荧光玻璃封装芯片级白光LED光热性能 增强出版

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"text", "data": "(1988-)，男，湖北孝感人，博士，副研究员，硕士研究生导师，2017年于华中科技大学获得博士学位，主要从事微纳制造与电子封装的研究。E-mail: " }, { "name": "text", "data": "lijj@siat.ac.cn" } ] ] } ], "email": "lijj@siat.ac.cn", "deceased": false }, { "name": [ { "lang": "zh", "surname": "史", "givenname": "铁林", "namestyle": "eastern", "prefix": "" }, { "lang": "en", "surname": "SHI", "givenname": "Tie-lin", "namestyle": "eastern", "prefix": "" } ], "stringName": [], "aff": [ { "rid": "aff1", "text": "1" } ], "role": [], "deceased": false } ], "aff": [ { "id": "aff1", "intro": [ { "lang": "zh", "label": "1", "text": "华中科技大学　机械科学与工程学院，湖北　武汉　430074", "data": [ { "name": "text", "data": "华中科技大学　机械科学与工程学院，湖北　武汉　430074" } ] }, { "lang": "en", "label": "1", "text": "School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China", "data": [ { "name": "text", "data": "School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China" } ] } ] }, { "id": "aff2", "intro": [ { "lang": "zh", "label": "2", "text": "华中科技大学　航空航天学院，湖北　武汉　430074", "data": [ { "name": "text", "data": "华中科技大学　航空航天学院，湖北　武汉　430074" } ] }, { "lang": "en", "label": "2", "text": "School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan 430074, China", "data": [ { "name": "text", "data": "School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan 430074, China" } ] } ] }, { "id": "aff3", "intro": [ { "lang": "zh", "label": "3", "text": "中国科学院　深圳先进技术研究院，广东　深圳　518055", "data": [ { "name": "text", "data": "中国科学院　深圳先进技术研究院，广东　深圳　518055" } ] }, { "lang": "en", "label": "3", "text": "Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China", "data": [ { "name": "text", "data": "Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China" } ] } ] } ] }, "abstracts": [ { "lang": "zh", "data": [ { "name": "p", "data": [ { "name": "text", "data": "芯片级封装是实现高光密度白光LED和减小封装体积的一种重要途径，而目前芯片级白光LED存在荧光层老化、荧光粉热猝灭等问题，严重影响白光LED的性能和可靠性。为此，本文结合荧光玻璃的技术优势，提出了荧光玻璃封装芯片级白光LED，并分析了白光LED光热性能。利用丝网印刷和低温烧结工艺在玻璃基片表面制备了荧光玻璃层，从而获得了晶圆级荧光玻璃片，再切割成芯片级荧光玻璃用于白光LED封装。分析了荧光玻璃层的微观形貌，荧光粉颗粒内嵌在玻璃基体中，膜层致密、无明显残余气孔；通过调节荧光玻璃层厚度优化了白光LED光学性能，当荧光玻璃层为120 μm时，白光LED获得了最优光学性能，光效、色温和色坐标分别为111.8 lm/W、6 876 K和(0.307 4,0.321 4)；分析了荧光玻璃封装结构对白光LED光热性能的影响，荧光玻璃层靠近LED芯片封装具有更高的光效和更低的色温，同时白光LED表面温度更低。" } ] } ] }, { "lang": "en", "data": [ { "name": "p", "data": [ { "name": "text", "data": "Chip-scale packaging(CSP) is an important way to realize a white LED with high optical density and reduce its package size. However, chip-scale white LED has the problems of the aging of phosphor layer and the thermal quenching of phosphor, which seriously affect the performance and reliability of white LED. Herein, combined with the technical advantages of PiG, we proposed a phosphor-in-glass(PiG) packaged chip-scale white LED, and analyzed the photothermal performance of white LED. The PiG layer was prepared on the surface of glass substrate with the process of screen printing and low-temperature sintering, and then the PiG was cut into the chip-scale PiG for white LED packaging. The microscopic morphology of PiG was analyzed. The phosphor particles were embedded in the glass matrix, and the film layer displays a dense