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电子科技大学, 光电信息学院, 四川, 成都, 610054
收稿日期:2007-08-25,
修回日期:2007-11-24,
纸质出版日期:2008-05-20
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朱炳金, 陈泽祥, 张强, 王小菊, 于涛. 六硼化镧薄膜场致发射的特性[J]. 发光学报, 2008,29(3): 561-566
ZHU Bing-jin, CHEN Ze-xiang, ZHANG Qiang, WANG Xiao-ju, YU Tao. Field Emission Characteristics of LaB<sub>6</sub> Film[J]. Chinese Journal of Luminescence, 2008,29(3): 561-566
阵列薄膜是在制备好的尖锥阵列上沉积其他材料的薄膜
以提高场发射阴极性能
它是一种有效的提高场发射阴极性能的方法。在n型硅片上先后采用氧化、光刻、干法刻蚀、氧化削尖等工艺
制备出曲率半径很小的硅尖锥场发射阵列
硅阵列中每个硅尖锥的底半径约2μm
锥高约1.04μm
每个硅尖之间间隔6μm
尖端的曲率半径约50nm
锥角约56°
尖锥阵列的密度约10
6
/cm
2
。为了降低硅尖锥的功函数及提高抗离子轰击能力
通过电子束蒸发在硅尖阵列上沉积六硼化镧(LaB
6
)薄膜
薄膜的厚度大约50nm
锥尖曲率半径变为约111nm。X射线衍射(XRD)分析结果表明
电子束沉积在硅尖端的LaB
6
具有良好的结晶特性。硅尖锥及不同的真空度下阵列薄膜的场致发射
I-V
特性及电流发射稳定性的测试结果表明:沉积LaB
6
的薄膜阴极阵列的总发射电流达到125μA
是纯硅尖锥阵列125倍。并且硅阵列六硼化镧薄膜具有良好的场发射稳定性
是一种理想的薄膜场发射阵列。
Vacuum micro-electronics devices based on field emission cathode have become the focus of people around the world because it has lots of advantages such as high-speed electron transmission
low power consumption
high current density
operating without heating and so on. Field emission array (FEA) is the most important part of the vacuum micro-electronics device. In order to improve the performance of the FEA devices
many new structures have been designed and the fabrication of FEA has been optimized constantly. Filmed-array is a novel approach that includes not only the advantages of the array but also the characters of the film materials. It is considered to be an effective method to improve the performance of the devices. Filmed-array is fabricated by coating additional thin films on the tip of prepared spindt arrays. If the film material chosen has low work function
high conductance and reliability
good emission can be gained. The choosing principle of the film materials includes work function
conductance
density and reliability. Being a good thermal emission material
lanthanum hexaboride(LaB
6
) has excellent characteristics and is propitious to the film. The fabrication of LaB
6
-coated silicon spindt field emission arrays is reported in this paper
in which standard semiconductor techniques including oxidation
photolithogragh
dry etching
oxidation sharpening on the n-type silicon were used. In our fabricated silicon spindt arrays
the height is about 1μm. Interval between each silicon spindt is 6 μm
and cutting-edge radius of curvature is about 50 nm
tip-angle is about 56 degrees
the density of arrays is about 10
6
/cm
2
. Then
the LaB
6
film is deposited on the silicon spindt by electron beam evaporation to reduce the work function and enhance the capability of resisting ion bombardment. Film thickness is about 50 nm
the radius of curvature is about 111 nm.The X-ray Diffraction (XRD) analysis results indicates LaB
6
with well crystallization was gained by electron beam evaporation
In interplanar 〈100〉
films make preferred growth.
I-V
characteristics and stability of field emission of silicon array and LaB
6
filmed-arrays have been studied. The results show that silicon array coated by LaB
6
film has good and stable emission characteristics. The total field emission current from the LaB
6
filmed-arrays reached to 125 μA
which is 125 times than pure silicon spindt arrays. The results indicated LaB
6
filmed-arrays is the kind of ideal field emission arrays.
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