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Thermal Analysis and Optimization of Vertical-cavity Surface-emitting Lasers with Different Packaging Structures
Device Fabrication and Physics | 更新时间：2024-09-25
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    • Thermal Analysis and Optimization of Vertical-cavity Surface-emitting Lasers with Different Packaging Structures

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    • “The latest research reveals that optimizing VCSEL packaging can significantly improve heat dissipation performance, providing key technical support for fields such as laser radar.”
    • Chinese Journal of Luminescence   Vol. 45, Issue 8, Pages: 1371-1379(2024)

    • DOI：10.37188/CJL.20240141    

      CLC： TN248

    • Published：25 August 2024，

      Received：20 May 2024，

      Revised：29 May 2022，

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  • ZHANG WEI, WANG YANJING, TONG HAIXIA, et al. Thermal Analysis and Optimization of Vertical-cavity Surface-emitting Lasers with Different Packaging Structures. [J]. Chinese journal of luminescence, 2024, 45(8): 1371-1379. DOI： 10.37188/CJL.20240141.

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