structure with no obvious residual pores. The optical properties of white LED were optimized by adjusting the thickness of PiG layer. When the thickness of PiG layer is 120 μm, the related luminous efficiency(LE), correlated color temperature(CCT), and chromaticity coordinate are 111.8 lm/W, 6 876 K, and (0.307 4, 0.321 4), respectively. The effect of PiG packaging structure on the photothermal performance of white LED was analyzed. The PiG layer close to LED chip packaging has higher LE and lower CCT, while the surface temperature of white LED is lower." } ] } ] } ], "keyword": [ { "lang": "zh", "data": [ [ { "name": "text", "data": "白光LED" } ], [ { "name": "text", "data": "芯片级封装" } ], [ { "name": "text", "data": "荧光玻璃" } ], [ { "name": "text", "data": "光热性能" } ] ] }, { "lang": "en", "data": [ [ { "name": "text", "data": "white LED" } ], [ { "name": "text", "data": "chip-scale packaging" } ], [ { "name": "text", "data": "phosphor-in-glass" } ], [ { "name": "text", "data": "photothermal performance" } ] ] } ], "highlights": [], "body": [ { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "1" } ], "title": [ { "name": "text", "data": "引言" } ], "level": "1", "id": "s1" } }, { "name": "p", "data": [ { "name": "text", "data": "LED由于其发光效率高、寿命长、无污染、结构紧凑等优点，在照明和显示领域中有着广泛的应用" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "1", "type": "bibr", "rid": "R1", "data": [ { "name": "text", "data": "1" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "4", "type": "bibr", "rid": "R4", "data": [ { "name": "text", "data": "4" } ] } } ], "rid": [ "R1", "R2", "R3", "R4" ], "text": "1-4", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。目前主流白光LED光源是荧光转换白光LED(pc-WLED)，主要是采用蓝色LED芯片激发黄色荧光层形成黄光，蓝光和黄光混合形成白光" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "5", "type": "bibr", "rid": "R5", "data": [ { "name": "text", "data": "5" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "8", "type": "bibr", "rid": "R8", "data": [ { "name": "text", "data": "8" } ] } } ], "rid": [ "R5", "R6", "R7", "R8" ], "text": "5-8", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。随着人们对高亮度照明的需求不断增加，LED技术逐渐向着大功率封装形式发展，目前主要包括多芯片集成的板上芯片封装(Chip-on-board,CoB)和高光密度的芯片级封装(Chip-scale packaging,CSP)" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "9", "type": "bibr", "rid": "R9", "data": [ { "name": "text", "data": "9" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "10", "type": "bibr", "rid": "R10", "data": [ { "name": "text", "data": "10" } ] } } ], "rid": [ "R9", "R10" ], "text": "9-10", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。虽然通过多芯片集成能够提高LED光功率，但板上芯片封装会增加工艺步骤、结构尺寸和制造成本。与此同时，芯片级封装具有功率密度高、热阻低、尺寸小和工艺集成度高等优点，是目前常用的高功率密度封装技术，已广泛应用于汽车大灯、室外照明等领域的白光LED封装" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "11", "type": "bibr", "rid": "R11", "data": [ { "name": "text", "data": "11" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "12", "type": "bibr", "rid": "R12", "data": [ { "name": "text", "data": "12" } ] } } ], "rid": [ "R11", "R12" ], "text": "11-12", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。" } ] }, { "name": "p", "data": [ { "name": "text", "data": "芯片级封装一般是指封装尺寸不大于芯片尺寸的1.2倍" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "xref", "data": { "text": "13", "type": "bibr", "rid": "R13", "data": [ { "name": "text", "data": "13" } ] } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。