Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

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Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging

Luminescence Industry and Technology Frontier | Updated：2022-08-01

- Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging Cover Article Enhanced Publication
- Chinese Journal of Luminescence Vol.43, Issue 7, (2022)
- Affiliations：
  
  School of Mechanical Science and Engineering， Huazhong University of Science and Technology,Wuhan,China,430074;School of Aerospace Engineering， Huazhong University of Science and Technology,Wuhan,China,430074
- Author bio：
- Funds：
  
  Key Research and Development Project of Hubei Province(2021BAA213;2020BAB068;2021BAA071)
- DOI：10.37188/CJL.20220084 CLC： TN312.8
- Published：05 July 2022，
  
  Published Online：，
  
  Received：11 March 2022，
  
  Revised：31 March 2022，
  
  Accepted：
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Cite this article
王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-114610.37188/CJL.20220084.

WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-114610.37188/CJL.20220084.
王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-114610.37188/CJL.20220084. DOI： 10.37188/CJL.20220084.

WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-114610.37188/CJL.20220084. DOI： 10.37188/CJL.20220084.

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Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging Cover Article Enhanced Publication