荧光玻璃封装芯片级白光LED光热性能

张稀雯; 余子康; 牟运; 彭洋; 李俊杰; 史铁林

doi:10.37188/CJL.20210303

您当前的位置：

首页 >

文章列表页 >

荧光玻璃封装芯片级白光LED光热性能

发光产业及技术前沿 | 更新时间：2021-12-17

- 荧光玻璃封装芯片级白光LED光热性能
  增强出版
- Photothermal Performance of Phosphor-in-glass Packaged Chip-scale White LED
- 发光学报 2021年42卷第12期页码：1961-1968
- 作者机构：
  
  1.华中科技大学　机械科学与工程学院，湖北　武汉　430074
  2.华中科技大学　航空航天学院，湖北　武汉　430074
  3.中国科学院　深圳先进技术研究院，广东　深圳　518055
- 作者简介：
  
  [ "张稀雯(1987-)，女，湖北孝感人，博士研究生，2012年于武汉理工大学获得硕士学位，主要从事电子集成与制造的研究。E-mail: xiwenzhang@hust.edu.cn" ]
  [ "彭洋(1989-)，男，安徽六安人，博士，讲师，硕士研究生导师，2017年于华中科技大学获得博士学位，主要从事微纳制造与电子封装的研究。E-mail: ypeng@hust.edu.cn" ]
  [ "李俊杰(1988-)，男，湖北孝感人，博士，副研究员，硕士研究生导师，2017年于华中科技大学获得博士学位，主要从事微纳制造与电子封装的研究。E-mail: lijj@siat.ac.cn" ]
- 基金信息：
  
  国家自然科学基金(51805196;51805197);中央高校基本科研业务费专项资金(2020kfyXJJS092)
- DOI：10.37188/CJL.20210303
  中图分类号： TN312.8
- 纸质出版日期：2021-12，
  
  收稿日期：2021-09-16，
  
  修回日期：2021-10-06，
- 稿件说明：
移动端阅览
张稀雯, 余子康, 牟运, 等. 荧光玻璃封装芯片级白光LED光热性能[J]. 发光学报, 2021,42(12):1961-1968.

XI-WEN ZHANG, ZI-KANG YU, YUN MOU, et al. Photothermal Performance of Phosphor-in-glass Packaged Chip-scale White LED. [J]. Chinese journal of luminescence, 2021, 42(12): 1961-1968.
张稀雯, 余子康, 牟运, 等. 荧光玻璃封装芯片级白光LED光热性能[J]. 发光学报, 2021,42(12):1961-1968. DOI： 10.37188/CJL.20210303.

XI-WEN ZHANG, ZI-KANG YU, YUN MOU, et al. Photothermal Performance of Phosphor-in-glass Packaged Chip-scale White LED. [J]. Chinese journal of luminescence, 2021, 42(12): 1961-1968. DOI： 10.37188/CJL.20210303.

摘要

芯片级封装是实现高光密度白光LED和减小封装体积的一种重要途径，而目前芯片级白光LED存在荧光层老化、荧光粉热猝灭等问题，严重影响白光LED的性能和可靠性。为此，本文结合荧光玻璃的技术优势，提出了荧光玻璃封装芯片级白光LED，并分析了白光LED光热性能。利用丝网印刷和低温烧结工艺在玻璃基片表面制备了荧光玻璃层，从而获得了晶圆级荧光玻璃片，再切割成芯片级荧光玻璃用于白光LED封装。分析了荧光玻璃层的微观形貌，荧光粉颗粒内嵌在玻璃基体中，膜层致密、无明显残余气孔；通过调节荧光玻璃层厚度优化了白光LED光学性能，当荧光玻璃层为120 μm时，白光LED获得了最优光学性能，光效、色温和色坐标分别为111.8 lm/W、6 876 K和(0.307 4

