High Power COB LED Modules Attached by Nanosilver Paste

YANG Cheng-xiang; LI Xin; KONG Ya-fei; MEI Yun-hui; LU Guo-quan

doi:10.3788/fgxb20163701.0094

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High Power COB LED Modules Attached by Nanosilver Paste

更新时间：2020-08-12

- High Power COB LED Modules Attached by Nanosilver Paste
- Chinese Journal of Luminescence Vol. 37, Issue 1, Pages: 94-99(2016)
- 作者机构：
  
  1. 天津大学材料科学与工程学院, 天津 300072
  2. 弗吉尼亚理工大学材料科学与工程学院, 弗吉尼亚蒙哥马利 24060
- 作者简介：
- 基金信息：
- DOI：10.3788/fgxb20163701.0094
  CLC： TN312.8
- Received：10 September 2015，
  
  Revised：12 November 2015，
  
  Published：10 January 2016
- 稿件说明：
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杨呈祥, 李欣, 孔亚飞等. 纳米银焊膏封装大功率COB LED模块的性能研究[J]. 发光学报, 2016,37(1): 94-99

YANG Cheng-xiang, LI Xin, KONG Ya-fei etc. High Power COB LED Modules Attached by Nanosilver Paste[J]. Chinese Journal of Luminescence, 2016,37(1): 94-99
杨呈祥, 李欣, 孔亚飞等. 纳米银焊膏封装大功率COB LED模块的性能研究[J]. 发光学报, 2016,37(1): 94-99 DOI： 10.3788/fgxb20163701.0094.

YANG Cheng-xiang, LI Xin, KONG Ya-fei etc. High Power COB LED Modules Attached by Nanosilver Paste[J]. Chinese Journal of Luminescence, 2016,37(1): 94-99 DOI： 10.3788/fgxb20163701.0094.

摘要

为提高大功率LED的散热能力

采用具有更高熔点和更优良的导电导热性能的纳米银焊膏作为芯片粘结材料

以Al

基陶瓷基板封装COB LED模块。同时以Sn/Ag3.0/Cu0.5和导电银胶两种粘结材料作为对比

分别在27

100

120 ℃等环境温度中测试3种模块的光电性能来评估模块的热管理水平;在100 ℃环境下进行加速老化实验

评估3种LED模块的可靠性。测试结果表明

纳米银焊膏封装的大功率LED模块光电性能优异

且具有较强的长期可靠性。

Abstract

In order to improve the thermal performance of the high-power LED

the novel nanosilver paste with higher melting temperature and thermal/electrical conductivity was used as die-attach material

and Al

-based ceramic substrates were used to form a high-power LED chip-on-board (COB) architecture. To compare the effect of die attach material

high power COB LED modules were packaged by nanosilver paste

traditional Sn/Ag3.0/Cu0.5 solder and silver epoxy

respectively. The photoelectricity properties of three kinds of LEDs under various ambient temperatures from 27 to 120 ℃ were measured to evaluate their thermal management. The accelerated degradation testing under 100 ℃ was measured to evaluate the reliability. The test results show that the nanosilver paste is a very promising die-attach material for high power multi-chip modules packaging.

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references

宁磊,史永盛,史耀华,等. LED封装结构对出光率的影响 [J]. 液晶与显示, 2010, 25(6):822-825. NING L, SHI Y S, SHI Y H, et al.. Influence of package structure on LED light extraction [J]. Chin. J. Liq. Cryst. Disp., 2010, 25(6):822-825. (in Chinese)

白一鸣,罗毅,韩彦军,等. 集成封装发光二极管光提取效率的计算及优化 [J]. 光学精密工程, 2014, 22(5):1129-1137. BAI Y M, LUO Y, HAN Y J, et al.. Calculation and optimization of light extraction efficiency for integrated LED [J]. Opt. Precision Eng., 2014, 22(5):1129-1137. (in Chinese)

NARENDRAN N, GU Y. Life of LED-based white light sources [J]. J. Disp. Technol., 2005, 1(1):167-171.

NARENDRAN N, GU Y, FREYSSINIERJ P, et al.. Solid-state lighting: failure analysis of white LEDs [J]. J. Cryst. Growth, 2004, 268(3):449-456.

ARIK M, BECKER C A, WEAVERS E, et al.. Evaluation of temperature distribution of LED module [J]. Microelectron. Reliab., 2013, 53(4):554-559.

NARENDRAN N, GU Y, HOSSEINZADEH R. The degradation of GaAlAs red light-emitting diodes under continuous and low-speed pulse operation [J]. Microelectron. Reliab., 1998, 38(10):1627-1630.

王志斌,刘永成,李志全. 双进双出射流水冷大功率LED散热系统研究 [J]. 光子学报, 2014, 43(7):0723003-1-6. WANG Z B, LIU Y C, LI Z Q. Analysis on high power LED cooling system based on double inlet and outlet water jet [J]. Acta Photon. Sinica, 2014, 43(7):0723003-1-6. (in Chinese)

LI X, CHEN X, LU G Q. Reliability of high-power light emitting diode attached with different thermal interface materials [J]. J. Electron. Pack., 2010, 132(3):031011-1-6.

MANIKAM V R, CHEONG K Y. Die attach materials for high temperature applications: a review [J]. IEEE Trans. Compon. Pack. Manufact. Technol., 2011, 1(4):457-478.

RIMDUSIT S, ISHIDA H. Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins [J]. Polymer, 2000, 41(22):7941-7949.

兰海,邓种华,刘著光,等. LED的COB封装热仿真设计 [J]. 发光学报, 2012, 33(5):535-539. LAN H, DENG Z H, LIU Z G, et al.. Thermal simulation for design of LED COB package [J]. Chin. J. Lumin., 2012, 33(5):535-539. (in Chinese)

马建设,贺丽云,刘彤,等. 板上芯片集成封装的发光二极管结构设计 [J]. 光学精密工程, 2013, 21(4):904-910. MA J S, HE L Y, LIU T, et al.. Design of optical structure for chip-on-board wafer level packaging LEDs [J]. Opt. Precision Eng., 2013, 21(4):904-910. (in Chinese)

王健,黄先,刘丽,等. 温度和电流对白光LED发光效率的影响 [J]. 发光学报, 2008, 29(2):358-362. WANG J, HUANG X, LIU L, et al.. Effect of temperature and current on LED luminous efficiency [J]. Chin. J. Lumin., 2008, 29(2):358-362. (in Chinese)

郑峰,刘丽莹,刘小溪,等. 多主色LED照明光源的相关色温调控 [J]. 光学精密工程, 2015, 23(4):927-933. ZHENG F, LIU L Y, LIU X X, et al.. Control of correlated color temperature for multi-primary color LED illumination [J]. Opt. Precision Eng., 2015, 23(4):927-933. (in Chinese)

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