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1. 中国科学院半导体研究所
2. 中国科学院大学 北京,100049
纸质出版日期:2018-3-5,
网络出版日期:2017-10-12,
收稿日期:2017-7-24,
修回日期:2017-9-28,
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刘翠翠, 王鑫, 井红旗等. 三波长合束单管激光器光纤耦合模块设计[J]. 发光学报, 2018,39(3): 337-342
LIU Cui-cui, WANG Xin, JING Hong-qi etc. Design of Fiber-coupled Laser Diode Module Based on Three-wavelengths Multiplexing by ZEMAX[J]. Chinese Journal of Luminescence, 2018,39(3): 337-342
刘翠翠, 王鑫, 井红旗等. 三波长合束单管激光器光纤耦合模块设计[J]. 发光学报, 2018,39(3): 337-342 DOI: 10.3788/fgxb20183903.0337.
LIU Cui-cui, WANG Xin, JING Hong-qi etc. Design of Fiber-coupled Laser Diode Module Based on Three-wavelengths Multiplexing by ZEMAX[J]. Chinese Journal of Luminescence, 2018,39(3): 337-342 DOI: 10.3788/fgxb20183903.0337.
为了研究以单管半导体激光器为基本单元的高功率、高亮度波长合束光纤耦合模块,设计出新型光纤激光器泵浦模块,基于ZEMAX光学设计软件等设计了一种由30支单管半导体激光器组成、可输出3种波长光束的光纤耦合模块。将经快慢轴整形、空间合束、波长合束、光路转向及聚焦的光束耦合进入芯径105 m、数值孔径0.22的普通光纤,最终得到尾纤输出端高于357.91 W的输出功率,光纤耦合效率为99.42%,光功率密度为27.24 MW/cm
2
-stras。为了验证模块的实际操作的可行性,分析了光纤端面法线与入射光束之间的夹角对耦合效率的影响,结果显示该夹角对模块的耦合效率影响较小。同时,应用ANSYS软件对模块散热情况的分析结果可知,模块散热性能良好。故该模块各项性能良好,可靠性较高,实现了高功率、高亮度、多波长的多单管半导体激光器光纤耦合模块的设计目的。
In order to develop a wavelengths ultiplexing fiber-coupled module of high output power and high power denisty on the basis of single emitter semiconductor laser diode
and design a kind of new pump laser for fiber laser
a new-type fiber-coupled module composed of 30 LDs was designed based on ZEMAX optical design software
which can output three kinds of wavelengths. After collimation by micro lens
including FACs and SACs
spatial multiplexing
wavelength multiplexing
diversion by special mirrors
focusing by focus lens and coupling to a fiber
the module can produce above 357.91 W output power from a standard fiber with core diameter of 105 m and numerical aperture (NA) of 0.22. The total fiber coupling efficiency is about 99.42%
and the power density is 27.24 MW/cm
2
. To test the practical feasibility of the module
analyzed the influence from the angle between the incident beam and the normals of optical fiber end face on the coupling efficiency
the results showed the effects from the angle is so tiny that can be neglected. At the same time
the application of ANSYS software for the thermal analysis of this module shows that the cooling performance of the module is pretty good. Therefore this module's performance is positive and of high reliability
which can meet the demand of single emitter semiconductor laser fiber-coupled module which is of high power
high brightness and multiple wavelengths. Additionally
this design is of great guiding significance for practical production.
半导体激光器光纤耦合合束技术ZEMAX
semiconductor laserfiber couplingmultiplexing technologyZEMAX
王立军, 宁永强, 秦莉, 等. 大功率半导体激光器研究进展[J]. 发光学报, 2015, 36(1):1-19. WANG L J, NING Y Q, QIN L, et al.. Development of high power diode laser[J]. Chin. J. Lumin., 2015, 36(1):1-19. (in Chinese)
周泽鹏, 薄报学, 高欣, 等. 基于ZEMAX高功率半导体激光器光纤耦合设计[J]. 发光学报, 2013, 34(9):1208-1212. ZHOU Z P, BO B X, GAO X, et al.. Fiber coupling design of high power semiconductor laser based on ZEMAX[J].Chin.J. Lumin., 2013, 34(9):1208-1212. (in Chinese)
陈少武, 韩勤, 胡传贤, 等. 大功率半导体激光器光纤耦合模块的耦合光学系统[J]. 半导体学报, 2001, 22(12):1572-1576. CHEN S W, HAN Q, HU C X, et al.. Two practical fiber coupling optical systems for high power fiber-coupled laser diodes module[J]. Chin. J. Semicond., 2001, 22(12):1572-1576. (in Chinese)
王立军, 彭航宇, 张俊. 大功率半导体激光合束进展[J]. 中国光学, 2015, 8(4):517-534. WANG L J, PENG H Y, ZHANG J. Advance on high power diode laser coupling[J]. Chin. Opt., 2015, 8(4):517-534. (in Chinese)
王鑫, 王翠鸾, 吴霞, 等. GaAs基高功率半导体激光器单管耦合研究[J]. 发光学报, 2015, 36(9):1018-1021. WANG X, WANG C L, WU X, et al.. Coupling research of high power single GaAs Based semiconductor laser[J]. Chin. J. Lumin., 2015, 36(9):1018-1021. (in Chinese)
JIANG X C, LIU R, GAO Y Y, et al.. Packaging of wavelength stabilized 976 nm 100 W 105m NA 0.15 fiber coupled diode lasers[J]. SPIE, 2016, 7854:785403-1-6.
张俊, 彭航宇, 刘云, 等. 三波长合束高亮度半导体激光光源[J]. 中国激光, 2013, 40(4):65-70. ZHANG J, PENG H Y, LIU Y, et al.. High brightness diode laser source based on three-wavelength multiplexing[J]. Chin. J. Lasers, 2013, 40(4):65-70. (in Chinese)
NI Y X, MA X Y, JING H Q, et al.. Finite element analysis of expansion-matched sub-mounts for high-power laser diodes packaging[J]. J. Semicond., 2016, 37(6):064005-1-5.
JING H Q, ZHONG L, NI Y X, et al.. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid thermodynamics[J]. J. Semicond., 2015, 36(10):102006-1-6.
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