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北京工业大学 激光工程研究院 北京,100124
纸质出版日期:2016-4-5,
收稿日期:2015-12-24,
修回日期:2016-1-17,
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贾冠男, 尧舜, 高祥宇等. 热容型大功率半导体激光器瞬态热特性[J]. 发光学报, 2016,37(4): 422-427
JIA Guan-nan, YAO Shun, GAO Xiang-yu etc. Transient Thermal Characteristics of Heat Capacity High Power Diode Lasers[J]. Chinese Journal of Luminescence, 2016,37(4): 422-427
贾冠男, 尧舜, 高祥宇等. 热容型大功率半导体激光器瞬态热特性[J]. 发光学报, 2016,37(4): 422-427 DOI: 10.3788/fgxb20163704.0422.
JIA Guan-nan, YAO Shun, GAO Xiang-yu etc. Transient Thermal Characteristics of Heat Capacity High Power Diode Lasers[J]. Chinese Journal of Luminescence, 2016,37(4): 422-427 DOI: 10.3788/fgxb20163704.0422.
为研究热容型大功率半导体激光器在低环境温度、高瞬时功率、长工作间歇时间条件下的应用
建立三维瞬态热传导模型
通过有限元法计算得出热沉三维尺寸对半导体激光器瞬态热特性的影响。选取尺寸为26.6 mm11.5 mm4 mm的热沉进行热容型半导体激光器的封装测试
获得其在-20 ℃和-30 ℃环境温度下连续工作3.5 s过程中有源区温度随时间的变化曲线
并与数值计算的结果进行对比。结果表明
两者在误差范围内能够很好地吻合。
To investigate the application of heat capacity high power diode lasers under the condition of low temperature
high transient power and long interval working time
a 3-D transient thermal model was established. By adopting the finite element analysis
the effect of 3-D sizes of the heat sink on the transient thermal characteristics of diode laser was calculated successfully. According to the simulation results
the heat sink with dimension of 26.6 mm11.5 mm4 mm was chosen to package the heat capacity diode laser
and the experiments of the diode laser working 3.5 s continuously under -20 ℃ and -30 ℃ were carried out respectively. Eventually
the temperature curves of the active region were obtained and demonstrated a good consistence with the simulation results.
激光器半导体激光器热容型瞬态热特性
laserdiode laserheat capacitytransient thermal characteristic
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