Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED

QIN Dian-cheng; CHEN Ai-bing; XIAO Yong-long

doi:10.3788/fgxb20194001.0097

您当前的位置：

首页 >

文章列表页 >

Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED

Device Fabrication and Physics | 更新时间：2020-08-12

- Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED
- Chinese Journal of Luminescence Vol. 40, Issue 1, Pages: 97-105(2019)
- 作者机构：
  
  1. 广东省LED封装散热基板工程技术研究中心,广东珠海,519180
  2. 乐健科技(珠海)有限公司,广东珠海,519180
- 作者简介：
- 基金信息：
- DOI：10.3788/fgxb20194001.0097
  CLC： TB3.33
- Received：15 March 2018，
  
  Revised：22 May 2018，
  
  Published Online：13 June 2018，
  
  Published：05 January 2019
- 稿件说明：
移动端阅览
秦典成, 陈爱兵, 肖永龙. 嵌埋陶瓷散热基板对白光LED性能的影响[J]. 发光学报, 2019,40(1): 97-105

QIN Dian-cheng, CHEN Ai-bing, XIAO Yong-long. Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED[J]. Chinese Journal of Luminescence, 2019,40(1): 97-105
秦典成, 陈爱兵, 肖永龙. 嵌埋陶瓷散热基板对白光LED性能的影响[J]. 发光学报, 2019,40(1): 97-105 DOI： 10.3788/fgxb20194001.0097.

QIN Dian-cheng, CHEN Ai-bing, XIAO Yong-long. Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED[J]. Chinese Journal of Luminescence, 2019,40(1): 97-105 DOI： 10.3788/fgxb20194001.0097.

摘要

将氮化铝陶瓷片局部嵌入FR4材料中获得嵌埋陶瓷散热基板，结合LED相关测试手段对比研究了其与普通MCPCB对白光LED光学特性的影响。将嵌埋陶瓷散热基板应用于功率为30 W的远近一体车灯光源，并对LED车灯光源进行了光衰测试以及可靠性验证。结果表明，嵌埋陶瓷散热基板较之普通MCPCB有着更好的散热性能，FR4/AlN界面呈现出良好的结合强度，可以大幅减小LED的结温，有效改善LED的光学性能，极大地提升LED汽车灯光源的性能稳定性。

Abstract

Ceramic-embedded heat dissipation substrate was prepared employing AlN block embedded selectively into FR4 material. A comparison study on LED's optical characteristic was carried out between aforementioned substrate and regular MCPCB using LED-related test method. Ceramic-embedded heat dissipation substrate was used on a 30 W far and near integrated functional LED automobile lamp

with its light failure and reliability were investigated. It was found that the ceramic-embedded heat dissipation substrate was endowed with unparalleled heat dissipation performance in comparison with regular MCPCB and the FR4/AlN interface presented an excellent bonding strength

which could dramatically decrease the junction temperature of LED and improve LED's optical performance

thus enhancing the performance stability of LED automobile lamp.

关键词

Keywords

references

HASHIM N H,ANITHAMBIGAI P,MUTHARASU D. Thermal characterization of high power LED with ceramic particles filled thermal paste for effective heat dissipation[J]. Microelectron. Reliabil., 2015,55(2):383-388.

TANG Y,DING X R,YU B H,et al.. A high power LED device with chips directly mounted on heat pipes[J]. Appl. Therm. Eng., 2014,66(1-2):632-639.

CHENG H H,HUANG D S,LIN M T. Heat dissipation design and analysis of high power LED array using the finite element method[J]. Microelectron. Reliabil., 2012,52(5):905-911.

KIM D,LEE J,KIM J,et al.. Enhancement of heat dissipation of LED module with cupric-oxide composite coating on aluminum-alloy heat sink[J]. Energy Convers. Manage., 2015,106:958-963.

LI Q M,GUI Y G,MU Q W,et al.. Effect of composite surface treatment on heat dissipation of LEDs[J]. Mater. Des., 2016,89:597-603.

WU H H,LIN K H,LIN S T. A study on the heat dissipation of high power multi-chip COB LEDs[J]. Microelectron. J., 2012,43(4):280-287.

XU Y S,CHUNG D D L,MROZ C. Thermally conducting aluminum nitride polymer-matrix composites[J]. Compos. Part A, 2001,32(12):1749-1757.

PENG W Y,HUANG X Y,YU J H,et al.. Electrical and thermophysical properties of epoxy/aluminum nitride nanocomposites:effects of nanoparticle surface modification[J]. Compos. Part A, 2010,41(9):1201-1209.

