高温硬焊料准连续半导体激光器巴条叠阵的性能研究

江先锋; 张丽芳; 郭栓银; 李江

doi:10.3788/fgxb20153605.0563

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高温硬焊料准连续半导体激光器巴条叠阵的性能研究

器件制备及器件物理 | 更新时间：2020-08-12

- 高温硬焊料准连续半导体激光器巴条叠阵的性能研究
- Research on Performance of High Temperature Hard Solder Diode Laser Array
- 发光学报 2015年36卷第5期页码：563-566
- 作者机构：
  
  中国科学院苏州生物医学工程技术研究所半导体光电子技术研究室,江苏苏州,215163
- 作者简介：
- 基金信息：
  
  国家863计划()();苏州市科技发展技术项目(SH2014024)资助()
- DOI：10.3788/fgxb20153605.0563
  中图分类号： TN248.4
- 纸质出版日期：2015-5-3，
  
  网络出版日期：2015-4-2，
  
  收稿日期：2014-12-12，
  
  修回日期：2015-3-14，
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江先锋, 张丽芳, 郭栓银等. 高温硬焊料准连续半导体激光器巴条叠阵的性能研究[J]. 发光学报, 2015,36(5): 563-566

JIANG Xian-feng, ZHANG Li-fang, GUO Shuan-yin etc. Research on Performance of High Temperature Hard Solder Diode Laser Array[J]. Chinese Journal of Luminescence, 2015,36(5): 563-566
江先锋, 张丽芳, 郭栓银等. 高温硬焊料准连续半导体激光器巴条叠阵的性能研究[J]. 发光学报, 2015,36(5): 563-566 DOI： 10.3788/fgxb20153605.0563.

JIANG Xian-feng, ZHANG Li-fang, GUO Shuan-yin etc. Research on Performance of High Temperature Hard Solder Diode Laser Array[J]. Chinese Journal of Luminescence, 2015,36(5): 563-566 DOI： 10.3788/fgxb20153605.0563.

摘要

以巴条叠阵结构及封装方法为基础

研制了一组高温硬焊料准连续半导体激光器巴条叠阵

并研究了其相关的光电性能和寿命特征。结果表明

所研制的器件在200 A的工作电流下

重复频率250 Hz、脉宽200 s时

单巴峰值功率

200 W

50%光谱宽度

3 nm

电光转换效率

50%

寿命达到4.7110

shots时的功率衰减

15%;当工作电流为150 A时

预期寿命高达1.510

shots。

Abstract

Based on the stack array of structure and assembly methods

a set of high temperature and hard solder quasi-continuous laser diode stack arrays were developed

and the related photo-electric performance and lifetime characteristics were studied. When the stack array is in condition of operating current 200 A

repetition frequency 250 Hz

pulse width 200 s

the FWHM is less than 3 nm

electro-optical conversion efficiency is more than 50%

peak power per bar is more than 200 W

lifetime is up to 4.7110

shots

and the peak power degradation is less than 15%. When the operating current is 150 A

the lifetime is up to 1.510

shots.

关键词

半导体激光器叠阵硬焊料准连续

Keywords

diode laser arrayhard solderQCW

references

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Liu X S, Davis R W, Hughes L C, et al. A study on the reliability of indium solder die bonding of high power semiconductor lasers [J]. J. Appl. Phys., 2006, 100(1):103104-1-6.

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