目前，荧光转换材料或荧光层决定了芯片级白光LED光热性能。其中荧光硅胶(Phosphor-in-silicone,PiS)是一种简单、高效的荧光转换材料，通过在LED芯片的表面直接涂覆一层荧光硅胶就可以获得芯片级封装的白光LED" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "xref", "data": { "text": "14", "type": "bibr", "rid": "R14", "data": [ { "name": "text", "data": "14" } ] } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。然而，由于LED芯片产生的热量和荧光粉荧光转换产生的热量相对较大，热量直接传递到荧光硅胶层，造成荧光硅胶层出现严重的热积累和热聚集现象" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "xref", "data": { "text": "15", "type": "bibr", "rid": "R15", "data": [ { "name": "text", "data": "15" } ] } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。此外，由于荧光硅胶耐热性差、热导率低，使得白光LED长时间工作中出现荧光粉热猝灭和硅胶老化或碳化，导致白光LED发生不可逆转的性能退化" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "16", "type": "bibr", "rid": "R16", "data": [ { "name": "text", "data": "16" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "17", "type": "bibr", "rid": "R17", "data": [ { "name": "text", "data": "17" } ] } } ], "rid": [ "R16", "R17" ], "text": "16-17", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。为此，研究者采用高热稳定的无机荧光转换材料代替有机荧光树脂材料，其中荧光玻璃(Phosphor-in-glass,PiG)是一种简单、有效的无机荧光转换材料，不仅保留了荧光粉的发光特性，还拥有玻璃材料的耐热性" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "18", "type": "bibr", "rid": "R18", "data": [ { "name": "text", "data": "18" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "21", "type": "bibr", "rid": "R21", "data": [ { "name": "text", "data": "21" } ] } } ], "rid": [ "R18", "R19", "R20", "R21" ], "text": "18-21", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。与发光单晶、荧光陶瓷等无机荧光转换材料相比，荧光玻璃具有制备工艺简单、发光特性可调、成本低、易批量化等优点" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "22", "type": "bibr", "rid": "R22", "data": [ { "name": "text", "data": "22" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "24", "type": "bibr", "rid": "R24", "data": [ { "name": "text", "data": "24" } ] } } ], "rid": [ "R22", "R23", "R24" ], "text": "22-24", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。相对于有机荧光树脂封装，荧光玻璃封装显著提高了白光LED可靠性，且通过控制工艺参数调节了荧光玻璃发光特性" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "blockXref", "data": { "data": [ { "name": "xref", "data": { "text": "25", "type": "bibr", "rid": "R25", "data": [ { "name": "text", "data": "25" } ] } }, { "name": "text", "data": "-" }, { "name": "xref", "data": { "text": "26", "type": "bibr", "rid": "R26", "data": [ { "name": "text", "data": "26" } ] } } ], "rid": [ "R25", "R26" ], "text": "25-26", "type": "bibr" } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。但是，目前荧光玻璃封装仍采用传统远程荧光粉技术，首先在封装基板上完成芯片固晶和打线，然后利用粘结材料实现单片荧光玻璃与封装基板间的粘结，整个封装工艺集成度低，封装成本高" }, { "name": "sup", "data": [ { "name": "text", "data": "[" }, { "name": "xref", "data": { "text": "27", "type": "bibr", "rid": "R27", "data": [ { "name": "text", "data": "27" } ] } }, { "name": "text", "data": "]" } ] }, { "name": "text", "data": "。此外，很少有报道将荧光玻璃用于芯片级白光LED，且对其光热性能未做相关研究。" } ] }, { "name": "p", "data": [ { "name": "text", "data": "本文提出荧光玻璃封装芯片级白光LED，通过结合丝网印刷和低温烧结技术在玻璃基片上制备出荧光玻璃层，再通过激光切割获得芯片级荧光玻璃用于白光LED封装。