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Thermal Impact of High Power Semiconductor Laser with Voids in Solder Layer
更新时间:2020-08-12
    • Thermal Impact of High Power Semiconductor Laser with Voids in Solder Layer

    • Chinese Journal of Luminescence   Vol. 39, Issue 7, Pages: 983-990(2018)
    • DOI:10.3788/fgxb20183907.0983    

      CLC: TN248.4
    • Received:01 November 2017

      Revised:02 March 2018

      Published Online:23 March 2018

      Published:05 July 2018

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  • ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming etc. Thermal Impact of High Power Semiconductor Laser with Voids in Solder Layer[J]. Chinese Journal of Luminescence, 2018,39(7): 983-990 DOI: 10.3788/fgxb20183907.0983.

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