您当前的位置:
首页 >
文章列表页 >
Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging
Luminescence Industry and Technology Frontier | 更新时间:2022-08-01
    • Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

      增强出版
    • Chinese Journal of Luminescence   Vol. 43, Issue 7, Pages: 1139-1146(2022)
    • DOI:10.37188/CJL.20220084    

      CLC: TN312.8
    • Published:05 July 2022

      Received:11 March 2022

      Revised:31 March 2022

    移动端阅览

  • ZHE WANG, YONG-TONG WANG, JIA-XIN LIU, et al. Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging. [J]. Chinese journal of luminescence, 2022, 43(7): 1139-1146. DOI: 10.37188/CJL.20220084.

  •  
  •  

0

Views

483

下载量

3

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Research Progress of CDs-based Electroluminescent Devices
Thermal Stability and Reliability Analysis of Ultraviolet Light-emitting Diode Packages
Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED
Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

Related Author

Mingxiang CHEN
Yang PENG
Yun MOU
Jiaxin LIU
Yongtong WANG
Zhe WANG
LI Xu
GUAN Li

Related Institution

Hebei Key Laboratory of Optic-Electronic Information and Materials, College of Physics Science and Technology, Hebei University
Hebei Key Laboratory of Semiconductor Lighting and Display Critical Materials, Hebei Ledphor Optoelectronics Technology Co., LTD.
College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China
Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China
School of Electronic Information Engineering, Guangdong University of Technology, Guangzhou 510006, China
0