ZHE WANG, YONG-TONG WANG, JIA-XIN LIU, et al. Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging. [J]. Chinese journal of luminescence, 2022, 43(7): 1139-1146.
DOI:
ZHE WANG, YONG-TONG WANG, JIA-XIN LIU, et al. Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging. [J]. Chinese journal of luminescence, 2022, 43(7): 1139-1146. DOI: 10.37188/CJL.20220084.
Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging增强出版
The low thermal conductivity of ordinary printed circuit board(PCB) material leads to poor heat dissipation performance, which makes it difficult to package high-power devices. In this work, a PCB substrate embedded with direct plated copper ceramic substrate(DPC)(hereinafter referred to as “embedded substrate”) is developed, which can enhance the local heat dissipation of PCB owing to the high thermal conductivity of ceramic materials, so it can be used for high-power LED packaging. Firstly, the DPC is fixed into the windowed PCB with adhesive, and the embedded substrate is obtained after electrical interconnection. Compared with ordinary PCB substrate, the surface temperature of embedded substrate is lower and the temperature rise trend is slow at the same current. When the current increases from 200 mA to 400 mA, the temperature rise of LED packaged with embedded substrate is about 42.1 ℃ lower than that of ordinary PCB substrate. At 350 mA, the thermal resistance and junction temperature of LED sample packaged with embedded substrate are 15.55 K/W and 9.36 ℃ respectively, and its optical power increases with the increase of current, which is always higher than that of LED packaged with ordinary PCB substrate under the same current. At 400 mA, the difference in optical power between them is about 16.7%. The experiments show that the embedded substrate is a high-performance and low-cost packaging substrate, which can effectively improve the heat dissipation performance of high-power LED and meet the packaging application requirements of power devices.
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