
浏览全部资源
扫码关注微信
北京工业大学 电子信息与控制工程学院
收稿:2011-06-24,
修回:2011-7-20,
网络首发:2011-10-22,
纸质出版:2011-10-22
移动端阅览
周舟, 冯士维, 张光沉, 郭春生, 李静婉. GaN基大功率白光LED的高温老化特性[J]. 发光学报, 2011,32(10): 1046-1050
ZHOU Zhou, FENG Shi-wei, ZHANG Guang-chen, GUO Chun-sheng, LI Jing-wan. The Aging Characteristics of High-power GaN-based White Light-emitting Diodes[J]. Chinese Journal of Luminescence, 2011,32(10): 1046-1050
对大功率GaN基白光LED在85 ℃下进行了高温加速老化实验。经6 500 h的老化
样品光通量退化幅度为28%~33%。样品的
I-V
特性变化表明其串联电阻和反向漏电流不断增大
原因可归结为芯片欧姆接触的退化及芯片材料中缺陷密度的提高。样品的热特性变化显示出各结构层热阻均明显增大
这是由散热通道上各层材料的老化及焊料层出现大面积空洞引起的。分析表明
高温老化过程中芯片和封装材料的退化共同导致了LED的缓变失效。
paper
Fang Yan. Market analysis and future trends of LED [J]. Laser & Optoelectronics Progress, 2007, 44 (6):69-71 (in Chinese).[2] Chen Haiming. Development and trends on white LED technology and industry in foreign countries [J]. Semiconductor Technology (半导体技术), 2010(7):621-625,743 (in Chinese).[3] Dupuis R D, Krames M R. History, development, and applications of high-brightness visible light-emitting diodes [J]. IEEE J. Lightwave Technology, 2008, 26 (9):1154-1171.[4] Hu Jianzheng, Yang Lianqiao, Moo Wha Shin, et al. The aging mechanism of high-power InGaN/GaN light-emitting diodes under electrical stresses [J]. Semicond. Sci. Technol., 2007, 22 (12):1249-1252.[5] Li Bingqian, Liu Yuhua, Feng Yuchun. The power dissipation of equivalent series resistance and its influence on lumen efficiency of GaN based high power light-emitting diodes [J]. Acta Phys. Sinica, 2008(1):477-481.[6] Rossia F, Armania N, Salviatia G, et al. The role of Mg complexes in the degradation of InGaN-based LEDs [J]. Superlattices and Microstructures, 2004, 36 (4-6):859-868.[7] Cao X A, Sandvik P M, LeBoeuf S F, et al. Defect generation in InGaN/GaN light-emitiing diodes under forward and reverse electrical stresses[J]. Microelectronics Reliability, 2003, 43 (12):1987-1991.[8] Yu Binhai, Wang Yaohao. Junction temperature and thermal resistance restrict the development of high-power LED [J].Chin. J. Lumin. (发光学报), 2005, 26 (6):761-766 (in Chinese).[9] Dai Shuchun. Influence of power effect on the thermal resistance of power LED [J]. Chin. J. Lumin. (发光学报), 2010, 31 (6):877-881 (in Chinese).[10] Feng Shiwei, Xie Xuesong, Lv Changzhi, et al. The thermal characterization of packaged semiconductor device [J].J. Semiconductors, 1999, 20 (5):220-226.[11] Szekely V. Enhancing reliability with thermal transient testing [J]. Microelectronics Reliability, 2002, 42 (4-5):629-40.[12] Rencz M, Poppe A, Kollar E , et al. Increasing the accuracy of structure function based themal material parameter measurements [J]. IEEE Trans. Compon. Pack. Techn., 2005, 28 (1):51-57.[13] Yang Lianqiao, Hu Jianzheng, Shin Moo Whan. Dynamic thermal analysis of high-power LEDs at pulse conditions [J]. IEEE Electron Device Letters, 2006, 29 (8):863-866.[14] Trevisanello L, Meneghini M, Mura G, et al. Accelerated life test of high brightness light emitting diodes [J]. IEEE Trans. Device Mater. Reliab., 2008, 8 (2):304-315.[15] Wang Jian, Huang Xian, Liu Li, et al. Effect of temperature and current on LED luminous efficiency [J]. Chin. J. Lumin. (发光学报), 2008, 29 (2):358-362 (in Chinese).
0
浏览量
466
下载量
15
CSCD
关联资源
相关文章
相关作者
相关机构
京公网安备11010802024621