Influence of Multi-core CSP-LED Chip Spacing on Thermal Congestion

LIU Qian; XIONG Chuan-bing; TANG Ying-wen; LI Xiao-zhen; WANG Shi-long

doi:10.3788/fgxb20204103.0308

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Influence of Multi-core CSP-LED Chip Spacing on Thermal Congestion

Device Fabrication and Physics | 更新时间：2020-08-12

- Influence of Multi-core CSP-LED Chip Spacing on Thermal Congestion
- Chinese Journal of Luminescence Vol. 41, Issue 3, Pages: 308-315(2020)
- 作者机构：
  
  闽南师范大学物理与信息工程学院
- 作者简介：
- 基金信息：
  
  Supported by National Natural Science Foundation of China(51072076);Industry-Unive
- DOI：10.3788/fgxb20204103.0308
  CLC： TN304
- Received：12 December 2019，
  
  Revised：2020-1-4，
  
  Online First：06 January 2020，
  
  Published：05 March 2020
- 稿件说明：
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刘倩, 熊传兵, 汤英文等. 多芯CSP-LED芯片间距对热拥堵的影响[J]. 发光学报, 2020,41(3): 308-315

LIU Qian, XIONG Chuan-bing, TANG Ying-wen etc. Influence of Multi-core CSP-LED Chip Spacing on Thermal Congestion[J]. Chinese Journal of Luminescence, 2020,41(3): 308-315
刘倩, 熊传兵, 汤英文等. 多芯CSP-LED芯片间距对热拥堵的影响[J]. 发光学报, 2020,41(3): 308-315 DOI： 10.3788/fgxb20204103.0308.

LIU Qian, XIONG Chuan-bing, TANG Ying-wen etc. Influence of Multi-core CSP-LED Chip Spacing on Thermal Congestion[J]. Chinese Journal of Luminescence, 2020,41(3): 308-315 DOI： 10.3788/fgxb20204103.0308.

摘要

在铝基板上贴片了不同间距的四颗芯片级封装发光二级管（CSP-LED）模组，测试了不同贴片间距CSP-LED模组的EL光谱、流明效率、光通量、相关色温等光电参数。结果显示，在小电流（20~400 mA）下，随着注入电流的增大，不同排布间距的蓝、白光样品的光电性能基本呈现相同的变化规律，即光通量、光功率呈线性增长，光效基本保持稳定；在大电流（1~1.5 A）下，随着芯片间排布间距减小，EL光谱积分强度降低，色温升高，红色比下降，排布间距为0.2 mm的光通量衰减了84.58%，相比之下排布间距为3 mm和5 mm的光通量衰减明显减缓，分别为8.96%和3.58%，这些现象与禁带宽度、热应力、非辐射复合等因素有关。结果表明，CSP白光LED光通量衰减主要是荧光粉退化导致的，考虑到实际生产成本问题，排布间距为3 mm时，有利于热量散出，进而提高LED光电性能特性及其自身的使用寿命。

Abstract

Device Fabrication and Physics

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references

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