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北京大学, 物理学院, 人工微结构和介观物理国家重点实验室 北京,100871
收稿日期:2004-08-09,
修回日期:2004-11-20,
纸质出版日期:2006-01-20
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康香宁, 章蓓, 胡成余, 王琦, 陈志忠, 张国义. 高反射率p-GaN欧姆接触电极[J]. 发光学报, 2006,27(1): 75-79
KANG Xiang-ning, ZHANG Bei, HU Cheng-yu, WANG Qi, CHEN Zhi-zhong, ZHANG Guo-yi. Ohmic Contact of High Reflectivity on p-Type GaN[J]. Chinese Journal of Luminescence, 2006,27(1): 75-79
根据光学薄膜原理计算了GaN/Ti/Ag、GaN/Al和GaN/Ni/Au/Ti/Ag、GaN/Ni/Au/Al多层电极结构的反射率
得出Ag基和Al基反射电极均能在全角范围内提供较高的反射率。实验测量结果表明
反射率能高于80%的Ag基反射电极
具有低欧姆接触的电学特性。并将GaN/Ni/Au/Ti/Ag多层反射电极应用在上下电极结构的GaN基LED中。实验上采用两步合金法获得了低接触电阻、高反射率的电极结构
并引入Ni/Au覆盖层克服了Ag高温时的团聚和氧化现象。解决了Ag电极的稳定性问题
显著地提高了LED的出光效率
成功制备了具有上下电极结构的GaN基LED管芯。
GaN-based light-emitting diodes provide higher performance in the short-wavelength part of the visible and ultraviolet spectrum than any other material system. However
there is still a great need for improvement of the extraction efficiency. Because many parts of emitting light of LED suffer absorption of the metal contacts and bond pads
also by active layer. So the employment of highly reflective metal ohmic contacts with a low contact resistance could substantially improve the GaN extraction efficiency of GaN-based LED
especially for vertical structure LED fabricated by laser lift-off process
which have more light output surface and high thermal conductivity than normal structure LED. The high reflectivity of omni-direction reflector is reported
that is
incorporation of Ag and Al onto the contact layers acting as a reflecting layer. Firstly
the reflectivity of the layers Ti/Ag
Al
Ni/Au/Ti/Ag and Ni/Au/Al were calculated through the theory of optical films. Then the reflectivity and contact characteristic of the GaN-based LED samples with these multi-layers on p-type GaN were measured. The result showed high omni-directional reflectors can be achieved over Ag-based films structure
and Al-based also
but the Ag-based films can provide higher reflectivity of 80%
which is better than that of Al-based film. The current-voltage curves showed low resistance on these contact layers except the Al direct on p-GaN. And the resistance of Ni/Au/Ti/Ag and Ni/Au/Al just depends on the annealed Ni/Au layers. Here the Ni/Au layers not only supply the ohmic contact but also the spreading the current. The conglomerate and oxidation of Ag film under high temperature are eliminated by introducing other Ni/Au cladding layers. Because the thickness of Ag is enough for high reflectivity so the additional layers after Ag also have no effect on the reflectivity. The good stability
low resistance and high reflectivity were obtained by two-step annealing methods. Then we applied the multi-layer Ni/Au/Ti/Ag/NiAu to vertical structure light emitting diodes (LED) by laser lift-off technology. The light output efficiency was improved significantly. The vertical structure LED with high reflective contact layer was fabricated successfully.
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Gessmann T,Schubert E F,Graff J W,et al.Omnidirectional reflective contacts for light-emitting diodes[J].IEEE Electron.Dev.Lett.,2003,24(10):683-685.
Song June-O,Leem Dong-Seok.Low-resistance and highly-reflective Zn-Ni solid solution/Ag ohmic contacts for flip-chip light-emitting diodes[J].Appl.Phys.Lett.,2003,83(24):4990-4992.
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