您当前的位置:
首页 >
文章列表页 >
Analysis of Thermal Characteristics of A Multichip Light-emitting Diodes Device
更新时间:2020-08-12
    • Analysis of Thermal Characteristics of A Multichip Light-emitting Diodes Device

    • Chinese Journal of Luminescence   Vol. 39, Issue 5, Pages: 751-756(2018)
    • DOI:10.3788/fgxb20183905.0751    

      CLC: TN312+.8
    • Received:06 September 2017

      Revised:25 November 2017

      Published Online:23 November 2017

      Published:05 May 2018

    移动端阅览

  • CHEN Huan-ting, CHEN Fu-chang, HE Yang etc. Analysis of Thermal Characteristics of A Multichip Light-emitting Diodes Device[J]. Chinese Journal of Luminescence, 2018,39(5): 751-756 DOI: 10.3788/fgxb20183905.0751.

  •  
  •  

0

Views

214

下载量

2

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Improvement of Heat Dissipation Performance of Deep Ultraviolet LED
Determination and Experimental Study of OLED Junction Temperature Based on PtOEP Molecular Temperature Probe
Influence of Ceramic-embedded Heat Dissipation Substrate on Performances of White LED
Thermal Impact of High Power Semiconductor Laser with Voids in Solder Layer
Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure

Related Author

CHANG Jianhua
ZHANG Huiguo
WANG Shuchang
LI Jiarui
XU Ru
YANG Jianan
ZHAO Jianguo
XU Zhengyin

Related Institution

School of Electronic and Information Engineering, Changshu Institute of Technology
School of Electronic and Information Engineering, Nanjing University of Information Science and Technology
Jiangsu Sunera Technology Co., Ltd
Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology
Rayben Technologies(Zhuhai) Ltd..
0