Effect of Number and Location of Eutectic Chips on Luminescent Properties of Ceramic Eutectic Packaged LED

Shi-long WANG; Chuan-bing XIONG; Ying-wen TANG; Xiao-zhen LI; Qian LIU

doi:10.37188/CJL.20200261

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Effect of Number and Location of Eutectic Chips on Luminescent Properties of Ceramic Eutectic Packaged LED

Luminescence Industry and Technology I Frontier | 更新时间：2020-11-10

- Effect of Number and Location of Eutectic Chips on Luminescent Properties of Ceramic Eutectic Packaged LED
- Chinese Journal of Luminescence Vol. 41, Issue 11, Pages: 1421-1430(2020)
- 作者机构：
  
  闽南师范大学物理与信息工程学院, 福建漳州 363000
- 作者简介：
- 基金信息：
  
  National Natureal Science Foundation of China;Industry-University Cooperation Projec
- DOI：10.37188/CJL.20200261
  CLC： TN304
- Published：2020-11，
  
  Received：5 August 2020，
  
  Accepted：3 September 2020
扫描看全文
Shi-long WANG, Chuan-bing XIONG, Ying-wen TANG, et al. Effect of Number and Location of Eutectic Chips on Luminescent Properties of Ceramic Eutectic Packaged LED. [J]. Chinese Journal of Luminescence 41(11):1421-1430(2020)
DOI：

Shi-long WANG, Chuan-bing XIONG, Ying-wen TANG, et al. Effect of Number and Location of Eutectic Chips on Luminescent Properties of Ceramic Eutectic Packaged LED. [J]. Chinese Journal of Luminescence 41(11):1421-1430(2020) DOI： 10.37188/CJL.20200261.

摘要

在大小为5.80 mm×2.55 mm×0.50 mm的8芯陶瓷封装基板上分别共晶了8颗和4颗1.125 mm×1.125 mm（45 mil×45 mil）的倒装蓝光LED芯片，在4.15 mm×2.55 mm×0.50 mm的6芯基板上共晶了6颗和3颗同规格芯片。在部分样品芯片侧边涂围了高反射白墙胶，研究了涂覆白墙胶对器件光功率的影响。在部分涂围了白墙胶样品的芯片顶面涂覆荧光粉硅胶混合层制备了白光器件，研究了共晶芯片数及共晶位置对蓝光/白光器件光功率、光通量和色温的影响。结果表明，共晶芯片的数量（额定功率）与陶瓷基板面积的匹配程度、陶瓷基板热电分离金属层与芯片共晶位置的匹配度会显著影响陶瓷封装LED的发光性能。

Abstract

Eight and four 1.125 mm×1.125 mm(45 mil×45 mil) flip-flop blue LED chips were eutectic on an 8-core ceramic package substrate with a size of 5.80 mm×2.55 mm×0.50 mm. Six and three chips of the same specification were co-crystallized on a 6-core substrate of 4.15 mm×2.55 mm×0.50 mm. The high reflection white wall glue was coated on the side of some sample chips

and the effect of white wall glue on the optical power of the device was studied. White light devices were fabricated by coating silica gel mixed layer on the top surface of the chip partially coated with white wall glue. The effects of the number of eutectic chips and the position of the eutectic on the optical power

luminous flux and color temperature of the blue and white light devices are studied. The results show that the matching degree between the number of eutectic chips(rated power) and the ceramic substrate area

and the matching degree between the thermoelectric separation metal layer of ceramic substrate and the eutectic position of the chip can significantly affect the luminous performance of ceramic packaged LED.

关键词

陶瓷封装金锡共晶热平衡热电分离

Keywords

ceramic packaginggold tin eutecticthermal balancethermoelectric separation

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