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1.华中科技大学 航空航天学院,湖北 武汉 430074
2.华中科技大学 机械科学与工程学院,湖北 武汉 430074
3.华中科技大学 能源与动力工程学院,湖北 武汉 430074
[ "彭洋(1989-),男,安徽六安人,博士,讲师,硕士研究生导师,2017年于华中科技大学获得博士学位,主要从事微纳制造与电子封装的研究。E-mail: ypeng@hust.edu.cn" ]
[ "陈明祥(1970-),男,湖北孝感人,博士,教授,博士研究生导师,2006年于华中科技大学获得博士学位,主要从事电子封装材料、技术与应用的研究。E-mail: chimish@hust.edu.cn" ]
[ "罗小兵(1974-),男,湖北新洲人,博士,教授,博士研究生导师,2002年于清华大学获得博士学位,主要从事LED封装与应用、极端热管理和微纳尺度传热的研究。E-mail: luoxb@hust.edu.cn" ]
纸质出版日期:2021-04-01,
收稿日期:2020-12-21,
修回日期:2021-01-08,
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彭洋, 陈明祥, 罗小兵. 深紫外LED封装技术现状与展望[J]. 发光学报, 2021,42(4):542-559.
Yang PENG, Ming-xiang CHEN, Xiao-bing LUO. Status and Perspectives of Deep Ultraviolet LED Packaging Technology[J]. Chinese Journal of Luminescence, 2021,42(4):542-559.
彭洋, 陈明祥, 罗小兵. 深紫外LED封装技术现状与展望[J]. 发光学报, 2021,42(4):542-559. DOI: 10.37188/CJL.20200394.
Yang PENG, Ming-xiang CHEN, Xiao-bing LUO. Status and Perspectives of Deep Ultraviolet LED Packaging Technology[J]. Chinese Journal of Luminescence, 2021,42(4):542-559. DOI: 10.37188/CJL.20200394.
深紫外发光二极管(Deep-ultraviolet light-emitting diode
DUV-LED)具有环保无汞、寿命长、功耗低、响应快、结构轻巧等诸多优势,在杀菌消毒、生化检测、医疗健康、隐秘通讯等领域具有重要应用价值。近年来,深紫外LED技术取得了快速发展,主要体现在光效和可靠性的不断提高,这一方面得益于芯片制造过程中氮化物材料外延和掺杂技术的进步,另一方面归功于深紫外LED封装技术的发展。但是,与波长较长的近紫外和蓝光LED相比,深紫外LED的光效和可靠性仍有很大提升空间。本综述重点对深紫外LED封装关键技术进行了系统分析,包括封装材料选择、封装结构设计、封装工艺优化、反射光损耗机制以及结温和热管理等,同时从提高光效与器件可靠性角度阐述了深紫外LED封装的最新研究进展,并对后续技术发展进行了展望。
Deep ultraviolet light-emitting diode(DUV-LED) has great applications in sterilization and disinfection
biochemical detection
medical treatment
and secret communication due to its mercury-free
long life
low power consumption
high response
and compact structure. In recent years
the light efficiency and reliability of DUV-LEDs are continuously enhanced. It is attributed to the advancement of nitride material epitaxy and doping technology in chip fabrication process and the development of DUV-LED packaging technology. However
the light efficiency and reliability of DUV-LED need to enhance compared with near-ultraviolet (NUV) and blue LEDs. This review focuses on the systematic analysis of the key technologies of DUV-LED packaging
including packaging material selection
packaging structure design
packaging process optimization
reflected light loss mechanism
and junction temperature and thermal management. Meanwhile
the latest research progresses of DUV-LED packaging in light extraction efficiency and device reliability are introduced. The future technology development of DUV-LED is prospected.
深紫外LED封装技术光效可靠性
DUV-LEDpackaging technologylight efficiencyreliability
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