Status and Perspectives of Deep Ultraviolet LED Packaging Technology

Yang PENG; Ming-xiang CHEN; Xiao-bing LUO

doi:10.37188/CJL.20200394

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Status and Perspectives of Deep Ultraviolet LED Packaging Technology

Luminescence Industry and Technology Frontier | 更新时间：2021-04-23

- Status and Perspectives of Deep Ultraviolet LED Packaging Technology
- Chinese Journal of Luminescence Vol. 42, Issue 4, Pages: 542-559(2021)
- 作者机构：
  
  1.华中科技大学航空航天学院，湖北　武汉　 430074
  2.华中科技大学机械科学与工程学院，湖北　武汉　 430074
  3.华中科技大学能源与动力工程学院，湖北　武汉　 430074
- 作者简介：
- 基金信息：
  
  National Natural Science Foundation of China(2016YFB0400804);National Key Research and Development Program of China(51805196;51775219)
- DOI：10.37188/CJL.20200394
  CLC： TN312.8
- Received：21 December 2020，
  
  Revised：08 January 2021，
  
  Published：01 April 2021
- 稿件说明：
移动端阅览
Yang PENG, Ming-xiang CHEN, Xiao-bing LUO. Status and Perspectives of Deep Ultraviolet LED Packaging Technology[J]. Chinese journal of luminescence, 2021, 42(4): 542-559.
DOI：

Yang PENG, Ming-xiang CHEN, Xiao-bing LUO. Status and Perspectives of Deep Ultraviolet LED Packaging Technology[J]. Chinese journal of luminescence, 2021, 42(4): 542-559. DOI： 10.37188/CJL.20200394.

摘要

深紫外发光二极管(Deep-ultraviolet light-emitting diode

DUV-LED)具有环保无汞、寿命长、功耗低、响应快、结构轻巧等诸多优势，在杀菌消毒、生化检测、医疗健康、隐秘通讯等领域具有重要应用价值。近年来，深紫外LED技术取得了快速发展，主要体现在光效和可靠性的不断提高，这一方面得益于芯片制造过程中氮化物材料外延和掺杂技术的进步，另一方面归功于深紫外LED封装技术的发展。但是，与波长较长的近紫外和蓝光LED相比，深紫外LED的光效和可靠性仍有很大提升空间。本综述重点对深紫外LED封装关键技术进行了系统分析，包括封装材料选择、封装结构设计、封装工艺优化、反射光损耗机制以及结温和热管理等，同时从提高光效与器件可靠性角度阐述了深紫外LED封装的最新研究进展，并对后续技术发展进行了展望。

Abstract

Deep ultraviolet light-emitting diode(DUV-LED) has great applications in sterilization and disinfection

biochemical detection

medical treatment

and secret communication due to its mercury-free

long life

low power consumption

high response

and compact structure. In recent years

the light efficiency and reliability of DUV-LEDs are continuously enhanced. It is attributed to the advancement of nitride material epitaxy and doping technology in chip fabrication process and the development of DUV-LED packaging technology. However

the light efficiency and reliability of DUV-LED need to enhance compared with near-ultraviolet (NUV) and blue LEDs. This review focuses on the systematic analysis of the key technologies of DUV-LED packaging

including packaging material selection

packaging structure design

packaging process optimization

reflected light loss mechanism

and junction temperature and thermal management. Meanwhile

the latest research progresses of DUV-LED packaging in light extraction efficiency and device reliability are introduced. The future technology development of DUV-LED is prospected.

关键词

Keywords

references

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