Analysis of Failure Mechanism of Reverse Leakage Current in GaN-based Micro-LEDs
Device Fabrication and Physics|更新时间:2024-09-26
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Analysis of Failure Mechanism of Reverse Leakage Current in GaN-based Micro-LEDs
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“In the research of GaN based blue light Micro LED chips, experts have revealed the influence of temperature and voltage stress on reverse leakage current, providing new insights for improving chip performance.”
Chinese Journal of LuminescenceVol. 45, Issue 9, Pages: 1539-1546(2024)
作者机构:
1.无锡学院 江苏省集成电路可靠性技术及检测系统工程研究中心, 江苏 无锡 214105
2.南京信息工程大学 电子与信息工程学院, 江苏 南京 210044
作者简介:
基金信息:
Funding Project: Talent Initiation Research Project at Nanjing University of Information Science & Technology, Binjiang College (2019 r005, 550219005)、Horizontal Integration(2019 r005;550219005);Horizontal Integration(2021320205000041;2023320205000242;2023320205000242;560124081)
WANG WEI, ZHANG TENGFEI, WANG SHOUYU. Analysis of Failure Mechanism of Reverse Leakage Current in GaN-based Micro-LEDs. [J]. Chinese journal of luminescence, 2024, 45(9): 1539-1546.
DOI:
WANG WEI, ZHANG TENGFEI, WANG SHOUYU. Analysis of Failure Mechanism of Reverse Leakage Current in GaN-based Micro-LEDs. [J]. Chinese journal of luminescence, 2024, 45(9): 1539-1546. DOI: 10.37188/CJL.20240164.
Analysis of Failure Mechanism of Reverse Leakage Current in GaN-based Micro-LEDs增强出版