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Research on integrated heat dissipation of a novel laser diode array substrate and a liquid-cooled microstructure
更新时间：2024-12-02
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    • Research on integrated heat dissipation of a novel laser diode array substrate and a liquid-cooled microstructure

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    • “In the field of semiconductor laser chip heat dissipation, researchers have proposed a new distributed flow pattern structure that effectively reduces chip junction temperature and cooling flow rate, providing technical support for high integration and high heat dissipation laser chips.”
    • Chinese Journal of Luminescence   Pages: 1-11(2024)

    • DOI：10.37188/CJL.20240205    

      CLC： TN248.4

    • Published Online：02 December 2024，

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  • CHEN LANG, LIU JIACHEN, ZHANG JUNYUE, et al. Research on integrated heat dissipation of a novel laser diode array substrate and a liquid-cooled microstructure. [J/OL]. Chinese journal of luminescence, 2024, 1-11. DOI： 10.37188/CJL.20240205.

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