Effects of BN &amp; Al2O3/Epoxy Composites Adhesive Layer on Junction Temperature of LED

LYU Ya-nan; LI Qiao-mei; MU Qi-wu; WEN Han-ying; ZHU Ling; SHOU Meng-jie

doi:10.3788/fgxb20153612.1469

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Effects of BN & Al₂O₃/Epoxy Composites Adhesive Layer on Junction Temperature of LED

更新时间：2020-08-12

- Effects of BN & Al₂O₃/Epoxy Composites Adhesive Layer on Junction Temperature of LED
- Chinese Journal of Luminescence Vol. 36, Issue 12, Pages: 1469-1476(2015)
- 作者机构：
  
  1. 重庆大学物理学院重庆,400044
  2. 重庆大学材料科学与工程学院重庆,400044
- 作者简介：
- 基金信息：
- DOI：10.3788/fgxb20153612.1469
  CLC： TN312.8
- Received：30 August 2015，
  
  Revised：23 September 2015，
  
  Published：10 December 2015
- 稿件说明：
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吕亚南, 李巧梅, 牟其伍等. BN&Al2O3/环氧树脂复合材料粘接层对LED灯结温的影响[J]. 发光学报, 2015,36(12): 1469-1476

LYU Ya-nan, LI Qiao-mei, MU Qi-wu etc. Effects of BN & Al2O3/Epoxy Composites Adhesive Layer on Junction Temperature of LED[J]. Chinese Journal of Luminescence, 2015,36(12): 1469-1476
吕亚南, 李巧梅, 牟其伍等. BN&Al2O3/环氧树脂复合材料粘接层对LED灯结温的影响[J]. 发光学报, 2015,36(12): 1469-1476 DOI： 10.3788/fgxb20153612.1469.

LYU Ya-nan, LI Qiao-mei, MU Qi-wu etc. Effects of BN & Al2O3/Epoxy Composites Adhesive Layer on Junction Temperature of LED[J]. Chinese Journal of Luminescence, 2015,36(12): 1469-1476 DOI： 10.3788/fgxb20153612.1469.

摘要

自制BN/EP(环氧树脂)复合材料和Al

/EP复合材料作为LED灯PCB板和散热铝块之间的粘接层材料

采用精密钻孔的方法用高精度测温仪测量LED灯正常工作时的温度分布

讨论粘接层对结温的影响

并与COMSOL Multiphysics软件模拟结果进行对比分析。实验测量LED结温与模拟结温变化趋势基本一致

结温会随着粘接层厚度的增加而上升、随着粘接层复合材料热导率的增加先快速降低而后趋于平缓。最终得到PCB板和散热铝块间最佳粘接层厚度和粘接层复合材料配比

当BN的质量分数为60%时

BN/EP复合材料粘接层的热导率最高

此时LED结温为75.2 ℃

比纯环氧树脂粘接层LED的结温降低了27.6 ℃。而Al

/EP复合材料粘接层LED的最低结温为78.2 ℃

此时Al

的质量分数为50%。

Abstract

Homemade BN/EP composites and Al

/EP composites were used as the adhesive layer between PCB and the heat sink of LED

respectively. The temperature distribution of LED working in the normal condition was measured by high-precision thermometers through a small hole. The effect of the adhesive layer composites on the junction temperature of LED was discussed

and was compared with the results from COMSOL simulations. A similar variation trend of junction temperature of LED was observed in both our experiment and COMSOL simulation. The junction temperature of LED raised with the increment of thickness of the adhesive layer. Besides

along with the increment of thermal conductivity of the adhesive layer composites

the junction temperature declined sharply at first

and then gradually decreased to a flat level. At last

we obtained two optimum values of the thickness and the ratio of adhesive layer composites with the best performance. When the mass fraction of BN is 60%

the thermal conductivity of BN/EP composites reaches at the highest level. In this condition

the junction temperature of LED is the lowest (75.2 ℃) and is 27.6 ℃ lower than that of using pure epoxy resin. In addition

the minimum junction temperature of the Al

/EP composites is 78.2 ℃ when the mass fraction of Al

is 50%.

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Keywords

references

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Effects of BN & Al2O3/Epoxy Composites Adhesive Layer on Junction Temperature of LED

DOI：10.3788/fgxb20153612.1469

摘要

Abstract

关键词

Keywords

references

Effects of BN & Al₂O₃/Epoxy Composites Adhesive Layer on Junction Temperature of LED