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1.中国科学院半导体研究所 宽禁带半导体研发中心, 北京 100083
2.中国科学院大学 材料科学与光电技术学院, 北京 100049
[ "蒋宗霖(1999-),男,重庆人,硕士研究生,2021年于北京邮电大学获得学士学位,主要从事氮化物材料制备技术,深紫外LED材料生长和器件制备技术的研究。E-mail: jiangzl@semi.ac.cn" ]
[ "王军喜(1975-),男,陕西西安人,博士,研究员,2003年于中国科学院半导体研究所获得博士学位,主要从事Ⅲ族氮化物发光材料与器件的研究。E-mail: jxwang@semi.ac.cn" ]
[ "魏学成(1977-),男,山东莱芜人,博士,副研究员,2007年于中国科学院半导体研究所获得博士学位,主要从事宽禁带半导体发光材料与器件的研究。E-mail: xcwei@semi.ac.cn" ]
收稿日期:2024-05-10,
修回日期:2024-05-19,
纸质出版日期:2024-08-25
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蒋宗霖,闫丹,张宁等.NH3/N2复合热退火技术改善高浓度Mg掺杂GaN材料性能[J].发光学报,2024,45(08):1325-1333.
JIANG Zonglin,YAN Dan,ZHANG Ning,et al.Enhanced Properties of Heavily Mg-doped GaN by Combining Thermal Annealing Processes in NH3/N2[J].Chinese Journal of Luminescence,2024,45(08):1325-1333.
蒋宗霖,闫丹,张宁等.NH3/N2复合热退火技术改善高浓度Mg掺杂GaN材料性能[J].发光学报,2024,45(08):1325-1333. DOI: 10.37188/CJL.20240130.
JIANG Zonglin,YAN Dan,ZHANG Ning,et al.Enhanced Properties of Heavily Mg-doped GaN by Combining Thermal Annealing Processes in NH3/N2[J].Chinese Journal of Luminescence,2024,45(08):1325-1333. DOI: 10.37188/CJL.20240130.
研究了NH
3
/N
2
复合热退火技术对高浓度Mg掺杂GaN材料晶体质量、发光性质及导电性能的影响。实验结果表明,相较于传统N
2
氛围高温热退火后处理工艺而言,NH
3
氛围高温热退火后处理工艺可以改善高浓度Mg掺杂GaN材料的晶体质量,同时可以增进Mg受主原子的有效掺杂,使得其光致发光谱中蓝光峰强度增强。采用NH
3
氛围高温热退火结合N
2
氛围低温热退火后处理工艺复合技术制备得到的高浓度Mg掺杂GaN材料内部背景电子浓度显著降低。这是由于在NH
3
氛围高温热退火后处理工艺中,NH
3
的热分解产物能够有效降低材料内N空位和间隙Ga原子等浅施主型缺陷浓度,最终改善高浓度Mg掺杂GaN材料的导电性能。
The effect of a novel post-growth process,
i.e
. high-temperature thermal annealing process in NH
3
, on the crystal quality, luminescence property, and electrical conductivity of the heavily Mg-doped GaN was studied. The experimental results showed that, compared with the traditional high-temperature annealing process in N
2
, the high-temperature thermal annealing process in NH
3
can improve crystal quality in the heavily Mg-doped GaN, while promote the further effective doping of Mg acceptors, resulting in an enhancement of the intensity of the blue luminescence band in its photoluminescence spectra. The heavily Mg-doped GaN with significantly lower background electron concentration was obtained by combining high-temperature thermal annealing process in NH
3
with low-temperature thermal annealing process in N
2
. This is because that the thermal decomposition products of NH
3
in the post-growth process can effectively reduce the concentration of shallow donor-type defects such as N vacancies and interstitial Ga atoms in the material, ultimately improving electrical conductivity of the heavily Mg-doped GaN.
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