C-mount封装激光器热特性分析与热沉结构优化研究

张晓磊; 薄报学; 张哲铭; 顾华欣; 刘力宁; 徐雨萌; 乔忠良; 高欣

doi:10.3788/fgxb20173807.0891

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C-mount封装激光器热特性分析与热沉结构优化研究

器件制备及器件物理 | 更新时间：2020-08-12

- C-mount封装激光器热特性分析与热沉结构优化研究
- Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure
- 发光学报 2017年38卷第7期页码：891-896
- 作者机构：
  
  长春理工大学高功率半导体激光国家重点实验室,吉林长春,130022
- 作者简介：
- 基金信息：
  
  国家自然科学基金（61176048，61177019，61308051）();吉林省科技发展计划（20150203007GX，20160203017GX）();中物院高
- DOI：10.3788/fgxb20173807.0891
  中图分类号： TN248.4
- 纸质出版日期：2017-7-5，
  
  收稿日期：2016-12-15，
  
  修回日期：2017-2-4，
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张晓磊, 薄报学, 张哲铭等. C-mount封装激光器热特性分析与热沉结构优化研究[J]. 发光学报, 2017,38(7): 891-896

ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming etc. Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure[J]. Chinese Journal of Luminescence, 2017,38(7): 891-896
张晓磊, 薄报学, 张哲铭等. C-mount封装激光器热特性分析与热沉结构优化研究[J]. 发光学报, 2017,38(7): 891-896 DOI： 10.3788/fgxb20173807.0891.

ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming etc. Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure[J]. Chinese Journal of Luminescence, 2017,38(7): 891-896 DOI： 10.3788/fgxb20173807.0891.

摘要

为了降低单管半导体激光器的结温、提高器件的散热效果，基于C-mount热沉的热特性分析提出了一种优化的台阶热沉结构，研究了单管激光器结温和腔面侧向温度分布曲线的影响。在热沉温度298 K和连续输出功率10 W的条件下，腔长为1.5 mm的典型C-mount封装结构激光器的结温为343.6 K，热阻为4.6 K/W。通过在典型C-mount热沉中引入台阶结构，使封装激光器的结温降低为333.8 K，热阻减小到3.5 K/W。计算表明，其输出功率可提高近20%。

Abstract

In order to reduce single-tube laser diode junction temperature and improve heat dissipation effects of the device

an optimized step sink structure was come up based on the thermal characteristic analysis of C-mount heat sink. The distribution of junction temperature and the lateral temperature of single-tube lasers were investigated. Under the conditions of the heat sink temperature of 298 K and continuous output power of 10 W

the junction temperature of typical C-mount heat sink package structure with 1.5 mm cavity length and 3 m solder thickness is 343.6 K

and the thermal resistance is 4.6 K/W. By introducing level heat sink structure

the junction temperature of single-tube laser diode is 333.8 K and thermal resistance is 3.5 K/W. Theoretical calculation shows that the output power can be improved nearly 20%.

关键词

焊料厚度热阻结温热沉输出功率

Keywords

solder thicknessthermal resistancejunction temperatureheat sinkoutput power

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