马振辉,黄金亮,殷镖,等. LED散热铝基板用导热介质材料的制备与性能研究[J]. 工程塑料应用, 2011,39(12):50-53. MA Z H,HUANG J L,YIN B,et al.. Study on preparation and performance of heat conduction medium material used on aluminum substrate for heat dissipation of LED[J]. Eng. Plast. Appl., 2011,39(12):50-53. (in Chinese)

OHKI Y. Development of epoxy resin composites with high thermal conductivity[J].IEEE Electr. Insulat. Mag., 2010,26(1):48-49.

吴朝晖,程浩,章军,等. 大功率LED封装基板技术与发展现状[J]. 半导体光电, 2016,37(1):1-6. WU Z H,CHENG H,ZHANG J,et al.. Technologies and development status of heat spreader for high-power LED packaging[J]. Semicond. Optoelectron., 2016,37(1):1-6. (in Chinese)

秦典成,李保忠,肖永龙. 陶瓷金属化研究现状及发展趋势[J]. 中国陶瓷工业, 2017,24(5):30-36. QIN D C,LI B Z,XIAO Y L. Current status and development of ceramic metallization[J]. China Ceram. Ind., 2017,24(5):30-36. (in Chinese)

CHMIELEWSKI T,GOLANSKI D,WLOSINSKI W. Metallization of ceramic materials based on the kinetic energy of detonation waves[J]. Bull. Pol. Acad. Sci., 2015,63(2):449-456.

张珊珊,杨会生,颜鲁春,等. 直接覆铜陶瓷板界面及其高温行为研究[J]. 真空电子技术, 2016(5):1-6. ZHANG S S,YANG H S,YAN L C,et al.. Research on metallization and interface behavior of direct plated copper ceramic substrates[J]. Vac. Electron., 2016(5):1-6. (in Chinese)

华炎生,谢强伟,徐明,等. 局部混压PCB制作工艺研究[J]. 印制电路信息, 2011(4):37-43. HUA Y S,XIE Q W,XU M,et al.. Technology research on partial hybrid PCB[J]. Print. Circuit Inf., 2011(4):37-43. (in Chinese)

YANG K S,CHUNG C H,TU C W,et al.. Thermal spreading resistance characteristics of a high power light emitting diode module[J]. Appl. Therm. Eng., 2014,70(1):361-368.

HSIEH J C,LIN D T W,CHENG C H,et al.. The optimal design of the thermal spreading on high power LEDs[J]. Microelectron. J., 2014,45(7):904-909.

RAHMANI Y,GANJI D D,BANDPY M G. Analytical study of thermal spreading resistance in curved-edge heat spreader[J]. Appl. Therm. Eng., 2016,104:527-533.

DANG T M L,KIM C Y,ZHANG Y M,et al.. Enhanced thermal conductivity of polymer composites via hybrid fillers of anisotropic aluminum nitride whiskers and isotropic spheres[J]. Compos. Part B, 2017,114:237-246.

张春伟,毕可东,王建立,等. 金属/非金属间界面热导的飞秒激光瞬态热反射法测量[J]. 中国科学:技术科学, 2012,42(5):597-602. ZHANG C W,BI K D,WANG J L,et al.. Measurement of thermal boundary conductance between metal and dielectric materials using femtosecond laser transient thermoreflectance technique[J]. Sci. China Technol. Sci., 2012,55(4):1044-1049.

AGRAWAL A,SATAPATHY A. Effects of aluminium nitride inclusions on thermal and electrical properties of epoxy and polypropylene:an experimental investigation[J]. Compos. Part A, 2014,63:51-58.

崔泽英,谷青博. LED光源光衰规律研究[J]. 半导体技术, 2012,37(4):312-315. CUI Z Y,GU Q B. Research on LED light source lumens depreciation rule[J]. Semicond. Technol., 2012,37(4):312-315. (in Chinese)

刘立明,郑晓东. LED结温与光谱特性关系的测量[J]. 光子学报, 2009,38(5):1069-1073. LIU L M,ZHENG X D. Measurements of LEDs spectral characteristics and junction temperature[J]. Acta Photon. Sinica, 2009,38(5):1069-1073. (in Chinese)

吴海彬,王昌铃. 白光LED封装材料对其光衰影响的实验研究[J]. 光学学报, 2005, 25(8):1091-1094. WU H B,WANG C L. Experimental research on influence of packing materials of white led on its luminous decay[J]. Acta Opt. Sinica, 2005,25(8):1091-1094. (in Chinese)

张楼英,周丽,张家雨,等. 大功率LED的光衰机制研究[J]. 半导体技术, 2009,34(5):474-477. ZHANG L Y,ZHOU L,ZHANG J Y,et al.. Research on mechanism of high-power LED luminous attenuation[J]. Semicond. Technol., 2009,34(5):474-477. (in Chinese)