系统分析了荧光玻璃膜厚度和封装结构对白光LED光热性能的影响，获得了最优光学性能的芯片级封装白光LED。" } ] } ] }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "2" } ], "title": [ { "name": "text", "data": "实验" } ], "level": "1", "id": "s2" } }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "2.1" } ], "title": [ { "name": "text", "data": "荧光玻璃制备及其芯片级白光LED封装" } ], "level": "2", "id": "s2a" } }, { "name": "p", "data": [ { "name": "xref", "data": { "text": "图1", "type": "fig", "rid": "F1", "data": [ { "name": "text", "data": "图1" } ] } }, { "name": "text", "data": "表示了荧光玻璃制备工艺及其封装流程。首先将黄色荧光粉(Y" }, { "name": "sub", "data": [ { "name": "text", "data": "3" } ] }, { "name": "text", "data": "Al" }, { "name": "sub", "data": [ { "name": "text", "data": "5" } ] }, { "name": "text", "data": "O" }, { "name": "sub", "data": [ { "name": "text", "data": "12" } ] }, { "name": "text", "data": "∶Ce" }, { "name": "sup", "data": [ { "name": "text", "data": "3+" } ] }, { "name": "text", "data": ",YAG,Intematix,USA)、低温硅硼酸盐玻璃粉(B" }, { "name": "sub", "data": [ { "name": "text", "data": "2" } ] }, { "name": "text", "data": "O" }, { "name": "sub", "data": [ { "name": "text", "data": "3" } ] }, { "name": "text", "data": "-SiO" }, { "name": "sub", "data": [ { "name": "text", "data": "2" } ] }, { "name": "text", "data": "-ZnO，自制，玻璃化转变温度为520 ℃)和有机溶剂(松节油透醇-乙基纤维素(32∶1.7)，国药集团化学试剂有限公司)充分混合获得荧光玻璃浆料，荧光粉和玻璃粉质量比为2∶3；然后采用丝网印刷工艺将该浆料均匀印刷在玻璃基片(硼硅酸盐玻璃，20 mm×20 mm×0.5 mm)上，并通过调节印刷次数来控制荧光玻璃膜层厚度；再将印刷后的玻璃基片放入马弗炉中，在600 ℃烧结30 min后自然冷却至室温，从而制备出晶圆级(大尺寸)荧光玻璃片；最后通过激光切割将该荧光玻璃片切割成芯片级荧光玻璃。通过调节印刷次数获得了5种不同膜厚的荧光玻璃，分别命名为PiG1、PiG2、PiG3、PiG4和PiG5。通过这种方法实现了芯片级荧光玻璃的简单、大规模制备，满足芯片级白光LED封装需求。在白光LED封装时，采用直接电镀陶瓷(Direct plated ceramic,DPC)基板作为封装基板，单颗倒装蓝光LED芯片(1.5 mm×1.5 mm×0.5 mm)通过金锡倒装共晶工艺贴装在DPC基板上，并采用高耐热透明硅胶(MS-1002,DOW CORNING,USA)将荧光玻璃粘附在LED芯片上表面，从而得到荧光玻璃封装芯片级白光LED(PiG-CSP-WLED)，并对比分析了荧光玻璃封装结构(荧光玻璃膜层位置)对LED光热性能的影响。" } ] }, { "name": "fig", "data": { "id": "F1", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图1" } ], "title": [ { "name": "text", "data": "荧光玻璃制备及其芯片级白光LED封装工艺流程" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 1" } ], "title": [ { "name": "text", "data": "Fabrication process of PiG and its CSP-WLED packaging process" } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919544&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919550&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919547&type=" } ] } } ] }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "2.2" } ], "title": [ { "name": "text", "data": "性能表征" } ], "level": "2", "id": "s2b" } }, { "name": "p", "data": [ { "name": "text", "data": "采用SEM(Scanning electronic microscope, Nova Nano SEM 450,FEI)表征荧光玻璃微观形貌；采用超景深三维显微镜(KEYENCE,VHX-1000,Japan)观测荧光玻璃厚度和芯片级白光LED结构；通过LED 自动温控光电分析测量系统测试(杭州远方光电信息股份有限公司，ATA-1000)分析白光LED光学性能，包括发射光谱(Electroluminescence,EL)、光效(Luminous efficiency,LE)、色温(Correlated color temperature,CCT)和CIE色坐标，并采用红外热像仪(FLIR,E63,USA)测试白光LED表面工作温度。" } ] } ] } ] }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "3" } ], "title": [ { "name": "text", "data": "结果与讨论" } ], "level": "1", "id": "s3" } }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "3.1" } ], "title": [ { "name": "text", "data": "荧光玻璃及其微观形貌" } ], "level": "2", "id": "s3a" } }, { "name": "p", "data": [ { "name": "xref", "data": { "text": "图2", "type": "fig", "rid": "F2", "data": [ { "name": "text", "data": "图2" } ] } }, { "name": "text", "data": "为制备的晶圆级荧光玻璃和切割后的芯片级荧光玻璃。