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Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs
Luminescence Industry and Technology Frontier | 更新时间：2024-08-06
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    • Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs

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    • “在半导体照明技术领域，最新研究揭示了铜基板面积、焊锡厚度和导电铜箔厚度对高功率LED器件极限光电性能的显著影响。实验结果表明，通过优化这些参数，可显著提升LED的极限光强和工作电压，为高功率LED器件的应用提供了重要指导。”
    • Chinese Journal of Luminescence   Vol. 45, Issue 7, Pages: 1196-1210(2024)

    • DOI：10.37188/CJL.20240090    

      CLC： TN304

    • Published：25 July 2024，

      Received：01 April 2024，

      Revised：22 April 2024，

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  • HUANG Linfeng,XIONG Chuanbing,TANG Yingwen,et al.Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs[J].Chinese Journal of Luminescence,2024,45(07):1196-1210. DOI： 10.37188/CJL.20240090.

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