XIA Yun-yun, WEN Shang-sheng, FANG Fang. Failure Mechanism Analysis of Negative Electrode in GaN-based White LED[J]. Chinese Journal of Luminescence, 2016,37(8): 1002-1007
XIA Yun-yun, WEN Shang-sheng, FANG Fang. Failure Mechanism Analysis of Negative Electrode in GaN-based White LED[J]. Chinese Journal of Luminescence, 2016,37(8): 1002-1007 DOI: 10.3788/fgxb20163708.1002.
Failure Mechanism Analysis of Negative Electrode in GaN-based White LED
The failure mechanism of white LED negative electrode shedding phenomenon was investigated. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) were used as two main techniques to characterize the surface morphology and composition of the chip. SEM shows that the surface of negative electrode dropped off is coarse
and granular crystals are formed in the transparent conductive film. Chlorine element has been detected in both corroded negative electrode part and the packaging glue by EDS testing. It is found that the electrochemical corrosion between chloridion and aluminum is the main reason to result in LED failure.
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