Semi-inorganic Packaging Technology of DUV-LEDs with High-vapor Tightness

WAN Chuiming; ZENG Zhaoming; XIAO Guowei; LAN Yian; XIE Zijing; WANG Hong

doi:10.37188/CJL.20230156

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Semi-inorganic Packaging Technology of DUV-LEDs with High-vapor Tightness

Luminescence Industry and Technology Frontier | 更新时间：2023-11-01

- Semi-inorganic Packaging Technology of DUV-LEDs with High-vapor Tightness
  增强出版
- Chinese Journal of Luminescence Vol. 44, Issue 10, Pages: 1842-1848(2023)
- 作者机构：
  
  1.华南理工大学电子与信息学院，广东广州　510640
  2.广东晶科电子股份有限公司，广东广州　511458
  3.中山市华南理工大学现代产业技术研究院，广东中山　528437
- 作者简介：
- 基金信息：
  
  Guangzhou Municipal Science and Technology Plan Project(202103030002);Nansha District Science and Technology Development Project of Guangzhou(2021ZD001);Science and Technology Plan Project of Guangdong Province(2020B010171001)
- DOI：10.37188/CJL.20230156
  CLC： TN383.1
- Published：05 October 2023，
  
  Received：29 June 2023，
  
  Revised：17 July 2023，
- 稿件说明：
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万垂铭,曾照明,肖国伟等.高气密性的深紫外LED半无机封装技术[J].发光学报,2023,44(10):1842-1848.

WAN Chuiming,ZENG Zhaoming,XIAO Guowei,et al.Semi-inorganic Packaging Technology of DUV-LEDs with High-vapor Tightness[J].Chinese Journal of Luminescence,2023,44(10):1842-1848.
万垂铭,曾照明,肖国伟等.高气密性的深紫外LED半无机封装技术[J].发光学报,2023,44(10):1842-1848. DOI： 10.37188/CJL.20230156.

WAN Chuiming,ZENG Zhaoming,XIAO Guowei,et al.Semi-inorganic Packaging Technology of DUV-LEDs with High-vapor Tightness[J].Chinese Journal of Luminescence,2023,44(10):1842-1848. DOI： 10.37188/CJL.20230156.

摘要

深紫外LED可通过物理方式破坏病毒和细菌的结构，从而获得高效消毒的效果。相比于工艺成熟的蓝光LED，如何提高深紫外LED的封装可靠性和出光率仍是关键问题。本文采用基底预热方式微固化封装胶，结合阵列点胶方式将石英玻璃固定在镀铜围坝，制备了半无机封装的深紫外LED。该器件的输出波长为275 nm，半峰宽约为11 nm。对比传统类透明材料封装的器件，石英封装的深紫外LED有更高的出光率。在真空红墨水和氦气漏率实验中，采用本文提出的半无机封装技术的深紫外LED器件表现出高密封性。此外，在加速老化测试中，该封装器件的光衰速率在20%以内。实验结果表明，对比有机封装的深紫外LED器件，在基底预热条件下，采用阵列点胶固定石英玻璃是现阶段提高深紫外LED可靠性的一种封装方法。

Abstract

Deep ultraviolet light-emitting diodes （DUV-LEDs） can physically destroy the structure of viruses and bacteria， thus achieving efficient disinfection. Compared with the mature blue LED process， how to improve the packaging reliability and light output efficiency of DUV-LEDs is still a key problem. In this paper， a semi-inorganic packaging DUV-LED was prepared by using substrate preheating method of micro-cured encapsulation adhesive and combining with array dispensation method to bond quartz glass in plated dam copper. The output wavelength of the device is 275 nm and its half-peak width is approximately 11 nm. Quartz-packaged DUV-LEDs have higher light output than traditional devices packaged with transparent materials. DUV-LED devices using the packaging technique presented herein exhibit high air hermeticity in vacuum red ink and helium environments. Moreover， in the accelerated aging test， the light decay rate of this packaged device is less than 20%. Experimental results show that using array dispensing to bond quartz glass under substrate preheating is a packaging method to improve the reliability of DUV-LEDs compared with organic packaging.

关键词

深紫外LED可靠性出光率基底预热阵列点胶

Keywords

DUV-LEDsreliabilitylight output efficiencysubstrate preheatingarray dispensing

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