荧光玻璃呈现黄色，晶圆级尺寸为20 mm×20 mm，芯片级尺寸为1.5 mm×1.5 mm。由于受到荧光粉颗粒的散射作用，荧光玻璃透明度明显降低。" }, { "name": "xref", "data": { "text": "图3(a)", "type": "fig", "rid": "F3", "data": [ { "name": "text", "data": "图3(a)" } ] } }, { "name": "text", "data": "为荧光玻璃的SEM图。荧光粉颗粒均匀分布于玻璃基体中，无团聚现象。此外，荧光粉颗粒与玻璃基体间没有明显的气孔缺陷，界面清晰且无界面相物质，这是由于玻璃粉在烧结过程中会发生粘性流动，可有效填充荧光粉颗粒间空隙，从而得到相对致密的荧光玻璃。" }, { "name": "xref", "data": { "text": "图3(b)~(f)", "type": "fig", "rid": "F3", "data": [ { "name": "text", "data": "图3(b)~(f)" } ] } }, { "name": "text", "data": "为不同厚度荧光玻璃的光学照片。荧光玻璃厚度随印刷次数增加而增大，且荧光玻璃表面平整度和一致性随着荧光玻璃厚度增加而得到提升。当印刷次数从1增加到5时(PiG1~PiG5)，荧光玻璃厚度从31 μm增加到152 μm，且每次印刷厚度约为30 μm。" }, { "name": "xref", "data": { "text": "图3(g)~(j)", "type": "fig", "rid": "F3", "data": [ { "name": "text", "data": "图3(g)~(j)" } ] } }, { "name": "text", "data": "为荧光玻璃横截面的EDS能谱图，可以看出玻璃基片与荧光玻璃层之间的界面清晰。EDS的成分确认了YAG荧光粉的成分，有Y、Al、O元素。" }, { "name": "xref", "data": { "text": "图4", "type": "fig", "rid": "F4", "data": [ { "name": "text", "data": "图4" } ] } }, { "name": "text", "data": "为烧结前荧光粉和烧结后的荧光玻璃的XRD测试结果，其中荧光粉的特征峰并未发生改变，说明其在烧结过程中，YAG荧光粉的晶体结构没有被破坏。外量子效率(External quantum efficiency,EQE)是荧光玻璃的关键性能指标之一，其数值为出射光子数与入射光子数之比。出射光子可由白光LED在490~750 nm发光强度的积分计算得到，入射光子可通过蓝光LED蓝光强度的积分计算得到。本文中制备的荧光玻璃的外量子效率为71%，其稍有下降是因为高温烧结过程中荧光粉存在热、化学降解。" } ] }, { "name": "fig", "data": { "id": "F2", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图2" } ], "title": [ { "name": "text", "data": "(a)晶圆级荧光玻璃实物图；(b)芯片级荧光玻璃实物图。" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 2" } ], "title": [ { "name": "text", "data": "(a)Picture of wafer-scale PiG. (b)Picture of chip-scale PiG." } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919553&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919559&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919556&type=" } ] } }, { "name": "fig", "data": { "id": "F3", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图3" } ], "title": [ { "name": "text", "data": "(a)荧光玻璃的SEM图；(b)～(f)不同厚度荧光玻璃的横截面光学照片(PiG1～PiG5);(g)～(j)荧光玻璃截面EDS mapping图。" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 3" } ], "title": [ { "name": "text", "data": "(a)Top-view SEM image of PiG film. (b)-(f)Cross-section optical pictures of PiG with different film thicknesses. (g)-(j)Cross-section EDS mapping image of PiG." } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919562&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919569&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919565&type=" } ] } }, { "name": "fig", "data": { "id": "F4", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图4" } ], "title": [ { "name": "text", "data": "荧光粉和荧光玻璃的XRD图" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 4" } ], "title": [ { "name": "text", "data": "XRD images of phosphor and PiG" } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919573&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919580&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919575&type=" } ] } } ] }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "3.2" } ], "title": [ { "name": "text", "data": "荧光玻璃封装芯片级白光LED光学性能优化" } ], "level": "2", "id": "s3b" } }, { "name": "p", "data": [ { "name": "xref", "data": { "text": "图5(a)", "type": "fig", "rid": "F5", "data": [ { "name": "text", "data": "图5(a)" } ] } }, { "name": "text", "data": "为不同厚度荧光玻璃封装芯片级白光LED的光效和色温图。