有机发光二极管的热分析与热设计

杨连乔; 付美娟; 魏斌; 张建华; 曹进

doi:10.3788/fgxb20123306.0624

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有机发光二极管的热分析与热设计

器件制备及器件物理 | 更新时间：2020-08-12

- 有机发光二极管的热分析与热设计
- Thermal Analysis and Thermal Design of Organic Light-emitting Diode
- 发光学报 2012年33卷第6期页码：624-627
- 作者机构：
  
  上海大学新型显示及集成应用教育部重点实验室上海,200072
- 作者简介：
- 基金信息：
  
  国家十二五科技支撑计划(2011BAE01B14)();教育部留学回国人员科研启动基金();上海市自然科学基金(09ZR1411900)资助项目()
- DOI：10.3788/fgxb20123306.0624
  中图分类号： TN305.94;TN364+.2
- 纸质出版日期：2012-6-10，
  
  网络出版日期：2012-6-10，
  
  收稿日期：2012-2-23，
  
  修回日期：2012-4-11，
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杨连乔, 付美娟, 魏斌, 张建华, 曹进. 有机发光二极管的热分析与热设计[J]. 发光学报, 2012,(6): 624-627

YANG Lian-qiao, FU Mei-juan, WEI Bin, ZHANG Jian-hua, CAO Jin. Thermal Analysis and Thermal Design of Organic Light-emitting Diode[J]. Chinese Journal of Luminescence, 2012,(6): 624-627
杨连乔, 付美娟, 魏斌, 张建华, 曹进. 有机发光二极管的热分析与热设计[J]. 发光学报, 2012,(6): 624-627 DOI： 10.3788/fgxb20123306.0624.

YANG Lian-qiao, FU Mei-juan, WEI Bin, ZHANG Jian-hua, CAO Jin. Thermal Analysis and Thermal Design of Organic Light-emitting Diode[J]. Chinese Journal of Luminescence, 2012,(6): 624-627 DOI： 10.3788/fgxb20123306.0624.

摘要

采用基于计算流体动力学的热学模拟仿真与瞬态热学测试技术分析了OLED的热学特性

研究并讨论了输入功率、面板取向、风速等实际应用变量对OLED面板结温的影响。研究结果表明

OLED的结温与衬底及封装盖表面存在明显的温度梯度

且此温度梯度随输入电流增加大幅增大。OLED的热学特性与面板取向、气流速度密切相关。

Abstract

Computational fluid dynamic (CFD) based thermal simulation and transient thermal measurement are utilized to evaluate the thermal performance of OLED in this paper. The effects of input power

panel orientation and air velocity on the thermal characteristics of OLED are investigated and discussed. It is found that obvious thermal gradient exists between junction and substrate or glass cover

and the thermal gradient increases obviously with the input power. The thermal characteristic has a close relationship with the orientation of OLED panel and air velocity.

关键词

OLED结温热阻

Keywords

OLEDjunction temperaturethermal resistance

references

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van der Tempel L, Melis G P, Brandsma T C. Thermal conductivity of a glass:I. Measurement by the glass-metal contact [J]. Glass Phys. Chem., 2000, 26(6):606-611.

Wang W J, Lee T H, Choi J H, et al. Thermal investigation of GaN-based laser diode package [J]. IEEE Trans. Compon. Packag. Technol., 2007, 30(4):637-642.

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