费翔,钱可元,罗毅. 大功率LED结温测量及发光特性研究[J]. 光电子激光, 2008,19(3):289-292. FEI X,QIAN K Y,LUO Y. Junction temperature measurement and luminous properties research of high-power LED[J]. J. Optoelectron.Laser, 2008,19(3):289-292. (in Chinese)

梁田静,张方辉,邱西振,等. 结温对高显指低色温白光LED光谱特性的影响[J]. 功能材料, 2012, 43(24):3389-3392. LIANG T J,ZHANG F H,QIU X Z,et al.. The Influence of junction temperature on the spectral characteristics of white LED with low color temperature and high color rendering index[J]. J. Funct. Mater., 2012,43(24):3389-3392. (in Chinese)

胡长奇,张方辉,张静. 新型白光LED的光谱特性和相关结温特性[J]. 发光学报, 2012,33(9):939-943. HU C Q,ZHANG F H,ZHANG J. The spectral and junction temperature properties of new white light LED[J]. Chin. J. Lumin., 2012,33(9):939-943. (in Chinese)

丁天平,郭伟玲,崔碧峰,等. 温度对功率LED光谱特性的影响[J]. 光谱学与光谱分析, 2011,31(6):1450-1453. DING T P,GUO W L,CUI B F,et al.. The effect of temperature on the PL spectra of high power LED[J]. Spectrosc. Spectr. Anal., 2011,31(6):1450-1453. (in Chinese)

陈依新,沈光地,高志远,等. AlGaInP大功率发光二极管发光效率与结温的关系[J]. 物理学报, 2011,60(8):625-630. CHEN Y X,SHEN G D,GAO Z Y,et al.. Relationship between light efficiency and juction temperature of high power AlGaInP light-emitting diode[J]. Acta Phys. Sinica, 2011,60(8):625-630. (in Chinese)

钟文姣,魏爱香,招瑜. 结温对GaN基白光LED光学特性的影响[J]. 发光学报, 2013,34(9):1203-1207. ZHONG W J,WEI A X,ZHAO Y. Dependence of GaN-based white LED colorimetric parameters on junction temperature[J]. Chin. J. Lumin., 2013,34(9):1203-1207. (in Chinese)

张楼英,崔一平,罗宗南,等. 大功率LED整个寿命中的颜色漂移[J]. 液晶与显示, 2010,25(2):210-214. ZHANG L Y,CUI Y P,LUO Z N,et al.. Color offset in process of high-power LED life aging[J]. Chin. J. Liq. Cryst. Disp., 2010,25(2):210-214. (in Chinese)

方福波,王垚浩,宋代辉,等. 白光LED衰减的光谱分析[J]. 发光学报, 2008,29(2):353-357. FANG F B,WANG Y H,SONG D H,et al.. Spectroscopic analysis of white LED attenuation[J]. Chin. J. Lumin., 2008,29(2):353-357. (in Chinese)

温磊. 复合材料层压板残余应力的研究[D]. 北京:北京航空材料研究院, 2000. WEN L. Study on Residual Stress of Composite Laminates[D]. Beijing:Beijing Institute of Aerial Materials, 2000. (in Chinese)

白智辉,郭宏,张习敏,等. 热冲击对金刚石/铜复合材料的热学性能影响[J]. 稀有金属, 2013,37(5):840-844. BAI Z H,GUO H,ZHANG X M,et al.. Influences of thermal shock on thermal properties of diamond/copper composite[J]. Chin. J. Rare Met., 2013,37(5):840-844. (in Chinese)

Views

170

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Experimental Investigation of Integrated Heat Pipe Heat Sink for Multi-chip LED Module in Natural Convection

Photoluminescence and Multifunctional Applications of NaGdMgTeO₆∶Eu³⁺ Phosphors

Improvement of Heat Dissipation Performance of Deep Ultraviolet LED

Preparation of New Single Component Solid Carbon Dots for White LED with High Color Rendering Index

Related Author

ZHOU Chi

ZUO Dun-wen

SUN Yu-li

Zhe WANG

Yongtong WANG

Jiaxin LIU

Yun MOU

Yang PENG

Related Institution

College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics

School of Mechanical Science and Engineering， Huazhong University of Science and Technology

School of Aerospace Engineering， Huazhong University of Science and Technology

Anhui Engineering Research Center for Photoelectrocatalytic Electrode Materials， School of Electrical Engineering， Huainan Normal University

Huainan No.6 High School

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176862 Email：fgxbt@126.com
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