浏览全部资源
扫码关注微信
1. 华北电力大学 新能源电力系统国家重点实验室 北京,102206
2. 华北电力大学 低品位能源多相流与传热北京市重点实验室 北京,102206
纸质出版日期:2012-6-10,
网络出版日期:2012-6-10,
收稿日期:2012-3-19,
修回日期:2012-4-10,
扫 描 看 全 文
王天虎, 徐进良, 王晓东. 非等温模型下LED芯片性能与衬底的关系[J]. 发光学报, 2012,(6): 616-623
WANG Tian-Hu, XU Jin-Liang, WANG Xiao-Dong. Relationship Between Light-emitting Diode Performance and Different Substrates Working Under Non-isothermal Model[J]. Chinese Journal of Luminescence, 2012,(6): 616-623
王天虎, 徐进良, 王晓东. 非等温模型下LED芯片性能与衬底的关系[J]. 发光学报, 2012,(6): 616-623 DOI: 10.3788/fgxb20123306.0616.
WANG Tian-Hu, XU Jin-Liang, WANG Xiao-Dong. Relationship Between Light-emitting Diode Performance and Different Substrates Working Under Non-isothermal Model[J]. Chinese Journal of Luminescence, 2012,(6): 616-623 DOI: 10.3788/fgxb20123306.0616.
发光二极管(LED)中载流子的输运及复合决定了其非均匀的内热源强度及分布
而芯片温度又影响载流子的输运及复合
两者具有强烈的耦合关系。本文利用非等温多物理场耦合模型对以蓝宝石、Si及SiC为衬底的 LED芯片的内量子效率、光谱特性及光电转换效率进行了系统研究。结果表明:以SiC为衬底的LED芯片具有最小的效率下垂效应(Efficiency droop)及最高的光谱强度和光电转换效率。这是因为与其他两种衬底的LED芯片相比
以SiC为衬底的LED芯片具有最好的散热性能
因此非均匀温度场对其载流子输运及复合的影响最小
使得活性区中的载流子浓度显著增强
漏电流明显下降。
The carrier transport and recombination in light-emitting diodes (LEDs) determine the non-uniform intensity and distribution of the internal heat source. The non-uniform temperature field also influences the carrier transport and recombination in LEDs. Thus the carrier transport and recombination are strongly coupled with temperatures. In this paper
the internal quantum efficiency
spectrum characteristic and photoelectric conversion efficiency of LEDs with substrates of sapphire
Si and SiC are systematically studied by a non-isothermal multi-physics-field coupling model. It is shown that the LED with SiC substrate has the smallest efficiency droop effect and exhibits the highest spectrum intensity and photoelectric conversion efficiency
among the LEDs with substrates of sapphire
Si and SiC. This is because the LED with the substrate of SiC has the best thermal dissipation capability
thus the non-uniform temperature field has the smallest effect on the carrier transport and recombination
leading to the significantly enhanced carrier concentration in the active region and decreased current leakage.
发光二极管内量子效率衬底温度场
light-emitting diodesinternal quantum efficiencysubstratetemperature field
Krames M R, Shchekin O B, Mueller-Mach R, et al. Status and future of high-power light-emitting diodes for solid-state lighting [J]. IEEE J. Display Technol., 2007, 3(2):160-175.[2] Yin Yue, Liang Jingqiu, Liang Zhongzhu, et al. Effects of electrode structure on the current distribution of AlGaInP-LED array [J]. Chin. J. Lumin.(发光学报), 2011, 32(10):1051-1056 (in Chinese).[3] Chai Weiwei, Chen Qinghua, Li Linghong, et al. Heat dissipation analysis of high power LED connected to copper coated heat sink by soldering [J]. Chin. J. Lumin.(发光学报), 2011, 32(11):1171-1175 (in Chinese).[4] Wang Wanjing, Li Xifeng, Shi Jifeng, et al. Effect of ITO interface modulation layer on the performances of LEDs with Ga-doped ZnO electrode [J]. Chin. J. Lumin.(发光学报), 2012, 33(2):210-215 (in Chinese).[5] Kuo Y K, Chang J Y, Tsai M C, et al. Advantages of blue InGaN multiple-quantum well light-emitting diodes with InGaN barriers [J]. Appl. Phys. Lett., 2009, 95(1):011116-1-3.[6] Hader J, Moloney J V, Koch S W. Density-activated defect recombination as a possible explanation for the efficiency droop in GaN-based diodes [J]. Appl. Phys. Lett., 2010, 96(22):221106-1-3.