ZHANG Jian-xin, HAN Bian-hua, YANG Qing-xin etc. Thermal Design and Optimization of LED Integrated with Thermoelectric Cooler in Natural Convection[J]. Chinese Journal of Luminescence, 2018,39(4): 523-533
ZHANG Jian-xin, HAN Bian-hua, YANG Qing-xin etc. Thermal Design and Optimization of LED Integrated with Thermoelectric Cooler in Natural Convection[J]. Chinese Journal of Luminescence, 2018,39(4): 523-533 DOI: 10.3788/fgxb20183904.0523.
Thermal Design and Optimization of LED Integrated with Thermoelectric Cooler in Natural Convection
In order to improve the thermal performance of LED lamp with high heat flux in natural convection
a thermoelectric cooler (TEC) was presented to meet the cooling requirement of a compact lamp with single high-power LED. The performance parameters of TEC were determined accurately by regression analysis for TEC experimental data at different work status. The equivalent thermal circuits of the compact LED modules with TEC and without TEC were established based on electrical-thermal analogy. Some mathematic models of equivalent thermal circuits were developed to quickly predict the accurate thermal performance of LED modules following the specified calculation procedure in this paper. The thermal performance analysis results show that the best cooling performance can be obtained at the optimum input TEC current for a specific LED power dissipation. The thermal performance of LED modules with TEC can be superior to that of modules without TEC and be better at low LED power dissipations than at high ones. Two-objective optimization was carried out using three design variables of fin to minimize the junction temperature and fin mass simultaneously. For the un-optimized and optimized modules
the comparison results of thermal performance demonstrate that the effective operating range of TEC in optimized module performs broader than that in un-optimized module. The LED power dissipation of optimized module can reach a higher performance than that of un-optimized one. At the LED power dissipation of 0.493 W
the minimum junction temperature is 15.66℃ and much lower than the ambient temperature of 30℃. For the LED modules with TEC
the equivalent thermal circuit models presented based on TEC experimental data can contribute to the thermal design
performance analysis and structural optimization.
关键词
Keywords
references
NARENDRAN N, GU Y, FREYSSINIER J P, et al.. Solid-state lighting:failure analysis of white LEDs[J]. J. Cryst. Growth, 2004, 268(3-4):449-456.
陈华, 周兴林, 汤文, 等. 大功率远程荧光粉型白光LED散热封装设计[J]. 发光学报, 2017, 38(1):97-102. CHEN H, ZHOU X L, TANG W, et al.. Thermal design of high power remote phosphor white LED package[J]. Chin. J. Lumin., 2017, 38(1):97-102. (in Chinese)
SUN B, FAN X, YE H, et al.. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation[J]. Reliab. Eng. Syst. Saf., 2017, 163:14-21.
JEON D, BYON C. Thermal performance of plate fin heat sinks with dual-height fins subject to natural convection[J]. Int. J. Heat Mass Transf., 2017, 113:1086-1092.
SKMEN K F. YVRVKLV E, YAMANKARADENIZ N. Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications[J]. Appl. Therm. Eng., 2016, 94:534-542.
SUFIAN S F, FAIRUZ Z M, ZUBAIR M, et al.. Thermal analysis of dual piezoelectric fans for cooling multi-LED packages[J]. Microelectron. Reliab., 2014, 54(8):1534-1543.
DENG Y G, LIU J. A liquid metal cooling system for the thermal management of high power LEDs[J]. Int. Commun. Heat Mass Transf., 2010, 37(7):788-791.
王志斌, 张健, 刘丽君, 等. 大功率LED螺旋扁管水冷散热技术研究[J]. 光子学报, 2013, 42(11):1350-1354. WANG Z B, ZHANG J, LIU L J, et al.. Study of water cooling technology on high power LED with the twisted tube[J]. Acta Photon. Sinica, 2013, 42(11):1350-1354. (in Chinese)
LUO X B, CHEN W, SUN R X, et al.. Experimental and numerical investigation of a microjet based cooling system for high power LEDs[J]. Heat Transfer Eng., 2008, 29(9):774-781.
CHANG Y W, CHANG C C, KE M T, et al.. Thermoelectric air-cooling module for electronic devices[J]. Appl. Therm. Eng., 2009, 29(13):2731-2737.
HU H M, GE T S, DAI Y J, et al.. Experimental study on water-cooled thermoelectric cooler for CPU under severe environment[J]. Int. J. Refrig., 2016, 62:30-38.
CHUN K L, DAI M J, YU C K, et al.. High efficiency silicon-based high power LED package integrated with micro-thermoelectric device[C]. International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, Taipei, China, 2007:29-33.
