Center

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176862 Email：fgxbt@126.com
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