深紫外LED封装技术现状与展望

彭洋; 陈明祥; 罗小兵

doi:10.37188/CJL.20200394

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深紫外LED封装技术现状与展望

发光产业及技术前沿 | 更新时间：2021-04-23

- 深紫外LED封装技术现状与展望
- Status and Perspectives of Deep Ultraviolet LED Packaging Technology
- 发光学报 2021年42卷第4期页码：542-559
- 作者机构：
  
  1.华中科技大学航空航天学院，湖北　武汉　 430074
  2.华中科技大学机械科学与工程学院，湖北　武汉　 430074
  3.华中科技大学能源与动力工程学院，湖北　武汉　 430074
- 作者简介：
  
  [ "彭洋(1989-)，男，安徽六安人，博士，讲师，硕士研究生导师，2017年于华中科技大学获得博士学位，主要从事微纳制造与电子封装的研究。E-mail: ypeng@hust.edu.cn" ]
  [ "陈明祥(1970-)，男，湖北孝感人，博士，教授，博士研究生导师，2006年于华中科技大学获得博士学位，主要从事电子封装材料、技术与应用的研究。E-mail: chimish@hust.edu.cn" ]
  [ "罗小兵(1974-)，男，湖北新洲人，博士，教授，博士研究生导师，2002年于清华大学获得博士学位，主要从事LED封装与应用、极端热管理和微纳尺度传热的研究。E-mail: luoxb@hust.edu.cn" ]
- 基金信息：
  
  国家重点研发计划(2016YFB0400804);国家自然科学基金(51805196;51775219)
- DOI：10.37188/CJL.20200394
  中图分类号：
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彭洋, 陈明祥, 罗小兵. 深紫外LED封装技术现状与展望[J]. 发光学报, 2021,42(4):542-559.

Yang PENG, Ming-xiang CHEN, Xiao-bing LUO. Status and Perspectives of Deep Ultraviolet LED Packaging Technology[J]. Chinese Journal of Luminescence, 2021,42(4):542-559.
彭洋, 陈明祥, 罗小兵. 深紫外LED封装技术现状与展望[J]. 发光学报, 2021,42(4):542-559. DOI： 10.37188/CJL.20200394.

Yang PENG, Ming-xiang CHEN, Xiao-bing LUO. Status and Perspectives of Deep Ultraviolet LED Packaging Technology[J]. Chinese Journal of Luminescence, 2021,42(4):542-559. DOI： 10.37188/CJL.20200394.

摘要

深紫外发光二极管(Deep-ultraviolet light-emitting diode,DUV-LED)具有环保无汞、寿命长、功耗低、响应快、结构轻巧等诸多优势，在杀菌消毒、生化检测、医疗健康、隐秘通讯等领域具有重要应用价值。近年来，深紫外LED技术取得了快速发展，主要体现在光效和可靠性的不断提高，这一方面得益于芯片制造过程中氮化物材料外延和掺杂技术的进步，另一方面归功于深紫外LED封装技术的发展。但是，与波长较长的近紫外和蓝光LED相比，深紫外LED的光效和可靠性仍有很大提升空间。本综述重点对深紫外LED封装关键技术进行了系统分析，包括封装材料选择、封装结构设计、封装工艺优化、反射光损耗机制以及结温和热管理等，同时从提高光效与器件可靠性角度阐述了深紫外LED封装的最新研究进展，并对后续技术发展进行了展望。

Abstract

Deep ultraviolet light-emitting diode(DUV-LED) has great applications in sterilization and disinfection, biochemical detection, medical treatment, and secret communication due to its mercury-free, long life, low power consumption, high response, and compact structure. In recent years, the light efficiency and reliability of DUV-LEDs are continuously enhanced. It is attributed to the advancement of nitride material epitaxy and doping technology in chip fabrication process and the development of DUV-LED packaging technology. However, the light efficiency and reliability of DUV-LED need to enhance compared with near-ultraviolet (NUV) and blue LEDs. This review focuses on the systematic analysis of the key technologies of DUV-LED packaging, including packaging material selection, packaging structure design, packaging process optimization, reflected light loss mechanism, and junction temperature and thermal management. Meanwhile, the latest research progresses of DUV-LED packaging in light extraction efficiency and device reliability are introduced. The future technology development of DUV-LED is prospected.

关键词

深紫外LED封装技术光效可靠性

Keywords

DUV-LEDpackaging technologylight efficiencyreliability

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