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Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure
Device Fabrication and Physics | 更新时间：2025-02-25
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    • Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure

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    • “In the field of semiconductor laser chip heat dissipation, researchers have proposed a new distributed flow pattern structure that effectively reduces chip junction temperature and cooling flow rate, providing technical support for high integration and high heat dissipation laser chips.”
    • Chinese Journal of Luminescence   Vol. 46, Issue 2, Pages: 343-353(2025)

    • DOI：10.37188/CJL.20240205    

      CLC： TN248.4
    • CSTR：32170. 14. CJL. 20240205    

    • Received：14 September 2024，

      Revised：10 October 2024，

      Published：25 February 2025

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  • CHEN Lang,LIU Jiachen,ZHANG Junyue,et al.Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure[J].Chinese Journal of Luminescence,2025,46(02):343-353. DOI： 10.37188/CJL.20240205. CSTR： 32170. 14. CJL. 20240205.

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LIU Jiachen
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State Key Laboratory of Transient 0ptics and Photonics， Xi'an Institute of 0ptics and Precision Mechanics， Chinese Academy of Sciences
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