浏览全部资源
扫码关注微信
闽南师范大学 物理与信息工程学院, 福建 漳州 363000
纸质出版日期:2018-5-5,
网络出版日期:2017-11-23,
收稿日期:2017-9-6,
修回日期:2017-11-25,
扫 描 看 全 文
陈焕庭, 陈福昌, 何洋等. 多芯片LED器件热学特性分析[J]. 发光学报, 2018,39(5): 751-756
CHEN Huan-ting, CHEN Fu-chang, HE Yang etc. Analysis of Thermal Characteristics of A Multichip Light-emitting Diodes Device[J]. Chinese Journal of Luminescence, 2018,39(5): 751-756
陈焕庭, 陈福昌, 何洋等. 多芯片LED器件热学特性分析[J]. 发光学报, 2018,39(5): 751-756 DOI: 10.3788/fgxb20183905.0751.
CHEN Huan-ting, CHEN Fu-chang, HE Yang etc. Analysis of Thermal Characteristics of A Multichip Light-emitting Diodes Device[J]. Chinese Journal of Luminescence, 2018,39(5): 751-756 DOI: 10.3788/fgxb20183905.0751.
由于芯片之间存在的热耦合效应,多芯片LED器件内部存在复杂热学规律。本文通过多芯片LED热学模型描述多芯片LED器件系统内部热阻支路路径,进而通过有限体积数值计算多芯片LED器件结温。通过本文试验验证,单颗芯片、2颗芯片、3颗芯片以及4颗芯片在负载不同电功率(0.3~1.2 W)情况下,结温的测试值和计算值的最小误差值为0.8%,最大误差值为6.8%,平均误差值为3.4%,计算结果与测试结果基本保持一致,因此有利论证了多芯片LED热学模型可为评价多芯片LED器件热学性能提供重要的参考作用,有助于更全面分析多芯片LED热阻内部芯片之间的热耦合效应。该实验结果为准确预测多芯片LED器件内部结温提供了重要理论依据。
A multichip LED device has complex interaction and mechanism due to thermal coupling effect. An estimation method for the thermal network model of the multichip LED device based on multichip thermal model was proposed in this paper. The predicted junction temperature in finite volume method was applied to the multichip LED device. The minimum
maximum and average deviations of junction temperature between the proposed model and the measurement are about 0.8%
6.8% and 3.4%
respectively. The calculated results are in good agreement with the measurements. These results confirm that the multichip thermal model with finite volume method can provide accurate predictions for junction temperature. The work offers a new research and development tool for practicing LED designers to accurately predict the junction temperature of LED system.
多芯片LED器件热学特性热耦合效应结温有限体积法
multichip light-emitting diodes devicethermal characteristicsthermal coupling effectjunction temperaturefinite volume method
徐玉珍, 林维明. 一种简化变量的新型LED光电热模型[J]. 光学学报, 2013, 33(5):0523001-1-7. XU Y Z, LIN W M. A novel LED photo-electro-thermal model with simplified variables[J]. Acta Opt. Sinica, 2013, 33(5):0523001-1-7. (in Chinese)
徐广强, 于慧媛, 张竞辉, 等. 基于单色LED补偿白光LED技术的模拟太阳光谱研究[J]. 发光学报, 2017, 38(8):1117-1124. XU G Q, YU H Y, ZHANG J H, et al.. Solar spectrum matching based on white LED compensated with monochromatic LEDs[J]. Chin. J. Lumin., 2017, 38(8):1117-1124. (in Chinese)
CHEN H T, TAN S C, HUI S Y. Color variation reduction of GaN-based white light-emitting diodes via peak-wavelength stabilization[J]. IEEE Trans. Power Electron., 2014, 29(7):3709-3719.
CHEN H T, HUI S Y. Dynamic prediction of correlated color temperature and color rendering index of phosphor-coated white light-emitting diodes[J]. IEEE Trans. Power Electron., 2014, 61(2):784-797.
李天保, 赵广洲, 卢太平, 等. 非故意掺杂GaN层厚度对蓝光LED波长均匀性的影响[J]. 发光学报, 2017, 38(9):1198-1204. LI T B, ZHAO G Z, LU T P, et al.. Effect of undoped GaN layer thickness on the wavelength uniformity of GaN based blue LEDs[J]. Chin. J. Lumin., 2017, 38(9):1198-1204. (in Chinese)
CHEN H T, TAN S C, HUI S Y. Analysis and modeling of high-power phosphor-coated white light-emitting diodes with a large surface area[J]. IEEE Trans. Power Electron., 2015, 30(6):3334-3344.
廖炫, 郭震宁, 潘诗发, 等. LED汽车前大灯散热器正交优化设计与分析[J]. 光子学报, 2016, 45(11):1122003. LIAO X, GUO Z N, PAN S F, et al.. Orthogonal optimization design and analysis of the LED car headlights[J]. Acta Photon. Sinica, 2016, 45(11):1122003. (in Chinese)
ROSTEN H I, LASANCE C J M, PARRY J D. The world of thermal characterization according to delphi-part I:background to Delphi[J]. IEEE Trans. Compon. Hybr. Manuf. Technol., 1997, 20(4):384-391.
SABRY M N. Compact thermal models for electronic systems[J]. IEEE Trans. Compon. Packaging Technol., 2003, 26(1):179-185.
INCROPERA E P, DEWITT D P, BERGMAN T L, et al.. Fundamentals of Heat and Mass Transfer[M]. 6th ed. New York:Baker & Taylor, 2006.
SZKELY V. A new evaluation method of thermal transient measurement results[J]. Microelectron. J., 1997, 28(3):277-292.
邓辉, 吕毅军, 高玉琳, 等. 交流发光二极管热特性的模拟分析[J]. 光学学报, 2012, 32(6):0623001-1-6. DENG H, LV Y J, GAO Y L, et al.. Thermal simulation of alternating current light emitting diodes[J]. Acta Opt. Sinica, 2012, 32(6):0623001-1-6. (in Chinese)
0
浏览量
60
下载量
2
CSCD
关联资源
相关文章
相关作者
相关机构