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1. 中国科学院半导体研究所 集成光电子学国家重点实验室 北京,100083
2. 河南仕佳光子科技有限公司,河南 鹤壁,458030
Received:19 February 2016,
Revised:29 March 2016,
Published:05 July 2016
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刘丽杰, 吴远大, 王玥等. 1310 nm垂直腔面发射激光器芯片制备技术的研究进展[J]. 发光学报, 2016,37(7): 809-815
LIU Li-jie, WU Yuan-da, WANG Yue etc. Research Progress of 1310 nm VCSELs Chip Technology[J]. Chinese Journal of Luminescence, 2016,37(7): 809-815
刘丽杰, 吴远大, 王玥等. 1310 nm垂直腔面发射激光器芯片制备技术的研究进展[J]. 发光学报, 2016,37(7): 809-815 DOI: 10.3788/fgxb20163707.0809.
LIU Li-jie, WU Yuan-da, WANG Yue etc. Research Progress of 1310 nm VCSELs Chip Technology[J]. Chinese Journal of Luminescence, 2016,37(7): 809-815 DOI: 10.3788/fgxb20163707.0809.
垂直腔面发射激光器(VCSELs)在光纤通讯领域有着广泛的应用前景
国际上对VCSELs需求逐年增加
而国内目前VCSELs的产业化尚属空白。本文从两方面着手综述1310 nm VCSELs制备方法。将可以制备出1310 nm VCSELs的4种材料
从理论、制备、量产时需要考虑的因素等方面进行较为全面的汇总分析;同时对两种主流的制备方法从工艺步骤分析其在产业化方面的优势与不足。
The vertical-cavity surface-emitting laser(VCSEL) is becoming a key device in the gigabit
local-area networks(LANs) and optical interconnets. Its volumn is increasing ever year in the world. However
there is no company to produce this promising device in China. In this paper
we review its material system properties and fabrication technology of 1310 nm long-wavelength band and analyse the advantage and disadvantage from production. Lastly
we give a conclusion which method is better choice in the industrlization.
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