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Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging
Luminescence Industry and Technology Frontier | 更新时间:2022-08-01
    • Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

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    • Chinese Journal of Luminescence   Vol. 43, Issue 7, Pages: 1139-1146(2022)
    • DOI:10.37188/CJL.20220084    

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  • WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-1146. DOI: 10.37188/CJL.20220084.

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