C-mount封装不同激光器芯片尺寸的热阻分析

马祥柱; 霍晋; 曲轶; 杜石磊; 王宇

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C-mount封装不同激光器芯片尺寸的热阻分析

器件制备及器件物理 | 更新时间：2020-08-12

- C-mount封装不同激光器芯片尺寸的热阻分析
- Thermal-resistor Analysis of The Laser Chips with Different Size in C-mount Package
- 发光学报 2011年32卷第2期页码：184-187
- 作者机构：
  
  1. 长春理工大学高功率半导体激光国家重点实验室,吉林长春,130022
  2. 海特光电有限责任公司北京,100083
- 作者简介：
- 基金信息：
  
  国家自然科学基金(60976044)资助项目()
- DOI：
  中图分类号： TN248.4
- 收稿日期：2010-06-30，
  
  修回日期：2010-09-21，
  
  网络出版日期：2011-02-22，
  
  纸质出版日期：2011-02-22
- 稿件说明：
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马祥柱, 霍晋, 曲轶, 杜石磊, 王宇. C-mount封装不同激光器芯片尺寸的热阻分析[J]. 发光学报, 2011,32(2): 184-187

MA Xiang-zhu, HUO Jin, QU Yi, DU Shi-lei, WANG Yu. Thermal-resistor Analysis of The Laser Chips with Different Size in C-mount Package[J]. Chinese Journal of Luminescence, 2011,32(2): 184-187
马祥柱, 霍晋, 曲轶, 杜石磊, 王宇. C-mount封装不同激光器芯片尺寸的热阻分析[J]. 发光学报, 2011,32(2): 184-187 DOI：

MA Xiang-zhu, HUO Jin, QU Yi, DU Shi-lei, WANG Yu. Thermal-resistor Analysis of The Laser Chips with Different Size in C-mount Package[J]. Chinese Journal of Luminescence, 2011,32(2): 184-187 DOI：

摘要

采用波长漂移法对基于C-mount封装类型的不同尺寸芯片的热阻进行测量

得到了使热阻最小的最佳芯片尺寸和铟焊料厚度。测量结果表明

在铟焊料厚度为10 m、输出功率为2 W、条宽为200 m、腔长为2 000 m时

激光器芯片的热阻最小值为2.01 ℃/W。在铟焊料厚度为5 m和10 m两种条件下

对腔长为2 000 m的不同条宽的激光器芯片的热阻进行了测量

在铟焊料厚度为5 m时

激光器芯片的热阻由原来的2.01 ℃/W降到了1.85 ℃/W。

Abstract

Thermal-resistor of different chips based on C-mount package have been measured with the method of wavelength shift in this paper.Through the thermal-resistance measurement

we can get the best size of chip and the thickness of In solder to make the smallest thermal-resistance. The results show that when the thickness of In solder is 10 m

the output power is 2 W

the bar width is 200 m

the cavity length is 2 000 m and the minimum thermal-resistor of the chip is 2.01 ℃/W.The thermal-resistors with carvity length of 2 000 s have been measured when the In solder thickness is 5 m and 10 m. The results show that the thermal-resistor dropes from 2.01 ℃/W to 1.85 ℃/W for the 5 m In solider.

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references

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