Thermal Field Analysis and Heat Dissipation Design of AlGaInP-based LED Light Emitting Array

Li He; LIANG Jing-qiu; LIANG Zhong-zhu; WANG Wei-biao; TIAN Chao; QIN Yu-xin; LYU Jin-guang

doi:10.3788/fgxb20153610.1212

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Thermal Field Analysis and Heat Dissipation Design of AlGaInP-based LED Light Emitting Array

更新时间：2020-08-12

- Thermal Field Analysis and Heat Dissipation Design of AlGaInP-based LED Light Emitting Array
- Chinese Journal of Luminescence Vol. 36, Issue 10, Pages: 1212-1219(2015)
- 作者机构：
  
  1. 中国科学院大学, 北京 100049
  2. 中国科学院长春光学精密机械与物理研究所应用光学国家重点实验室, 吉林长春 130033
- 作者简介：
- 基金信息：
- DOI：10.3788/fgxb20153610.1212
  CLC： TN383
- Received：04 July 2015，
  
  Revised：17 August 2015，
  
  Published：10 October 2015
- 稿件说明：
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李贺, 梁静秋, 梁中翥等. AlGaInP-LED发光阵列热场分析及散热设计[J]. 发光学报, 2015,36(10): 1212-1219

Li He, LIANG Jing-qiu, LIANG Zhong-zhu etc. Thermal Field Analysis and Heat Dissipation Design of AlGaInP-based LED Light Emitting Array[J]. Chinese Journal of Luminescence, 2015,36(10): 1212-1219
李贺, 梁静秋, 梁中翥等. AlGaInP-LED发光阵列热场分析及散热设计[J]. 发光学报, 2015,36(10): 1212-1219 DOI： 10.3788/fgxb20153610.1212.

Li He, LIANG Jing-qiu, LIANG Zhong-zhu etc. Thermal Field Analysis and Heat Dissipation Design of AlGaInP-based LED Light Emitting Array[J]. Chinese Journal of Luminescence, 2015,36(10): 1212-1219 DOI： 10.3788/fgxb20153610.1212.

摘要

建立了55 AlGaInP材料LED微阵列的有限元热分析模型

根据计算对模型进行了简化。结果表明

简化模型与原始模型的温度分布规律基本一致

计算得到的两种模型在工作1.5 s时的温度相对误差为0.8%。使用简化模型模拟了含10

个单元、尺寸为10 mm10 mm100 m的芯片的温度场分布

工作1.5 s时的芯片中心温度已达到360.6 ℃。为解决其散热问题

设计了两种散热器

并对其结构进行了优化

分析了翅片数量、翅片尺寸、粘结材料对芯片温度的影响。

Abstract

A finite element thermal analysis model of 55 AlGaInP-based LED microarray was established and simplified according to the calculation results. The results show that the simplified model and original model have the same temperature distribution

relative error of simplified model is 0.8% at 1.5 s. Using the simplified model

the temperature distribution of the chip with the size of 10 mm10 mm100 m and 10

units was calculated

and the center temperature of chip reached 360.6 ℃ at 1.5 s. In order to solve the problem of heat dissipation

two finned radiators were designed

and the impacts of radiator structure

adhesive material

and number of fins on the temperature of chip were simulated.

关键词

Keywords

references

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