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陕西科技大学 电气与信息工程学院,陕西 西安,710021
纸质出版日期:2012-9-10,
收稿日期:2012-4-12,
修回日期:2012-5-25,
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胡长奇, 张方辉, 张静. 新型白光LED的光谱特性和相关结温特性[J]. 发光学报, 2012,33(9): 939-943
HU Chang-qi, ZHANG Fang-hui, ZHANG Jing. The Spectral and Junction Temperature Properties of New White Light LED[J]. Chinese Journal of Luminescence, 2012,33(9): 939-943
胡长奇, 张方辉, 张静. 新型白光LED的光谱特性和相关结温特性[J]. 发光学报, 2012,33(9): 939-943 DOI: 10.3788/fgxb20123309.0939.
HU Chang-qi, ZHANG Fang-hui, ZHANG Jing. The Spectral and Junction Temperature Properties of New White Light LED[J]. Chinese Journal of Luminescence, 2012,33(9): 939-943 DOI: 10.3788/fgxb20123309.0939.
利用蓝光LED芯片激发[Ru(dtb-bpy)
3
]
2+
(PF
6
-
)
2
和YAG混合荧光粉的方法制备了新型白光LED
研究了随着[Ru(dtb-bpy)
3
]
2+
(PF
6
-
)
2
含量的增加而引起的白光LED光谱特性的变化。当[Ru(dtb-bpy)
3
]
2+
(PF
6
-
)
2
的质量分数为1.5%时
白光LED的显色指数达到83.2
效率相对于其含量为0%时下降了约20%。另外
研究了结温对于一体化封装的该新型白光LED发光特性的影响
结果表明:高显色LED的结温从30 ℃上升到130 ℃的过程中
芯片的蓝光辐射出现了较大幅度的减少
共降低了27.73%
随之也导致该白光LED总发光强度的衰减
而且其发光效率出现了大幅度的下降
共衰减了31.76%
但是其显色性没有明显的变化。
A new white LED was fabricated by irradiated the mixed fluorescent powder which contained [Ru(dtb-bpy)
3
]
2+
(PF
6
-
)
2
and YAG. The relationship between white LED' spectral and the [Ru(dtb-bpy)
3
]
2+
(PF
6
-
)
2
content were investigated. When the mass fraction of [Ru(dtb-bpy)
3
]
2+
(PF
6
-
)
2
was 1.5%
the White LED color-rending index reached 83.2 and its luminous efficiency was about 20% lower than those without [Ru(dtb-bpy)
3
]
2+
(PF
6
-
)
2
. Moreover
we studied the influence of junction temperature on the luminous properties of the integration package white LED. The results showed that the blue chip radiation reduced about 27.73% during LED's junction temperature rising from 30 ℃ to 130 ℃. The white LED light intensity decreased and the luminous efficiency reduced 31.76%
while the color-rending was stability.
显色性磷光材料[Ru(dtb-bpy)3]2+(PF6-)2有机材料结温
color-rendingphosphorescent[Ru(dtb-bpy)3]2+(PF6-)2organic materialjunction temperature
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Li X M, Tao C Y, Kong L F, et al. Crystal structure and luminescence properties of (Y3-x-yREx)Al5O12∶Cey(RE=Tb,Gd) phosphor [J]. Journal of Function Materials (功能材料), 2008, 39(1):16-19 (in Chinese).
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