[7] Efremov A A, Bochkareva N I, Gorbunov R I, et al. Effect of the Joule heating on the quantum efficiency and choice of thermal conditions for high-power blue InGaN/GaN LEDs [J]. Semiconductors, 2006, 40(5):605-610.[8] Schubert E F. Light-emitting Diodes [M]. New York:Cambridge University Press, 2006:38-43.[9] Wang C H, Chen J R, Chiu C H, et al. Temperature dependent electroluminescence efficiency in blue InGaN-GaN light emitting diodes with different well widths [J]. IEEE Photon. Technol. Lett., 2010, 22(4):236-238.[10] Huh C, Schaff W J, Eastman L F, et al. Temperature dependence of light-output performance of InGaN/GaN multiple-quantum well light-emitting diodes with various In compositions [J]. SPIE, 2004, 5187:330-335.[11] Fujiwara K, Jimi H, Kaneda K. Temperature-dependent droop of electroluminescence efficiency in blue (In,Ga)N quantum-well diodes [J]. Phys. Stat. Sol. c, 2009, 6(S2):S814-S817.[12] Kim C S, Kim J H, Yee K J, et al. Temperature- and bias-dependent study of photocurrent spectroscopy in an InGaN light-emitting diode operating near 400 nm [J]. Journal of the Korean Physical Society, 2010, 57(4):793-796.[13] Li Y, Zhao W, Xia Y, et al. Temperature dependence of the quantum efficiency in green light emitting diode dies [J]. Phys. Stat. Sol. c, 2007, 4(7):2784-2787.[14] Lee H K, Yu J S. Thermal analysis of InGaN/GaN multiple quantum well light emitting diodes with different mesa sizes [J]. Jpn. J. Appl. Phys., 2010, 49(4):04DG11-1-5.[15] Lee D H, Lee H K, Yu J S, et al. Temperature and thermal characteristics of InGaN/GaN vertical light-emitting diodes on electroplated copper [J]. Semicond. Sci. Technol., 2011, 26(5):055014-1-6.[16] Wang T H, Wang X D, Xu J L. The investigation of high power LED by a non-isothermal coupling model [J]. Journal of Engineering Thermophysics (工程热物理学报), 2012, 33(4):647-650 (in Chinese).[17] Liu L, Edgar J H. Substrates for gallium nitride epitaxy [J]. Materials Science and Engineering R, 2002, 37(3):61-127.[18] Liu E K, Zhu B S, Luo J S. The Physics of Semiconductor [M]. Beijing:National Defense Industry Press, 1994:108-125 (in Chinese).[19] Grupen M, Hess K. Simulation of carrier transport and nonlinearities in quantum well laser diodes [J]. IEEE J. Quantum Electron., 1998, 34(1):120-140.[20] Ebaisieux G D, Herve-Gruyer G, Palmier J F, et al. Self-consistent 1-D solution of multiquantum-well laser equations [J]. Optical and Quantum Electronics, 1997, 29(6):651-660.[21] Wachutka G K. Rigorous thermodynamic treatment of heat generation and conduction in semiconductor modeling [J]. IEEE Transactions on Computer Aided Design, 1990, 9(11):1141-1149.[22] Chuang S L, Chang C S. k · p method for strained wurtzite semiconductors [J]. Phys. Rev. B, 1996, 54(4):2491-2504.[23] Vurgaftman I, Meyer J R. Band parameters for nitrogen-containing semiconductors [J]. J. Appl. Phys., 2003, 94(6):3675-3696.[24] Wang R G, Chen Z Q, Hu G Y. The comparison of LED dedding materials SiC, ZnO, Al2O3 [J]. Science Technology and Engineering (科学技术与工程), 2006, 6(2):121-126 (in Chinese).[25] Kuo Y K, Shih Y H, Tsai M C, et al. Improvement in electron overflow of near-ultraviolet InGaN LEDs by specific design on last barrier [J]. IEEE Photon. Technol. Lett., 2011, 23(21):1630-1632.[26] Vurgaftman I, Meyer J R, Ram-Mohan L R. Band parameters for Ⅲ-Ⅴ compound semiconductors and their alloys [J]. J. Appl. Phys.,2001, 89(11):5815-5875.
0
浏览量
58
下载量
0
CSCD
关联资源
相关文章
相关作者
相关机构