HE Fan, CHEN Qing-hua, LIU Juan-fang etc. Thermal Analysis of High Mast Integrated LED Lamp with New Heatsink Structure of Laminated Pure Aluminum Plate[J]. Chinese Journal of Luminescence, 2014,35(6): 742-747
HE Fan, CHEN Qing-hua, LIU Juan-fang etc. Thermal Analysis of High Mast Integrated LED Lamp with New Heatsink Structure of Laminated Pure Aluminum Plate[J]. Chinese Journal of Luminescence, 2014,35(6): 742-747 DOI: 10.3788/fgxb20143506.0742.
A new heatsink structure of laminated high heat conductivity pure aluminum plate was proposed for the thermal management of high power integrated LED for high mast lighting. An investigation of experiment and finite element simulation was carried out for the demonstration of the heat dissipation performance. The transient process of LED drive is longer and the steady state temperature is within the range of required operation temperature. The LED junction temperature can be effectively decreased due to the increasing of the heat dissipation area. The experiment results show that the designed heatsink and selected LED drive can satisfy the heat dissipation requirement of 250 W high power high mast lamp.
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Lei S J, Ma Q, Yoon D K, et al. Heat dissipation of LED back light units based on TRZZ [J]. Chin. J. Liq. Cryst. Disp.(液晶与显示), 2012, 27(1):56-60 (in Chinese).
Li D S, Zou L, Zhang Y C, et al. Evaluation of reliability for LED lamp base on fuzzy algorithm [J]. Opt. Precision Eng.(光学 精密工程), 2012, 20(12):2661-2666 (in Chinese).
Luo X B, Yang J H, Gan Z Y, et al. Analysis and optimization on microjet cooling system for high power LED [J]. J. Eng. Thermophys.(工程热物理学报), 2008, 29(11):1909-1914 (in Chinese).
Mo D C, Chen Y, Lu S S. Experimental study on high efficient flatten loop heat pipe [J]. J. Eng. Thermophys.(工程热物理学报), 2007, 28(1):229-232 (in Chinese).
Tang Z W, Huang Q, Zhao Z L. An integrated high-power LED refrigerated by semiconductor [J]. Semicond. Optoelectron.(半导体光电), 2007, 28(8):471-474 (in Chinese).
Chai W W, Chen Q H, Li L H, et al. Heat dissipation analysis of high power LED connected to copper coated heat sink by soldering [J]. Chin. J. Lumin.(发光学报), 2011, 32(11):1171-1175 (in Chinese).
Minseok H, Samuel G. Development of a thermal resistance model for chip-on-board packaging of high power LED arrays [J]. Microelectron. Reliab., 2012, 52:836-844.
Zhang J X, Niu P J, Li H Y, et al. Study on heat dissipation performance of LED array using thermal circuit method [J]. Chin. J. Lumin.(发光学报), 2013, 34(4):516-522 (in Chinese).
Li D C, Yang L, Wang P, et al. Research on the temperature stability of high-voltage power supply [J]. J. Lanzhou Univ.(兰州大学学报), 2006, 42(3):76-79 (in Chinese).
Gao Y B. Optimization of Plate Fin Natural Convective Heat Sink. Wuhan: Huazhong University of Science and Technology, 2008 (in Chinese).