0.321 4)；分析了荧光玻璃封装结构对白光LED光热性能的影响，荧光玻璃层靠近LED芯片封装具有更高的光效和更低的色温，同时白光LED表面温度更低。

Abstract

Chip-scale packaging(CSP) is an important way to realize a white LED with high optical density and reduce its package size. However

chip-scale white LED has the problems of the aging of phosphor layer and the thermal quenching of phosphor

which seriously affect the performance and reliability of white LED. Herein

combined with the technical advantages of PiG

we proposed a phosphor-in-glass(PiG) packaged chip-scale white LED

and analyzed the photothermal performance of white LED. The PiG layer was prepared on the surface of glass substrate with the process of screen printing and low-temperature sintering

and then the PiG was cut into the chip-scale PiG for white LED packaging. The microscopic morphology of PiG was analyzed. The phosphor particles were embedded in the glass matrix

and the film layer displays a dense structure with no obvious residual pores. The optical properties of white LED were optimized by adjusting the thickness of PiG layer. When the thickness of PiG layer is 120 μm

the related luminous efficiency(LE)

correlated color temperature(CCT)

and chromaticity coordinate are 111.8 lm/W

6 876 K

and (0.307 4

0.321 4)

respectively. The effect of PiG packaging structure on the photothermal performance of white LED was analyzed. The PiG layer close to LED chip packaging has higher LE and lower CCT

while the surface temperature of white LED is lower.

关键词

白光LED芯片级封装荧光玻璃光热性能

Keywords

white LEDchip-scale packagingphosphor-in-glassphotothermal performance

references

SCHUBERT E F, KIM J K. Solid-state light sources getting smart[J]. Science, 2005, 308(5726):1274-1278.

LUO X B, HU R, LIU S, et al. Heat and fluid flow in high-power LED packaging and applications[J]. Prog. Energy Combust. Sci., 2016, 56:1-32.

PENG Y, LI R X, WANG S M, et al. Luminous properties and thermal reliability of screen-printed phosphor-in-glass-based white light-emitting diodes[J]. IEEE Trans. Electron Dev., 2017, 64(3):1114-1119.

KIM Y H, VISWANATH N S M, UNITHRATTIL S, et al. Review-phosphor plates for high-power LED applications∶challenges and opportunities toward perfect lighting[J]. ECS J. Solid State Sci. Technol., 2018, 7(1):R3134-R3147.

YE S, XIAO F, PAN Y X, et al. Phosphors in phosphor-converted white light-emitting diodes∶recent advances in materials,techniques and properties[J]. Mater. Sci. Eng.: R: Rep., 2010, 71(1):1-34.

肖华, 吕毅军, 徐云鑫, 等. 传统白光LED与远程荧光粉白光LED的发光性能比较[J]. 发光学报, 2014, 35(1):66-72.

XIAO H, LYU Y J, XU Y X, et al. The difference of luminous performance between traditional phosphor packaging LED and remote phosphor LED[J]. Chin. J. Lumin., 2014, 35(1):66-72. (in Chinese)

CHO J, PARK J H, KIM J K, et al. White light-emitting diodes∶history,progress,and future[J]. Laser Photonics Rev., 2017, 11(2):1600147.

张瑞, 王伯阳, 王海. 白光LED用Phosphor-in-Glass荧光材料的研究进展[J]. 无机材料学报, 2017, 32(4):337-345.

ZHANG R, WANG B Y, WANG H. Advances in phosphor-in-glass for white LED[J]. J. Inorg. Mater., 2017, 32(4):337-345. (in Chinese)

LIANG G W, YU S D, TANG Y, et al. Enhancing luminous efficiency of quantum dot-based chip-on-board light-emitting diodes using polystyrene fiber mats[J]. IEEE Trans. Electron Dev., 2020, 67(10):4530-4533.

王世龙, 熊传兵, 汤英文, 等. 共晶芯片数及芯片位置对陶瓷共晶封装LED发光性能的影响[J]. 发光学报, 2020, 41(11):1421-1430.

WANG S L, XIONG C B, TANG Y W, et al. Effect of number and location of eutectic chips on luminescent properties of ceramic eutectic packaged LED[J]. Chin. J. Lumin., 2020, 41(11):1421-1430. (in Chinese)

LAI C F, TIEN Y C, TONG H C, et al. High-performance quantum dot light-emitting diodes using chip-scale package structures with high reliability and wide color gamut for backlight displays[J]. RSC Adv., 2018, 8(63):35966-35972.

