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Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure
Device Fabrication and Physics | 更新时间：2026-09-12

    • Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure

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    • Chinese Journal of Luminescence   Vol. 46, Issue 2, Pages: 343-353(2025)

    • DOI：10.37188/CJL.20240205    

      CLC： TN248.4
    • CSTR：32170. 14. CJL. 20240205    

    • Received：14 September 2024，

      Revised：2024-10-10，

      Published：25 February 2025

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  • CHEN Lang,LIU Jiachen,ZHANG Junyue,et al.Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure[J].Chinese Journal of Luminescence,2025,46(02):343-353. DOI： 10.37188/CJL.20240205. CSTR： 32170. 14. CJL. 20240205.

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Related Author

LIU Jiachen
ZHANG Junyue
WU Shunhua
HUANG Weizhou
ZHANG Rui
WANG Zhenfu
ZHANG Jiachen
LI Te

Related Institution

State Key Laboratory of Transient 0ptics and Photonics， Xi'an Institute of 0ptics and Precision Mechanics， Chinese Academy of Sciences
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