在350 mA电流驱动下，LED的光效随荧光玻璃厚度增加而出现先增大后减小的趋势。当荧光玻璃厚度从31 μm增加到120 μm时，LED的光效从84.45 lm/W增加到111.79 lm/W；当厚度继续增加到152 μm,LED的光效则降低至108.41 lm/W。这是由于随着YAG∶Ce" }, { "name": "sup", "data": [ { "name": "text", "data": "3+" } ] }, { "name": "text", "data": "荧光粉含量的增加，更多的蓝光被吸收并转化为黄色光，黄色发光强度增大，如" }, { "name": "xref", "data": { "text": "图5(b)", "type": "fig", "rid": "F5", "data": [ { "name": "text", "data": "图5(b)" } ] } }, { "name": "text", "data": "所示，从而表现出LED光效的提升。当荧光玻璃厚度继续增大，发光饱和与荧光转换耗损加剧，出射光线被荧光玻璃吸收，致使光效出现小幅度降低。此外，LED色温随着荧光玻璃厚度增加而逐渐降低，黄光强度逐渐增加，色坐标也从蓝白色逐渐变到冷白色，最后直至暖白色(如" }, { "name": "xref", "data": { "text": "图6", "type": "fig", "rid": "F6", "data": [ { "name": "text", "data": "图6" } ] } }, { "name": "text", "data": ")。综合考虑光效和色温性能，荧光玻璃厚度为120 μm时，芯片级白光LED的光学性能更优，光效、色温和色坐标分别为111.79 lm/W、6 876 K和(0.307 4,0.321 4)，发出的白光更接近普朗克轨迹。" } ] }, { "name": "fig", "data": { "id": "F5", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图5" } ], "title": [ { "name": "text", "data": "不同厚度荧光玻璃封装芯片级白光LED的光效/色温图(a)和发射光谱(b)" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 5" } ], "title": [ { "name": "text", "data": "LE and CCT spectra(a) and EL spectra(b) of CSP-WLEDs with different PiG film thicknesses" } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919584&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919591&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919587&type=" } ] } }, { "name": "fig", "data": { "id": "F6", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图6" } ], "title": [ { "name": "text", "data": "不同厚度荧光玻璃封装芯片级白光LED的色坐标变化" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 6" } ], "title": [ { "name": "text", "data": "CIE chromaticity coordinates of CSP-WLEDs with different PiG film thicknesses" } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919593&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919601&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919597&type=" } ] } } ] }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "3.3" } ], "title": [ { "name": "text", "data": "荧光玻璃封装结构对LED的光热性能影响" } ], "level": "2", "id": "s3c" } }, { "name": "p", "data": [ { "name": "text", "data": "为了分析荧光玻璃封装结构对芯片级白光LED光学和热学性能的影响，将荧光玻璃分别向上(PiG-up)和向下(PiG-down)贴装在LED芯片上表面，如" }, { "name": "xref", "data": { "text": "图7", "type": "fig", "rid": "F7", "data": [ { "name": "text", "data": "图7" } ] } }, { "name": "text", "data": "所示。当封装结构为PiG-up时， 玻璃衬底被粘接在LED芯片上表面，荧光玻璃朝外，远离LED芯片表面；当封装结构为PiG-down时，荧光玻璃被粘接在LED芯片上表面，玻璃衬底朝外。" } ] }, { "name": "fig", "data": { "id": "F7", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图7" } ], "title": [ { "name": "text", "data": "(a)、(c)荧光玻璃向上的光学实物图；(b)、(d)荧光玻璃向下的光学实物图。" