LI Jing, CAO Yin-hua, LIU You-qiang etc. Smile Effect Measurement of Laser Diode Line Arrays Based on External Cavity[J]. Chinese Journal of Luminescence, 2017,38(10): 1302-1306
LI Jing, CAO Yin-hua, LIU You-qiang etc. Smile Effect Measurement of Laser Diode Line Arrays Based on External Cavity[J]. Chinese Journal of Luminescence, 2017,38(10): 1302-1306 DOI: 10.3788/fgxb20173810.1302.
Smile Effect Measurement of Laser Diode Line Arrays Based on External Cavity
The smile effect was measured in the process of semiconductor laser packaging using the external cavity mirror of which the reflectance was greater than the front cavity surface of the semiconductor to form external cavity semiconductor laser. In measurement
the cylindrical lens was inserted in the external cavity. The external laser cavity was only formed between the outer mirror and the single light emitting point in the cylindrical lens light axis. The laser threshold of the light emitting point was reduced to output laser under the excitation current less than the normal threshold value. The light emitting point of the diode laser was selected one by one by moving the cylinder lens
so the smile effect was measured by summarizing all beam position. The low current is no harmful effects on the diode laser bar
and the influence of the other emitters on CCD is avoided by measuring single emitter.
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references
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