LI J H, MA B K, WANG R S, et al.. Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs[J]. Microelectron. Reliab., 2011, 51(12):2210-2215.
WANG J, ZHAO X J, CAI Y X, et al.. Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package[J]. Energy Convers. Manag., 2015, 101:532-540.
WANG N, WANG C H, LEI J X, et al. Numerical study on thermal management of LED packaging by using thermoelectric cooling[C]. International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP, Beijing, 2009:433-437.
CHEN M, SNYDER G J. Analytical and numerical parameter extraction for compact modeling of thermoelectric coolers[J]. Int. J. Heat Mass Transf., 2013, 60(1):689-699.
GAO X, CHEN M, SNYDER G J, et al.. Thermal management optimization of a thermoelectric integrated methanol evaporator using a compact CFD modeling approach[J]. J. Electron. Mater., 2013, 42(7):2035-2042.
SHYU J C, HSU K W, YANG K S, et al.. Thermal characterization of shrouded plate fin array on an LED backlight panel[J]. Appl. Therm. Eng., 2011, 31(14-15):2909-2915.
张建新, 牛萍娟, 李红月, 等. 基于等效热路法的LED阵列散热性能研究[J]. 发光学报, 2013, 34(4):516-522. ZHANG J X, NIU P J, LI H Y, et al.. Study on the heat dissipation performance of LED array using thermal circuit method[J]. Chin. J. Lumin., 2013, 34(4):516-522. (in Chinese)
ABDELMLEK K B, ARAOUD Z, CHARRADA K, et al.. Optimization of the thermal distribution of multi-chip LED package[J]. Appl. Therm. Eng., 2017, 126:653-660.
张建新, 武志刚, 李松宇, 等. LED散热模块总热阻测量实验系统开发[J]. 实验技术与管理, 2013, 30(12):77-81. ZHANG J X, WU Z G, LI S Y, et al.. Development of experimental system for measuring total thermal resistance of LED module[J]. Experiment. Technol. Manag., 2013, 30(12):77-81. (in Chinese)
LEUNG C W, PROBERT S D. Heat exchanger performance:effect of orientation[J]. Appl. Energy, 1989, 33(4):235-252.
DIALAMEH L, YAGHOUBI M, ABOUALI O. Natural convection from an array of horizontal rectangular thick fins with short length[J]. Appl. Therm. Eng., 2008, 28(17-18):2371-2379.
WONG S C, HUANG G J. Parametric study on the dynamic behavior of natural convection from horizontal rectangular fin arrays[J]. Int. J. Heat Mass Transf., 2013, 60(1):334-342.
SCHMID G, YANG L H, YANG T H, et al.. Influence of inter-fin base length on thermal performance of free hanging horizontal base heat sinks[J]. Appl. Therm. Eng., 2016, 108:1226-1236.
MICHELI L, REDDY K S, MALLICK T K. Experimental comparison of micro-scaled plate-fins and pin-fins under natural convection[J]. Int. Commun. Heat Mass Transf., 2016, 75:59-66.
张建新, 牛萍娟, 武志刚, 等. 大功率LED散热器性能的双目标优化[J]. 电工技术学报, 2014, 29(4):136-141. ZHANG J X, NIU P J, WU Z G, et al.. Two-objective optimization of heat sink cooling performance for high-power LED application[J]. Trans. China Electrotech. Soc., 2014, 29(4):136-141. (in Chinese)
Orientation Effects on Heat Dissipation Performance of Plate-fin Heat Sink for LED Application
Study on The Heat Dissipation Performance of LED Array Using Thermal Circuit Method
Orientation Effects Experiment on Natural Convection of High Power LED Heat Sink
Optimum Design of LED Array Light Source Based on Fruit Fly Optimization Algorithm
LED Color Mixing Design Based on Improved Artificial Fish Swarm Algorithm
Related Author
JIANG Yi-na
WANG Ning
NIU Ping-juan
YANG Qing-xin
ZHANG Jian-xin
NIU Ping-juan
SUN Lian-gen
LI Hong-yue
Related Institution
Tianjin Key Laboratory of Advanced Electrical Engineering and Energy Technology, Tianjin Polytechnic University
Engineering Research Center of High Power Solid State Lighting Application System, Ministry of Education, Tianjin Polytechnic University
State Key Laboratory of Hollow Fiber Membrane Materials and Processes, Tianjin Polytechnic University
Tianjin Key Laboratory of Advanced Electrical Engineering and Energy Technology, School of Electrical Engineering and Automation, Tianjin Polytechnic University
Institute of Engineering Thermophysics, Chinese Academy of Sciences