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Published:05 July 2022,
Received:11 March 2022,
Revised:31 March 2022,
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王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-1146.
WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-1146.
王哲,王永通,刘佳欣等.内嵌陶瓷电路板的PCB基板制备及其LED封装性能[J].发光学报,2022,43(07):1139-1146. DOI: 10.37188/CJL.20220084.
WANG Zhe,WANG Yong-tong,LIU Jia-xin,et al.Preparation of PCB Substrate Embedded with Ceramic Circuit Board and Performance of LED Packaging[J].Chinese Journal of Luminescence,2022,43(07):1139-1146. DOI: 10.37188/CJL.20220084.
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