Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure

ZHANG Xiao-lei; BO Bao-xue; ZHANG Zhe-ming; GU Hua-xin; LIU Li-ning; XU Yu-meng; QIAO Zhon

doi:10.3788/fgxb20173807.0891

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Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure

更新时间：2020-08-12

- Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure
- Chinese Journal of Luminescence Vol. 38, Issue 7, Pages: 891-896(2017)
- 作者机构：
  
  长春理工大学高功率半导体激光国家重点实验室,吉林长春,130022
- 作者简介：
- 基金信息：
  
  National Natural Science Fundation of China(61176048,61177019,61308051);Science an
- DOI：10.3788/fgxb20173807.0891
  CLC： TN248.4
- Received：15 December 2016，
  
  Revised：04 February 2017，
  
  Published：05 July 2017
- 稿件说明：
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张晓磊, 薄报学, 张哲铭等. C-mount封装激光器热特性分析与热沉结构优化研究[J]. 发光学报, 2017,38(7): 891-896

ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming etc. Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure[J]. Chinese Journal of Luminescence, 2017,38(7): 891-896
张晓磊, 薄报学, 张哲铭等. C-mount封装激光器热特性分析与热沉结构优化研究[J]. 发光学报, 2017,38(7): 891-896 DOI： 10.3788/fgxb20173807.0891.

ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming etc. Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure[J]. Chinese Journal of Luminescence, 2017,38(7): 891-896 DOI： 10.3788/fgxb20173807.0891.

摘要

为了降低单管半导体激光器的结温、提高器件的散热效果，基于C-mount热沉的热特性分析提出了一种优化的台阶热沉结构，研究了单管激光器结温和腔面侧向温度分布曲线的影响。在热沉温度298 K和连续输出功率10 W的条件下，腔长为1.5 mm的典型C-mount封装结构激光器的结温为343.6 K，热阻为4.6 K/W。通过在典型C-mount热沉中引入台阶结构，使封装激光器的结温降低为333.8 K，热阻减小到3.5 K/W。计算表明，其输出功率可提高近20%。

Abstract

In order to reduce single-tube laser diode junction temperature and improve heat dissipation effects of the device

an optimized step sink structure was come up based on the thermal characteristic analysis of C-mount heat sink. The distribution of junction temperature and the lateral temperature of single-tube lasers were investigated. Under the conditions of the heat sink temperature of 298 K and continuous output power of 10 W

the junction temperature of typical C-mount heat sink package structure with 1.5 mm cavity length and 3 m solder thickness is 343.6 K

and the thermal resistance is 4.6 K/W. By introducing level heat sink structure

the junction temperature of single-tube laser diode is 333.8 K and thermal resistance is 3.5 K/W. Theoretical calculation shows that the output power can be improved nearly 20%.

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