CHEN C, ZHAO D Z, XIONG Z H, et al. Comparative study of the photoelectric and thermal performance between traditional and chip-scale packaged white LED[J]. IEEE Trans. Electron Dev., 2021, 68(4):1710-1716.

JIANG C S, FAN J J, QIAN C, et al. Effects of voids on mechanical and thermal properties of the die attach solder layer used in high-power LED chip-scale packages[J]. IEEE Trans. Compon., Packag. Manuf. Technol., 2018, 8(7):1254-1262.

BAK G H, OH S W, SUNG H H, et al. Effect of phosphor layer size on the optical and thermal properties of chip scale packaged light-emitting diodes[J]. ECS Trans., 2018, 85(7):67-72.

PENG Y, SUN Q L, LIU J X, et al. Fabrication of stacked color converter for high-power WLEDs with ultra-high color rendering[J]. J. Alloys Compd., 2021, 850:156811.

ZHANG X W, LIU J X, LIU J L, et al. Reliable and efficient phosphor-in-glass-based chip-scale packaging for high-power white LEDs[J]. IEEE Trans. Electron Dev., 2021, 68(9):4473-4477.

PENG Y, MOU Y, SUN Q L, et al. Facile fabrication of heat-conducting phosphor-in-glass with dual-sapphire plates for laser-driven white lighting[J]. J. Alloys Compd., 2019, 790:744-749.

MOU Y, WANG H, LIANG D D, et al. Efficient and heat-conducting color converter of phosphor glass film printed on sapphire substrate for high-power white LEDs/LDs[J]. J. Non-Cryst. Solids, 2019, 515:98-105.

XU T, YUAN L, CHEN Y, et al. Y3Al5O12∶Ce3+ single crystal and red-emitting Y3Al5O12∶Cr3+ single crystal for high power W-LEDs[J]. Opt. Mater., 2019, 91:30-34.

LEE Y K, LEE J S, HEO J, et al. Phosphor in glasses with Pb-free silicate glass powders as robust color-converting materials for white LED applications[J]. Opt. Lett., 2012, 37(15):3276-3278.

LIN H, HU T, CHENG Y, et al. Glass ceramic phosphors∶towards long-lifetime high-power white light-emitting-diode applications—a review[J]. Laser Photonics Rev., 2018, 12(6):1700344.

ZHANG R, LIN H, YU Y L, et al. A new-generation color converter for high-power white LED∶transparent Ce3+∶YAG phosphor-in-glass[J]. Laser Photonics Rev., 2014, 8(1):158-164.

PENG Y, WANG H, LIU J X, et al. Broad-band and stable phosphor-in-glass enabling ultrahigh color rendering for all-inorganic high-power WLEDs[J]. ACS Appl. Electron. Mater., 2020, 2(9):2929-2936.

LEE Y K, KIM Y H, HEO J, et al. Control of chromaticity by phosphor in glasses with low temperature sintered silicate glasses for LED applications[J]. Opt. Lett., 2014, 39(14):4084-4087.

XI X Q, ZHANG L, KANG J, et al. Chip-level Ce∶GdYAG ceramic phosphors with excellent chromaticity parameters for high-brightness white LED device[J]. Opt. Express, 2021, 29(8):11938.

张延, 刘升, 许虹杰, 等. LED用荧光玻璃的制备及性能研究[J]. 无机材料学报, 2015, 30(6):588-592.

ZHANG Y, LIU S, XU H J, et al. Preparation and performance of Ce∶YAG phosphor-in-glass[J]. J. Inorg. Mater., 2015, 30(6):588-592. (in Chinese)

PENG Y, LIANG D D, WANG H, et al. Optical and thermal performances of PiG-based WLEDs with different packaging structures[J]. IEEE Photon. Technol. Lett., 2019, 31(16):1355-1358.

浏览量

480

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

Ce³⁺掺杂Ba₃Y₂（BO₃）₄荧光粉发光性能及应用

激光照明应用MgO-La₃Si₆N₁₁∶Ce³⁺复合荧光玻璃的制备及性能优化

大功率白光LED荧光胶和荧光片玻璃封装的光热性能

白光LED用Mn⁴⁺激活氟氧化物红色荧光粉研究进展