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 7" } ], "title": [ { "name": "text", "data": "(a), (c)Photographs of the PiG-up CSP-WLED. (b), (d) Photographs of the PiG-down CSP-WLED." } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919605&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919610&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919607&type=" } ] } }, { "name": "p", "data": [ { "name": "xref", "data": { "text": "图8(a)、(b)", "type": "fig", "rid": "F8", "data": [ { "name": "text", "data": "图8(a)、(b)" } ] } }, { "name": "text", "data": "分别表示了PiG-up和PiG-down封装芯片级白光LED光效和色温与驱动电流的关系。当驱动电流从200 mA增加到1 200 mA时，PiG-up封装的芯片级白光LED的光效从90.88 lm/W降低到66.17 lm/W，色温则一直处于非理想区间，从31 840 K增加到74 560 K，色温变化高达42 720 K;PiG-down封装的芯片级白光LED的光效从110.81 lm/W下降到81.88 lm/W，色温则从6 642 K逐渐增加到6 984 K，色温变化仅为342 K。因此，PiG-down封装结构比PiG-up封装结构更适合芯片级白光LED封装，能获得更高的光效和稳定的色温。这是由于PiG-down封装结构与LED芯片紧密相连，大幅度降低了蓝光从玻璃衬底侧壁泄露的风险，使得更多的蓝光被黄色荧光粉吸收，增加了黄光发光强度，如" }, { "name": "xref", "data": { "text": "图8(c)", "type": "fig", "rid": "F8", "data": [ { "name": "text", "data": "图8(c)" } ] } }, { "name": "text", "data": "所示。" }, { "name": "xref", "data": { "text": "图8(d)", "type": "fig", "rid": "F8", "data": [ { "name": "text", "data": "图8(d)" } ] } }, { "name": "text", "data": "为最高表面温度与驱动电流的关系，测试时间为LED点亮1 min时。最高表面温度随着驱动电流增加而升高，但PiG-down封装结构的最高表面温度明显低于PiG-up封装结构。这是由于荧光玻璃在蓝光LED激发下会产生大量的热，使得荧光玻璃温度快速上升，玻璃衬底热导率较低，难以将荧光玻璃内部产生的热及时传导到芯片上，再通过陶瓷基板耗散掉。" } ] }, { "name": "fig", "data": { "id": "F8", "caption": [ { "lang": "zh", "label": [ { "name": "text", "data": "图8" } ], "title": [ { "name": "text", "data": "荧光玻璃封装结构与芯片级白光LED的((a)荧光朝外，(b)荧光朝内)光效/色温、发射光谱(c)和最高表面温度(d)的关系。" } ] }, { "lang": "en", "label": [ { "name": "text", "data": "Fig. 8" } ], "title": [ { "name": "text", "data": "LE and CCT of the PiG-up(a) and PiG-down(b) CSP-WLEDs under various currents. (c)EL spectra of PiG CSP-WLEDs at the current of 1 000 mA. (d)Maximum temperatures of the PiG-up and PiG-down CSP-WLEDs under various currents after 1 min." } ] } ], "subcaption": [], "note": [], "graphics": [ { "print": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919612&type=", "small": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919615&type=", "big": "http://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=22919614&type=" } ] } } ] } ] }, { "name": "sec", "data": [ { "name": "sectitle", "data": { "label": [ { "name": "text", "data": "4" } ], "title": [ { "name": "text", "data": "结论" } ], "level": "1", "id": "s4" } }, { "name": "p", "data": [ { "name": "text", "data": "本文提出了荧光玻璃封装芯片级白光LED，并分析了白光LED光热性能。通过在玻璃衬底上印刷和烧结荧光玻璃，切割得到芯片级荧光玻璃，并直接贴装在LED芯片上表面，实现荧光玻璃芯片级白光LED封装。600 ℃低温烧结后，荧光粉颗粒均匀分布在玻璃基体中，荧光粉颗粒和玻璃基板紧密结合，无界面相。系统研究了荧光玻璃厚度和封装结构对芯片级白光LED性能的影响。当荧光玻璃厚度为120 μm时，荧光玻璃封装芯片级白光LED获得了最优光学性能，光效、色温和色坐标分别为111.79 lm/W、6 876 K和(0.307 4,0.321 4)，接近白光普朗克轨迹。相比于PiG-up封装，PiG-down封装结构能吸收更多的蓝光，并转化成黄光，表现出更高的光效和稳定的色温，并能有效降低表面温度。荧光玻璃封装芯片级白光LED是一种有效、可靠的高光密度白光LED器件，有利于促进芯片级白光LED的实际应用。" } ] }, { "name": "p", "data": [ { "name": "text", "data": "本文专家审稿意见及作者回复内容的下载地址:http://cjl.lightpublishing.cn/thesisDetails#10.37188/CJL.20210303." } ] } ] } ], "footnote": [], "reflist": { "title": [ { "name": "text", "data": "参考文献:" } ], "data": [ { "id": "R1", "label": "[1]", "citation": [ { "lang": "en", "text": [ { "name": "text", "data": "SCHUBERT E F" }, { "name": "text", "data": ", " }, { "name": "text", "data": "KIM J K" }, { "name": "text", "data": ". 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