纳米银焊膏烧结大功率LED模块的高温可靠性研究

陈佳; 李欣; 孔亚飞; 梅云辉; 陆国权

doi:10.3788/fgxb20163709.1159

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纳米银焊膏烧结大功率LED模块的高温可靠性研究

发光学应用及交叉前沿 | 更新时间：2020-08-12

- 纳米银焊膏烧结大功率LED模块的高温可靠性研究
- High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste
- 发光学报 2016年37卷第9期页码：1159-1165
- 作者机构：
  
  1. 天津大学材料科学与工程学院天津,300072
  2. 弗吉尼亚理工大学材料科学与工程学院, 弗吉尼亚州蒙哥马利,24060
- 作者简介：
- 基金信息：
  
  天津市自然科学基金青年基金（13JCQNJC02400）资助项目()
- DOI：10.3788/fgxb20163709.1159
  中图分类号： TN312.8
- 纸质出版日期：2016-9-5，
  
  收稿日期：2016-4-5，
  
  修回日期：2016-4-22，
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陈佳, 李欣, 孔亚飞等. 纳米银焊膏烧结大功率LED模块的高温可靠性研究[J]. 发光学报, 2016,37(9): 1159-1165

CHEN Jia, LI Xin, KONG Ya-fei etc. High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste[J]. Chinese Journal of Luminescence, 2016,37(9): 1159-1165
陈佳, 李欣, 孔亚飞等. 纳米银焊膏烧结大功率LED模块的高温可靠性研究[J]. 发光学报, 2016,37(9): 1159-1165 DOI： 10.3788/fgxb20163709.1159.

CHEN Jia, LI Xin, KONG Ya-fei etc. High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste[J]. Chinese Journal of Luminescence, 2016,37(9): 1159-1165 DOI： 10.3788/fgxb20163709.1159.

摘要

介绍了一种加速老化试验模型对LED模块进行寿命预测。分别采用纳米银焊膏、锡银铜焊料、导电银胶作为芯片粘结材料。控制环境温度和正向电流，在特定的时间测量光输出。比较了不同粘接材料及环境温度对LED老化过程的影响，并针对老化过程进行分析推导，建立老化数学模型，对其进行寿命预测。试验结果表明，纳米银焊膏粘接的模块对温度的抗性最好，纳米银焊膏有潜力在未来固态照明、投影和其他高功率器件领域得到应用。

Abstract

A general procedure for accelerated degradation testing (ADT) was presented to predict the lifetime of three kinds of LED modules. The die attach materials of LED modules were nano-silver paste

Sn3Ag0.5Cu (Sn-based alloys)

silver epoxy

respectively. The ambient temperature and forward current were controlled

and the light output at several time points was measured. The degradation mechanism of LEDs modules was analyzed. The lifetimes of LED modules under the condition of different die attach materials were predicted. The test results show that the nano-silver paste is a very promising die-attach material for the aging of multi-chip high power LED modules.

关键词

大功率LED模块粘结材料纳米银焊膏加速老化试验寿命

Keywords

high power LED moduledie attach materialsnano-silver pasteaccelerated degradation testinglifetime

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